H5ANAG8NCR-PBC vs H5ANAG8NCMR-VKC Comparison
Detailed side-by-side comparison of H5ANAG8NCR-PBC by SK hynix and H5ANAG8NCMR-VKC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | H5ANAG8NCR-PBC | H5ANAG8NCMR-VKC |
|---|---|---|
| Brand | SK hynix | SK hynix |
| Category | DRAM | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.50 | $8.05 |
| Memory Density | 16Gb (2 GB) | — |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM |
| Organization | x8 | — |
| Supply Voltage | 1.2 V (typical, DDR4 class) | — |
| Interface Type | Parallel, DDR4 (Double Data Rate 4) | — |
| Package | FBGA-78 (approximately 7.5 x 11 mm) | FBGA-78 |
| Mounting Type | Surface Mount | Surface Mount |
| Speed Grade Code | -PBC (SK hynix speed/temperature code; exact Mbps bin [DATA_NEEDED: speed bin value]) | — |
| Clock Frequency | [DATA_NEEDED: clock frequency] | — |
| CAS Latency | [DATA_NEEDED: CAS latency] | [DATA_NEEDED: CAS latency for VK speed bin] |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Bank Group Architecture | Yes (DDR4 bank groups) | — |
| On-Die Termination (ODT) | Yes (DDR4 standard feature) | — |
| Self-Refresh | Yes (DDR4 standard feature) | — |
| RoHS Status | Compliant (Lead-Free & Halogen-Free per SK hynix family datasheet) | [DATA_NEEDED: RoHS status] |
| Process Technology | CMOS | — |
| Application Class | Main memory (server, industrial, networking, PC) | — |
| Memory Size | — | 16 Gb |
| Memory Organization | — | 2G x 8 |
| Data Rate | — | 2666 Mbps/pin (DDR4-2666) |
| Supply Voltage (VDD) | — | 1.2 V |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Speed Grade | — | VK (per SK hynix speed-bin suffix) |
| Power Class | — | Normal Power |
| Bank Groups | — | 4 |
| Banks Total | — | 16 |
| Packaging | — | [DATA_NEEDED: standard packing quantity] |
| Manufacturer Process | — | CMOS DRAM |