K3KL9L90CM-MGCT vs K3KL3L30CM-BGCT Comparison
Detailed side-by-side comparison of K3KL9L90CM-MGCT by Samsung Electronics and K3KL3L30CM-BGCT by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K3KL9L90CM-MGCT - 64Gb LPDDR5X 7500Mbps x32 DRAM | Samsung
K3KL9L90CM-MGCT ✓ Active
Specification Comparison
| Parameter | K3KL9L90CM-MGCT | K3KL3L30CM-BGCT |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $36.91 | $0.00 |
| Memory Type | LPDDR5X SDRAM (DRAM) | LPDDR5X SDRAM |
| Memory Size | 64 Gbit (8 GByte) | — |
| Memory Organization | x32 | — |
| Maximum Data Rate | 7500 Mbps | — |
| Interface | LPDDR5X | — |
| Supply Voltages | 500 mV / 900 mV / 1.05 V / 1.8 V | — |
| VDDQ | 500 mV | — |
| Operating Temperature | -25C to +85C | [DATA_NEEDED: operating temperature range] |
| Package | FBGA-315 (BGA-315) | [DATA_NEEDED: exact package code and ball count] |
| Ball Pitch | 0.8 mm | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS status] |
| Product Status | Active | — |
| Typical Applications | Data storage, firmware boot, embedded logging, industrial controllers, computing modules | — |
| Memory Standard | JEDEC LPDDR5X-class (JESD209-5B family) | — |
| MSL Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| CAS Latency | [DATA_NEEDED: CAS latency] | — |
| Density | — | 64 Gbit |
| Organization | — | x64 |
| Speed Grade | — | LPDDR5X-7500 (7500 MT/s) |
| Technology | — | Stacked DRAM die, mobile BGA |
| Core Voltage | — | [DATA_NEEDED: VDD core voltage] |
| I/O Voltage (VDDQ) | — | [DATA_NEEDED: VDDQ voltage] |
| Refresh | — | [DATA_NEEDED: refresh scheme] |
| Standards Compliance | — | JEDEC LPDDR5X specification |
| Application Class | — | Mobile / embedded main memory |