EPM570GT144C3 - MAX II 570 LE CPLD, 5.4ns, 144-TQFP | Intel
MPN: EPM570GT144C3 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $22.9 | $22.90 |
| 10 | $21.85 | $218.50 |
| 100 | $18.4 | $1,840.00 |
| 500 | $15.95 | $7,975.00 |
| 1,000 | $13.5 | $13,500.00 |
Drop-in alternatives for EPM570GT144C3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570GT144C5N
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$14.2 / Unit
View Datasheet βEPM570GT144I5N
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View Datasheet βEPM570GT144C3N
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View Datasheet βEPM570GT144C4N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
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View Datasheet βEPM570GT144C3 Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/O Count | 76 (max, package-dependent) |
| Pin-to-Pin Propagation Delay (tPD1) | 5.4 ns (commercial, fastest speed grade) |
| User Flash Memory (UFM) | 8 Kbits (8,192 bits) |
| Core Supply Voltage | 1.8 V (internal regulator from VCCINT 3.3 V) |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial, C3 grade) |
| Package | 144-pin TQFP (GT144) |
| Mounting Type | Surface Mount |
| Process Technology | 0.30 Β΅m 6-layer-metal flash CMOS |
| Configuration Method | Non-volatile on-chip flash (instant-on) |
| Programming Interface | JTAG IEEE 1149.1 (ISP) |
| RoHS Status | Compliant |
| MSL Level | MSL 3 (per JEDEC J-STD-020) |
EPM570GT144C3 Pin Configuration
| Pin 1 | I/O β User I/O (bank 1) |
| Pin 2 | I/O β User I/O (bank 1) |
| Pin 3 | I/O β User I/O (bank 1) |
| Pin 4 | I/O β User I/O (bank 1) |
| Pin 5 | I/O β User I/O (bank 1) |
| Pin 6 | I/O β User I/O (bank 1) |
| Pin 7 | I/O β User I/O (bank 1) |
| Pin 8 | VCCIO1 β I/O bank 1 supply voltage (1.5/1.8/2.5/3.3V) |
| Pin 9 | I/O β User I/O (bank 1) |
| Pin 10 | I/O β User I/O (bank 1) |
| Pin 11 | I/O β User I/O (bank 1) |
| Pin 12 | I/O β User I/O (bank 1) |
| Pin 13 | I/O β User I/O (bank 2) |
| Pin 14 | I/O β User I/O (bank 2) |
| Pin 15 | VCCIO2 β I/O bank 2 supply voltage |
| Pin 16 | I/O β User I/O (bank 2) |
| Pin 17 | I/O β User I/O (bank 2) |
| Pin 18 | I/O β User I/O (bank 2) |
| Pin 19 | I/O β User I/O (bank 2) |
| Pin 20 | I/O β User I/O (bank 2) |
| Pin 21 | I/O β User I/O (bank 2) |
| Pin 22 | I/O β User I/O (bank 2) |
| Pin 23 | I/O β User I/O (bank 2) |
| Pin 24 | I/O β User I/O (bank 2) |
| Pin 25 | I/O β User I/O (bank 2) |
| Pin 26 | I/O β User I/O (bank 2) |
| Pin 27 | I/O β User I/O (bank 3) |
| Pin 28 | VCCIO3 β I/O bank 3 supply voltage |
| Pin 29 | I/O β User I/O (bank 3) |
| Pin 30 | I/O β User I/O (bank 3) |
| Pin 31 | I/O β User I/O (bank 3) |
| Pin 32 | I/O β User I/O (bank 3) |
| Pin 33 | I/O β User I/O (bank 3) |
