K3K8K80BM-MGCP vs K3K9K90BM-MGCP Comparison
Detailed side-by-side comparison of K3K8K80BM-MGCP by Samsung Electronics and K3K9K90BM-MGCP by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K3K8K80BM-MGCP | K3K9K90BM-MGCP |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $47.15 |
| Memory Type | LPDDR5 SDRAM (DRAM) | LPDDR5 SDRAM (CMOS) |
| Density | 64 Gb | — |
| Organization | 2G x 32 | [DATA_NEEDED: density and organization] |
| Data Rate | 6400 Mbps | — |
| Interface | LPDDR5 (CMOS) | — |
| Package | FBGA-315 (PBGA315) | PBGA (Plastic Ball Grid Array) |
| Supply Voltages | 500 mV, 900 mV, 1.05 V, 1.8 V | — |
| Operating Temperature | -25C to +85C | [DATA_NEEDED: operating temperature range] |
| Mounting Type | Surface Mount | Surface Mount |
| Technology | CMOS | — |
| Memory Category | Volatile DRAM | — |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free | Yes | — |
| Application Class | Specialized ICs / Memory | — |
| I/O Width | 32-bit | — |
| Pin Speed | — | Up to 6400 Mbps (family maximum per Samsung LPDDR5 page) |
| Interface Width | — | x32 (family standard for K3K/K3L BM packages) |
| Ball Count | — | [DATA_NEEDED: ball count] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: VDD voltage] |
| Refresh | — | Self-refresh with per-bank refresh support (LPDDR5 standard) |
| Power Saving vs LPDDR4X | — | Approximately 20% (Samsung published figure) |
| Max Bandwidth | — | Up to 51.2 GB/s (family maximum per Samsung LPDDR5 page) |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Clocking | — | WCK (word clock) architecture |
| Standards | — | JEDEC LPDDR5 |