EPM570GT144I5N vs EPM570GT144C3 Comparison
Detailed side-by-side comparison of EPM570GT144I5N by Intel and EPM570GT144C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM570GT144I5N | EPM570GT144C3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | 440 |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 116 (TQFP-144) | 76 (max, package-dependent) |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits (8,192 bits) |
| Core Voltage | 1.8 V | — |
| MultiVolt I/O Bank Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| Speed Grade | I5 (fastest industrial grade) | — |
| Operating Temperature | -40C to +100C (industrial) | 0 °C to +85 °C (commercial, C3 grade) |
| Package | TQFP-144 (GT144) | 144-pin TQFP (GT144) |
| Mounting Type | Surface Mount | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) ISP | JTAG IEEE 1149.1 (ISP) |
| Configuration Memory | Non-volatile on-chip flash | — |
| Process Technology | 6-layer-metal flash CMOS | 0.30 µm 6-layer-metal flash CMOS |
| RoHS Status | Compliant | Compliant |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Pin-to-Pin Propagation Delay (tPD1) | — | 5.4 ns (commercial, fastest speed grade) |
| Core Supply Voltage | — | 1.8 V (internal regulator from VCCINT 3.3 V) |
| I/O Supply Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Method | — | Non-volatile on-chip flash (instant-on) |
| MSL Level | — | MSL 3 (per JEDEC J-STD-020) |