| Pin 34 | I/O β User I/O (bank 3) |
| Pin 35 | I/O β User I/O (bank 3) |
| Pin 36 | I/O β User I/O (bank 3) |
| Pin 37 | VCCINT β Core analog 3.3V supply |
| Pin 38 | GND β Ground |
| Pin 39 | I/O β User I/O (bank 4) |
| Pin 40 | I/O β User I/O (bank 4) |
| Pin 41 | I/O β User I/O (bank 4) |
| Pin 42 | I/O β User I/O (bank 4) |
| Pin 43 | I/O β User I/O (bank 4) |
| Pin 44 | I/O β User I/O (bank 4) |
| Pin 45 | I/O β User I/O (bank 4) |
| Pin 46 | VCCIO4 β I/O bank 4 supply voltage |
| Pin 47 | I/O β User I/O (bank 4) |
| Pin 48 | I/O β User I/O (bank 4) |
| Pin 49 | I/O β User I/O (bank 4) |
| Pin 50 | I/O β User I/O (bank 4) |
| Pin 51 | I/O β User I/O (bank 4) |
| Pin 52 | I/O β User I/O (bank 4) |
| Pin 53 | I/O β User I/O (bank 4) |
| Pin 54 | I/O β User I/O (bank 4) |
| Pin 55 | I/O β User I/O (bank 4) |
| Pin 56 | I/O β User I/O (bank 4) |
| Pin 57 | I/O β User I/O (bank 4) |
| Pin 58 | I/O β User I/O (bank 4) |
| Pin 59 | I/O β User I/O (bank 4) |
| Pin 60 | I/O β User I/O (bank 4) |
| Pin 61 | I/O β User I/O (bank 4) |
| Pin 62 | I/O β User I/O (bank 4) |
| Pin 63 | I/O β User I/O (bank 4) |
| Pin 64 | I/O β User I/O (bank 4) |
| Pin 65 | I/O β User I/O (bank 4) |
| Pin 66 | I/O β User I/O (bank 4) |
| Pin 67 | VCCIO4 β I/O bank 4 supply voltage |
| Pin 68 | I/O β User I/O (bank 4) |
| Pin 69 | I/O β User I/O (bank 4) |
| Pin 70 | I/O β User I/O (bank 4) |
| Pin 71 | I/O β User I/O (bank 4) |
| Pin 72 | I/O β User I/O (bank 4) |
| Pin 73 | TDI β JTAG Test Data In |
| Pin 74 | TCK β JTAG Test Clock |
| Pin 75 | TMS β JTAG Test Mode Select |
| Pin 76 | nCONFIG β Configuration start (active low) |
| Pin 77 | I/O β User I/O (bank 3) |
| Pin 78 | I/O β User I/O (bank 3) |
| Pin 79 | I/O β User I/O (bank 3) |
| Pin 80 | VCCIO3 β I/O bank 3 supply voltage |
| Pin 81 | I/O β User I/O (bank 3) |
| Pin 82 | I/O β User I/O (bank 3) |
| Pin 83 | I/O β User I/O (bank 3) |
| Pin 84 | I/O β User I/O (bank 3) |
| Pin 85 | I/O β User I/O (bank 3) |
| Pin 86 | I/O β User I/O (bank 3) |
| Pin 87 | I/O β User I/O (bank 3) |
| Pin 88 | I/O β User I/O (bank 3) |
| Pin 89 | I/O β User I/O (bank 3) |
| Pin 90 | I/O β User I/O (bank 3) |
| Pin 91 | GND β Ground |
| Pin 92 | I/O β User I/O (bank 2) |
| Pin 93 | I/O β User I/O (bank 2) |
| Pin 94 | I/O β User I/O (bank 2) |
| Pin 95 | I/O β User I/O (bank 2) |
| Pin 96 | VCCIO2 β I/O bank 2 supply voltage |
| Pin 97 | I/O β User I/O (bank 2) |
| Pin 98 | I/O β User I/O (bank 2) |
| Pin 99 | I/O β User I/O (bank 2) |
| Pin 100 | I/O β User I/O (bank 2) |
| Pin 101 | I/O β User I/O (bank 2) |
| Pin 102 | I/O β User I/O (bank 2) |
| Pin 103 | I/O β User I/O (bank 2) |
| Pin 104 | I/O β User I/O (bank 2) |
| Pin 105 | I/O β User I/O (bank 2) |
