IQDH35N03LM5CGATMA1 vs BSC066N06NSATMA1 Comparison

Detailed side-by-side comparison of IQDH35N03LM5CGATMA1 by Infineon and BSC066N06NSATMA1 by Infineon. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter IQDH35N03LM5CGATMA1 BSC066N06NSATMA1
Brand Infineon Infineon
Category MOSFETs MOSFETs
Lifecycle Status Active Active
Drain-to-Source Voltage (VDS) 30 V —
Continuous Drain Current (ID) at Ta 66 A —
Pulsed Drain Current (IDM) at Tc 700 A —
Gate-to-Source Voltage (VGS) max ±20 V —
Static Drain-to-Source On-Resistance (RDS(on)) 0.35 mΩ (typical at VGS=10 V) —
Power Dissipation (PD) at Ta 2.5 W —
Power Dissipation (PD) at Tc 278 W —
Operating Temperature Range -55 °C to +175 °C —
Package PG-TTFN-9-U02 (PQFN 5x6 mm²) PG-TDSON-8-6 (TDSON EP)
Mounting Type Surface Mount Surface Mount
MSL Level 1 1
RoHS Status Compliant Compliant
Halogen Free Yes —
Channel Type N-Channel —
Technology OptiMOS 5 trench MOSFET OptiMOS 5 60 V trench-gate
Drain-Source Voltage (VDS) — 60 V
Continuous Drain Current (ID) at TC=25°C — 64 A
Continuous Drain Current (ID) at TC=100°C — 45 A
Pulsed Drain Current (IDM) — 256 A
Gate-Source Voltage (VGS) max — ±20 V
Static Drain-Source On-Resistance (RDS(on)) at VGS=10V — 6.6 mΩ (max)
Gate Threshold Voltage (VGS(th)) — 1.7 V (typ)
Total Gate Charge (Qg) — 26 nC (typ)
Power Dissipation (PD) at TC=25°C — 46 W
Power Dissipation (PD) at TA=25°C — 2.5 W
Thermal Resistance, Junction-to-Case (RθJC) — 1.3 °C/W
Operating Junction Temperature — -55°C to +150°C

Datasheets & Resources

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