EPM570GF256C3 vs EPM570F256C5 Comparison
Detailed side-by-side comparison of EPM570GF256C3 by Altera and EPM570F256C5 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM570GF256C3 | EPM570F256C5 |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | MAX II | — |
| Device Model | EPM570 | — |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User I/Os (max, FBGA-256) | 212 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) | — |
| Internal Performance fMAX | 300 MHz | — |
| Process Technology | 0.18 um 6-layer-metal flash | 0.18 µm |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) | — |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Package | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free | 256-ball FBGA |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| RoHS Status | Compliant (lead-free) | — |
| MSL Level | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 | — |
| Series | — | MAX II |
| Logic Elements | — | 570 |
| Macro Cells | — | 440 |
| User I/O | — | 160 |
| User Flash Memory | — | 8 Kbit |
| Supply Voltage - Internal | — | 2.5 V / 3.3 V |
| Maximum Operating Frequency | — | 201.1 MHz |
| Propagation Delay (tPD max) | — | 5.4 ns |
| Programmable Type | — | In System Programmable (Flash) |
| JTAG Support | — | IEEE 1149.1 |
| Mounting Type | — | Surface Mount |
| Operating Temperature | — | 0 °C to +85 °C (Commercial) |
| Speed Grade | — | C5 (5 ns) |