| Pin 106 | I/O β User I/O (bank 2) |
| Pin 107 | I/O β User I/O (bank 2) |
| Pin 108 | I/O β User I/O (bank 1) |
| Pin 109 | VCCIO1 β I/O bank 1 supply voltage |
| Pin 110 | I/O β User I/O (bank 1) |
| Pin 111 | I/O β User I/O (bank 1) |
| Pin 112 | I/O β User I/O (bank 1) |
| Pin 113 | I/O β User I/O (bank 1) |
| Pin 114 | I/O β User I/O (bank 1) |
| Pin 115 | I/O β User I/O (bank 1) |
| Pin 116 | I/O β User I/O (bank 1) |
| Pin 117 | I/O β User I/O (bank 1) |
| Pin 118 | CONF_DONE β Configuration done (open drain) |
| Pin 119 | nSTATUS β Configuration status (open drain) |
| Pin 120 | TDO β JTAG Test Data Out |
| Pin 121 | I/O β User I/O (bank 1) |
| Pin 122 | I/O β User I/O (bank 1) |
| Pin 123 | I/O β User I/O (bank 1) |
| Pin 124 | I/O β User I/O (bank 1) |
| Pin 125 | I/O β User I/O (bank 1) |
| Pin 126 | I/O β User I/O (bank 1) |
| Pin 127 | I/O β User I/O (bank 1) |
| Pin 128 | I/O β User I/O (bank 1) |
| Pin 129 | I/O β User I/O (bank 1) |
| Pin 130 | I/O β User I/O (bank 1) |
| Pin 131 | I/O β User I/O (bank 1) |
| Pin 132 | VCCINT β Core analog 3.3V supply |
| Pin 133 | I/O β User I/O (bank 1) |
| Pin 134 | I/O β User I/O (bank 1) |
| Pin 135 | GND β Ground |
| Pin 136 | I/O β User I/O (bank 1) |
| Pin 137 | I/O β User I/O (bank 1) |
| Pin 138 | I/O β User I/O (bank 1) |
| Pin 139 | I/O β User I/O (bank 1) |
| Pin 140 | I/O β User I/O (bank 1) |
| Pin 141 | I/O β User I/O (bank 1) |
| Pin 142 | I/O β User I/O (bank 1) |
| Pin 143 | I/O β User I/O (bank 1) |
| Pin 144 | I/O β User I/O (bank 1) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570GT144C3 is suitable for 7 applications: Bus Interface Bridging and Glue Logic, FPGA Configuration and Power Sequencing, Industrial Control and Factory Automation, Consumer Electronics and Display Control, LED Display and Signage Controllers, Test & Measurement and Instrumentation Front-Ends, Automotive Body Electronics (Non-Safety).
Bus Interface Bridging and Glue Logic
The EPM570GT144C3 is widely used for bus-to-bus bridging between disparate interfaces such as PCI to local bus, I2C to SPI, parallel SRAM to asynchronous peripherals, or custom legacy buses to modern microcontrollers. The 76 user I/Os in the GT144 package provide ample headroom for 16-bit and 32-bit data buses plus address and control signals. MultiVolt I/O support (1.5V / 1.8V / 2.5V / 3.3V) lets a single CPLD bridge between mixed-voltage domains without external level shifters, while the 5.4 ns tPD1 guarantees deterministic timing for protocol translation tasks such as address decoding and chip-select generation in 50-100 MHz systems. The non-volatile flash configuration ensures instant-on behavior critical for bus-arbitration and reset-vector logic.
