K3KL9L90CM-MGCT - 64Gb LPDDR5X 7500Mbps x32 DRAM | Samsung
MPN: K3KL9L90CM-MGCT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $45.31 | $45.31 |
| 10 | $43.05 | $430.50 |
| 100 | $40.9 | $4,090.00 |
| 500 | $38.85 | $19,425.00 |
| 1,000 | $36.91 | $36,910.00 |
Drop-in alternatives for K3KL9L90CM-MGCT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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K3KL3L30CM-BGCU
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View Datasheet →K3KL3L30CM-BGCT
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View Datasheet →K3KL8L80CM-MGCT
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View Datasheet →K3KL9L90CM-MGCT Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5X SDRAM (DRAM) |
| Memory Size | 64 Gbit (8 GByte) |
| Memory Organization | x32 |
| Maximum Data Rate | 7500 Mbps |
| Interface | LPDDR5X |
| Supply Voltages | 500 mV / 900 mV / 1.05 V / 1.8 V |
| VDDQ | 500 mV |
| Operating Temperature | -25C to +85C |
| Package | FBGA-315 (BGA-315) |
| Ball Pitch | 0.8 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per JLCPCB listing) |
| Product Status | Active |
| Typical Applications | Data storage, firmware boot, embedded logging, industrial controllers, computing modules |
| Memory Standard | JEDEC LPDDR5X-class (JESD209-5B family) |
K3KL9L90CM-MGCT fbga-315 (bga-315) Pin Configuration Guide
Complete pinout information for K3KL9L90CM-MGCT (fbga-315 (bga-315) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K3KL9L90CM-MGCT.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K3KL9L90CM-MGCT is suitable for 6 applications: AI Edge Compute Modules, Smartphone and Tablet Main Memory, Industrial Controllers and Embedded Logging, Computing Modules (COM Express / SoM), Firmware Boot and Data Storage Subsystems, Replacement Sourcing and Legacy Redesign.
AI Edge Compute Modules
The K3KL9L90CM-MGCT fits AI edge-compute designs because its 64 Gbit density and 7500 Mbps x32 interface deliver roughly 300 Gbps of per-channel bandwidth, matching the memory-hungry working-set requirements of on-device neural inference. In a typical SoM design, one or two of these packages sit directly under or adjacent to the AI SoC on a fly-by LPDDR5X bus, powered from a dedicated 500 mV VDDQ rail with 1.8 V and 1.05 V support domains. The -25C to +85C industrial range allows fanless edge enclosures, while the 315-ball 0.8 mm-pitch FBGA keeps routing compact on 8-10 layer stackups.
Recommended
Smartphone and Tablet Main Memory
LPDDR5X is the mainstream mobile main-memory technology, and the 64 Gbit x32 K3KL9L90CM-MGCT aligns with flagship smartphone DRAM configurations of 8 GByte and above. Its 7500 Mbps pin speed supports the memory bandwidth demanded by large-camera ISP pipelines and multitasking operating systems, while LPDDR5X low-voltage operation (500 mV VDDQ) reduces memory-subsystem power versus LPDDR5 at equivalent speed - Samsung advertises roughly 20% better power efficiency for the family. The -25C to +85C range and RoHS-compliant FBGA-315 package suit high-volume mobile assembly with standard reflow profiling.
Recommended
Industrial Controllers and Embedded Logging
Industrial controllers benefit from the K3KL9L90CM-MGCT combination of large volatile working memory and an industrial -25C to +85C operating range, per the Samsung product overview that explicitly targets industrial controllers, embedded logging, and firmware boot. In these designs the DRAM buffers process data and event logs before commit to NAND, and the 7500 Mbps x32 interface keeps real-time control loops responsive under heavy logging traffic. Designers should implement LPDDR5X deep-sleep and self-refresh modes to minimize standby power in always-on PLC-class equipment.
Recommended
Computing Modules (COM Express / SoM)
Computer-on-module vendors use packaged LPDDR5X dies like the K3KL9L90CM-MGCT to deliver 8-16 GByte memory options on a single carrier-compatible footprint. The 315-ball FBGA with 0.8 mm ball pitch mounts on 8-12 layer module PCBs using standard HDI processes, and the x32 organization allows one- or two-package channel topologies to scale capacity without changing the module connector. At 7500 Mbps, module vendors must budget strict length matching and reference-plane integrity; the resulting ~300 Gbps per channel bandwidth supports x86 and ARM compute modules for network appliances and edge servers.
Recommended
Firmware Boot and Data Storage Subsystems
The Samsung product overview lists data storage, firmware boot, and replacement sourcing as target uses for the K3KL9L90CM-MGCT. In boot-centric architectures the DRAM acts as the execution workspace where compressed firmware images are decompressed and run at 7500 Mbps-class bandwidth, shortening cold-boot times versus lower-speed LPDDR4X. Paired with NAND devices, the LPDDR5X device buffers page-mapping tables and write coalescing caches; its 64 Gbit capacity is sufficient for storage controllers that manage multi-terabyte flash arrays, and the industrial temperature range suits storage appliances in unconditioned environments.
Recommended
Replacement Sourcing and Legacy Redesign
Because open-market distributors (Wolfchip, icDirectory, Fusion Worldwide, Win Source) carry substantial K3KL9L90CM-MGCT stock - 30250 pcs reported as of Aug 31, 2026 - the part is a practical replacement-sourcing target for platforms whose original LPDDR5X supplier is allocated or discontinued. The identical 315-ball footprint and 0.8 mm pitch across the Samsung K3KL9L90CM family means PCBs designed around one variant can accept siblings after density-strap verification. This page consolidates verified stock and drop-in family members to shorten shortage-resolution cycles for end-of-life platform maintenance.
Recommended
Recommended Products Summary
Engineering reference data for K3KL9L90CM-MGCT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K3KL3L30CM-BGCU | K3KL3L30CM-BGCT | K3KL8L80CM-MGCT |
|---|---|---|---|---|
| Package | FBGA-315 (BGA-315) | BGA (x64 organization package) | BGA (sibling speed bin) | FBGA-315 (BGA-315) - same |
| Brand | Samsung Electronics | Samsung Semiconductor | Samsung Semiconductor | Samsung Semiconductor |
| Memory Size | 64 Gbit | 64 Gbit | 64 Gbit | 32 Gbit |
| Memory Organization | x32 | x64 | x32 | x32 |
| Memory Type | LPDDR5X DRAM | LPDDR5X DRAM | LPDDR5X DRAM | LPDDR5X DRAM |
| Max Data Rate | 7500 Mbps | LPDDR5X class speed | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | -25C to +85C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | Active | Active | Active | Active |
Key Differentiators
- Maximum density per package in family (vs K3KL8L80CM-MGCT)
- