EPM570GF256C3 - 570 LEs MAX II CPLD, 256-ball FBGA | Intel
MPN: EPM570GF256C3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.85 | $1,385.00 |
| 500 | $11.95 | $5,975.00 |
| 1,000 | $10.4 | $10,400.00 |
Drop-in alternatives for EPM570GF256C3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EPM570GF256C3 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Model | EPM570 |
| Logic Elements (LE) | 570 |
| Equivalent Macrocells | 440 |
| User I/Os (max, FBGA-256) | 212 |
| User Flash Memory (UFM) | 8 Kbit |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) |
| Internal Performance fMAX | 300 MHz |
| Process Technology | 0.18 um 6-layer-metal flash |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Package | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| RoHS Status | Compliant (lead-free) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for FBGA) |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 |
EPM570GF256C3 fbga-256 (fineline bga), 17 x 17 mm, 1.0 mm pitch, lead-free Pin Configuration Guide
Complete pinout information for EPM570GF256C3 (fbga-256 (fineline bga), 17 x 17 mm, 1.0 mm pitch, lead-free package) with 256 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570GF256C3.
Refer to the datasheet for full pin configuration.
Estimated pin count: 256 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GF256C3 is suitable for 6 applications: I/O Expansion and Voltage-Level Translation, Power-Up and Power-Down Sequencing, Bus Bridging and Interface Glue Logic, LED and Display Control, Industrial Control and Factory Automation, Board Management Controller in Servers and Routers.
I/O Expansion and Voltage-Level Translation
The EPM570GF256C3's MultiVolt core and 8 independently powered VCCIO banks (1.5 V / 1.8 V / 2.5 V / 3.3 V) make it ideal for expanding I/O count and translating logic levels between a host processor and peripherals. With 212 user I/Os and 570 LEs available, the device can implement 8-bit or 16-bit parallel bus bridges (e.g., SPI-to-parallel, I2C-to-GPIO expansion) without external level shifters. Designers typically instantiate I/O registers and simple state machines, fitting dozens of glue-logic functions into a single non-volatile device. The 8.7 ns tPD1 on the -3 speed grade adds only modest latency to real-time control paths, while the instant-on flash configuration eliminates boot delay. This makes the part a workhorse for FPGA- and microprocessor-based systems that need additional low-speed peripherals without consuming FPGA general-purpose I/O (GPIO).
Recommended
Power-Up and Power-Down Sequencing
Deterministic, instant-on logic makes the EPM570GF256C3 a strong choice for multi-rail power-supply sequencing in servers, networking switches, and industrial controllers. Each MAX II I/O bank can hold a rail at its own voltage while monitoring feedback from upstream regulators via enable or power-good signals. The 8 Kbit UFM block stores non-volatile configuration such as sequencing order, fault thresholds, and retry counters that would otherwise need an external EEPROM. Typical designs sequence 3 V, 5 V, 12 V, and 0.9 V core rails with millisecond-level delays and add watchdog logic for fault recovery. Designers favor the CPLD over an MCU for sequencing because it boots in microseconds and has no firmware update risk, an important property for safety-critical boot paths.
Recommended
Bus Bridging and Interface Glue Logic
Glue-logic bridging between incompatible bus standards is a classic CPLD application that fits the EPM570GF256C3 well. The 570 LEs, 8.7 ns propagation delay, and 212 user I/Os comfortably implement bridges such as SPI-to-I2C, UART-to-parallel, PCI-to-local bus, or LVDS-to-LVCMOS fan-out, plus accompanying registers and FIFOs. The MultiVolt I/O banks let designers mix 1.8 V LVCMOS with 3.3 V LVTTL peripherals on the same die, reducing board area and BOM cost. Quartus II synthesis produces deterministic timing reports that simplify sign-off for industrial and medical designs where propagation delay must be characterized across voltage and temperature corners.
Recommended
LED and Display Control
The EPM570GF256C3's combination of high I/O count (212 pins), 8 Kbit UFM for storing LED patterns or gamma tables, and instant-on flash boot makes it well suited to driving LED matrices, seven-segment displays, character LCDs, and small TFT panels. Each output pin can source/sink 4-8 mA typical, sufficient for direct LED drive with small series resistors. The UFM stores lookup tables and animation frames that the CPLD reads and refreshes at 100-1000 Hz, offloading the host processor. Compared with a microcontroller, the CPLD provides fully deterministic refresh timing with no firmware jitter, which matters for high-PWM-resolution dimming and flicker-free video-rate refresh.
Recommended
Industrial Control and Factory Automation
Factory-floor equipment needs deterministic glue logic that survives wide temperature swings, electrical noise, and long product lifetimes - all properties the EPM570GF256C3 delivers. The device operates over the industrial -40 C to +100 C range (industrial grade) and supports MultiVolt I/O for interfacing 5 V sensors and 3.3 V controllers simultaneously. With 570 LEs and 212 I/Os, it can implement motor-control PWM generation, encoder decoding, safety interlocks, and Modbus/Profibus glue logic on a single non-volatile chip. The instant-on behavior means safety paths become active before any firmware boots, a critical property for machine-safety circuits governed by ISO 13849 and IEC 61508.