Recommended
FPGA Configuration and Power Sequencing
The EPM570GT144C3 is commonly deployed as a configuration supervisor and power-sequencer for larger FPGAs such as Cyclone IV/V or Stratix families. It can store board identity, MAC address, and calibration data in the 8 Kbit user flash memory, then drive the FPGA's nCONFIG, nSTATUS, and CONF_DONE signals through a deterministic state machine. The 35 Β΅A standby current preserves battery life in always-on sequencing logic, and the instant-on flash configuration eliminates the cold-boot delay that volatile FPGAs exhibit without an external boot PROM. The 5.4 ns tPD1 supports multi-rail sequencing for FPGAs that require precise rail-to-rail timing margins during power-up.
Recommended
Industrial Control and Factory Automation
In factory-automation and PLC architectures, the EPM570GT144C3 serves as deterministic glue logic for motor-control signal conditioning, encoder interfacing, and safety-critical interlock decoding. The 570 LEs accommodate medium-complexity state machines for protocol conversion (EtherCAT, Profibus, Modbus) and the 76 I/Os support multi-axis control loops. While the EPM570GT144C3 itself is commercial-grade (0 Β°C to +85 Β°C), designs requiring wider temperature ranges can drop in the EPM570GT144I5N variant. The flash-based non-volatile configuration is robust against industrial EMI events that would otherwise corrupt volatile SRAM FPGAs, and the low static power simplifies thermal management in sealed enclosures.
Recommended
Consumer Electronics and Display Control
Consumer devices such as digital cameras, set-top boxes, e-readers, and household appliances leverage the EPM570GT144C3 for display timing generation, button-matrix scanning, and standby-controller logic. The instant-on flash configuration eliminates the visible delay that volatile FPGAs exhibit at power-on, and the 35 Β΅A standby current preserves battery life in always-listening remote controls. The MultiVolt I/O bank lets the CPLD directly interface 1.8V image sensors, 3.3V display drivers, and 5V legacy peripherals from a single chip. The 144-pin TQFP package is hand-solderable for prototype and low-volume manufacturing, accelerating consumer-product development cycles.
Recommended
LED Display and Signage Controllers
The EPM570GT144C3 excels as a scan-controller for LED matrix displays, scrolling signs, and architectural lighting fixtures where deterministic refresh timing is critical. The 5.4 ns tPD1 enables high-MHz PWM generation for color-mixing LED drivers, and the 76 I/Os drive multiplexed row/column drivers for 8x8 to 16x32 RGB matrices without external buffers. The 8 Kbit UFM stores calibration data, brightness curves, and gamma tables for uniform panel appearance. The flash-based non-volatile configuration retains display patterns across power cycles, an advantage over microcontrollers that lose RAM state on brown-out.
Recommended
Test & Measurement and Instrumentation Front-Ends
Benchtop instruments and ATE (Automatic Test Equipment) use the EPM570GT144C3 as a flexible pattern generator, multiplexer controller, or trigger-arming logic. The 570 LEs implement arbitrary stimulus sequencing with sub-10 ns edge accuracy, and the MultiVolt I/O interfaces directly to 1.5V LVDS drivers, 3.3V CMOS ADC front-ends, and 5V legacy instrumentation buses. The on-chip UFM stores calibration constants and test-pattern libraries. Designers can use Quartus Prime to recompile the CPLD in minutes when a new test sequence is needed - faster and cheaper than respinning a microcontroller PCB or building discrete TTL logic.
Recommended
Automotive Body Electronics (Non-Safety)
While the EPM570GT144C3 itself is commercial-grade and not AEC-Q100 qualified, it serves as a cost-effective development platform for automotive body-electronics prototypes such as body-control modules, mirror controllers, and HVAC switch-matrix decoders. Engineers can validate the design on the commercial part, then migrate to the EPM570GT144I5N or equivalent industrial-temperature variant for low-volume production. The 5.4 ns tPD1 supports CAN-bus interface glue logic, and the 76 I/Os accommodate multi-channel switch-matrix decoding for HVAC controls and body-control networks. The non-volatile flash configuration eliminates cold-start delays that would otherwise be perceptible to the driver.
