K3KL8L80DM-MGCU vs K3KL8L80DM-JGCT Comparison
Detailed side-by-side comparison of K3KL8L80DM-MGCU by Samsung Electronics and K3KL8L80DM-JGCT by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K3KL8L80DM-MGCU | K3KL8L80DM-JGCT |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $80.70 |
| Memory Type | LPDDR5X SDRAM | — |
| Density | 8 Gbit | 32 Gbit (4 GB) |
| Organization | 1G x 32 | x32 |
| Supply Voltage (VDD) | 1.05 V | — |
| Package | FBGA-315 | FBGA-315 (315-ball BGA) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Interface | LPDDR5X (JEDEC LPDDR5 backward-compatible) | LPDDR5X (JEDEC LPDDR5-compatible, low-power SDRAM) |
| Data Rate | [DATA_NEEDED: max data rate / speed grade] | Up to 7500 Mbps (family up to 8.5 Gbps) |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | -25C to +85C |
| Refresh | Self-refresh with per-bank refresh support | — |
| Power Management | Deep Sleep Mode (LPDDR5 feature set) | — |
| Configuration | Single-die, 32-bit bus | — |
| RoHS Status | unknown | Compliant |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| Application Segment | Mobile / Automotive / Edge AI | — |
| Manufacturer | — | Samsung Electronics |
| Product Type | — | LPDDR5X SDRAM |
| Supply Rails | — | 500 mV / 900 mV / 1.05 V / 1.8 V |
| Power Efficiency | — | ~20-25% improvement vs LPDDR5 (family figure) |
| Application Domains | — | Mobile, PC, automotive, on-device AI |
| VDD2/VDDQ Class | — | [DATA_NEEDED: exact VDD2 and VDDQ rail values for -JGCT speed grade] |
| Speed Grade Suffix Detail | — | [DATA_NEEDED: official Samsung ordering-code decode for JGCT suffix] |
| Package Dimensions | — | [DATA_NEEDED: package body dimensions in mm] |