Recommended
Board Management Controller in Servers and Routers
In server and router chassis, a board-management controller (BMC) companion needs to monitor voltage rails, fan tachometers, and intrusion switches independently of the main CPU. The EPM570GF256C3 fits this role as a low-cost, always-on logic device that boots from internal flash in microseconds and exposes up to 212 I/Os for sensor aggregation. Its 8 Kbit UFM stores board-specific metadata (serial number, MAC, hardware revision) without an external EEPROM. Designers pair the CPLD with a downstream microcontroller for higher-level management, while the CPLD handles the deterministic boot path and primary fault logging that must operate even before the BMC firmware is ready.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GF256C3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F256C3 | EPM570F256C4 | EPM570F256C5 | EPM570F256C5N | EPM570F256C4N | EPM570GF256-5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FBGA-256 (17x17 mm, 1.0 mm pitch) | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same |
| Logic Elements (LE) | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Speed Grade | -3 (tPD1 = 8.7 ns) | -3 (8.7 ns) | -4 (~7.5 ns) | -5 (~6.0 ns) | -5 (~6.0 ns) | -4 (~7.5 ns) | -5 (~6.0 ns) |
| Lead-Free (RoHS) | Yes (GF suffix denotes lead-free) | Depends on marking - check datasheet | Depends on marking | Depends on marking | Yes | Yes | Yes |
| User Flash Memory (UFM) | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| Vertical Migration to EPM1270/EPM2210 | Supported (same FBGA-256) | Supported | Supported | Supported | Supported | Supported | Supported |
| Distributor Price (USD, qty 1, as of 2026-09-12) | 18.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Non-volatile instant-on flash configuration (vs SRAM-based low-end FPGAs (e.g., Cyclone IV))
- MultiVolt I/O supporting 1.5 V to 3.3 V on the same die (vs Fixed-voltage microcontrollers and most SRAM FPGAs)
- Vertical migration across EPM570/EPM1270/EPM2210 in same FBGA-256 (vs Discrete CPLD/FPGA portfolio from Lattice (MachXO2/3))
Design Notes
The FBGA-256 package uses a 1.0 mm ball pitch on a 17 x 17 mm substrate. Use a PCB with at least 4 routing layers and microvia stack-ups (laser-drilled 0.1-0.15 mm vias) to fan out the inner balls. Escape routing must follow the Altera MAX II device handbook pin-out and PCB layout guidelines. Place 0.1 uF decoupling capacitors within 100 mil of every VCCINT and VCCIO ball pair, plus bulk 10 uF capacitors adjacent to each power-supply island. Avoid routing high-speed signals (faster than 50 MHz) directly under the BGA; use inner layers instead. Ground and power planes should be solid beneath the device to provide low-impedance return paths and thermal spreading.
Power the MAX II VCCINT from a clean 1.8 V supply capable of delivering at least 200 mA peak during flash programming and configuration. VCCIO banks must be powered even if unused, or pulled to GND via 10 kohm resistors if left floating, to avoid I/O pin leakage. Sequence VCCINT before VCCIO at power-up; failing to do so can cause latch-up. During in-system programming, JTAG signals (TCK, TMS, TDI, TDO) must be held in a defined state - add 10 kohm pull-ups on TCK, TMS, TDI to prevent spurious configuration. Estimated: ICCINT typical ~50 mA and ICCIO bank typical ~10-30 mA per active bank, based on MAX II DC specifications.
When the EPM570GF256C3 drives signals across multiple VCCIO banks, treat each bank-to-bank transition as a level-shifting path with associated skew. Match trace lengths within each bus group to within 100 mil for signals above 50 MHz to control setup/hold margins. Use series termination (22-33 ohm) on outputs that drive long traces (>2 inches) or capacitive loads (>15 pF) to dampen ringing. For differential I/O standards such as LVDS, follow the MAX II device handbook impedance guidelines (100 ohm differential, 60 ohm single-ended) and keep trace pairs tightly coupled.
Common mistakes when designing with the EPM570GF256C3 include (1) leaving JTAG pins floating instead of pull-up or pull-down termination, which causes intermittent configuration failures; (2) using a non-USB-Blaster-compatible JTAG programmer that does not support the MAX II flash programming algorithm; (3) forgetting that the UFM block uses dedicated interface logic and cannot be accessed as user memory outside the altufm megafunction; (4) assuming pin-to-pin compatibility with the larger EPM1270 or EPM2210 without verifying unused-pin behavior - some I/O pins become no-connects on the smaller device and must not be driven externally. Always run the Quartus II fitter with all unused pins set to 'As input tri-stated with weak pull-up' unless the design explicitly requires As output driving ground.
Compliance Information
RoHS compliant per Altera/Intel product page (lead-free FBGA-256). Not AEC-Q100 qualified; for automotive designs requiring AEC-Q100, use the MAX V 5M570Z automotive-grade variant. Halogen-free status not explicitly listed in available data - marked unknown.