Recommended
Recommended Products Summary
Engineering reference data for EPM570GT144C3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GT144C5N | EPM570GT144I5N | EPM570GT144C3N | EPM570GT144C4N |
|---|---|---|---|---|---|
| Package | 144-pin TQFP (GT144) | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same | 144-pin TQFP (GT144) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LEs) | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 |
| tPD1 (Pin-to-Pin Delay) | 5.4 ns | 7.5 ns (slower) | 7.5 ns (slower) | 5.4 ns (identical) | ~6.5 ns (intermediate) |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Operating Temperature Range | 0 Β°C to +85 Β°C (Commercial) | 0 Β°C to +85 Β°C (Commercial) | -40 Β°C to +100 Β°C (Industrial) | 0 Β°C to +85 Β°C (Commercial) | 0 Β°C to +85 Β°C (Commercial) |
| Lead-Free Finish | Standard finish (verify per lot) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Approx. Unit Price (1-pc, USD) | 22.90 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Fastest commercial speed grade in the MAX II 570 LE family (vs EPM570GT144C5N)
- Instant-on non-volatile flash configuration eliminates boot delay (vs SRAM-based small FPGAs (e.g. Cyclone family))
- MultiVolt I/O banks support 1.5V/1.8V/2.5V/3.3V mixed-voltage interfacing (vs Single-voltage competitor CPLDs)
Design Notes
The EPM570GT144C3 requires a stable 3.3V supply on VCCINT pins (multiple pins on the GT144 package) plus 1.5V/1.8V/2.5V/3.3V on each VCCIO bank. Bulk-decouple each VCCINT pin with a 1Β΅F ceramic plus 0.1Β΅F high-frequency bypass within 5mm of the pin, and add a 10Β΅F tantalum bulk cap near the regulator. The internal 1.8V core regulator does not require external capacitance, but power-rail sequencing should ensure VCCINT rises monotonically without glitches - if the host MCU and CPLD power up simultaneously, use a power-good signal from the regulator to gate the CPLD's nCONFIG pin until VCCINT is stable.
Place all VCCINT and VCCIO decoupling capacitors as close as possible to their respective pins on the top layer with short, wide traces to the power plane. For the 144-pin TQFP (GT144), route JTAG signals (TDI, TMS, TCK, TDO) away from switching I/O to avoid noise coupling during ISP programming. Add a 4.7kΞ© pull-up on nCONFIG and nSTATUS, and a 10kΞ© pull-up on CONF_DONE if open-drain operation is required. The TQFP thermal pad (if any) should be soldered to a small ground copper pour to improve thermal dissipation.
Common pitfalls: (1) Setting all four VCCIO banks to 3.3V when one bank interfaces to 1.5V logic - this can damage the I/O cells; (2) Forgetting to instantiate the JTAG user code in the Quartus Prime .SOF/.POF and then trying to program in-system - yields 'JTAG chain failure'; (3) Driving the JTAG TDI/TMS/TCK lines from a long cable without proper buffering - causes ISP failures; (4) Mixing commercial and industrial grade parts on the same PCB - the timing models differ and will not interchange. Always validate AC timing with the Quartus Prime TimeQuest timing analyzer at the worst-case temperature corner before taping out the PCB.
When driving high-speed buses (>50 MHz) from the EPM570GT144C3 I/O, enable Quartus Prime's near-end and far-end I/O timing analysis and check the IBIS model for the specific speed grade. The 5.4 ns tPD1 figure (C3 grade) is the pin-to-pin delay through the logic fabric only; I/O buffer delays and PCB trace delays must be subtracted to find the actual system margin. For multi-MHz buses, add source-series termination (typically 22-33Ξ©) close to the CPLD output to dampen reflections on long traces.
Compliance Information
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified - for automotive designs, migrate to industrial-grade EPM570GT144I5N or AEC-Q100-qualified MAX 10 CPLDs. Lead-free finish standard.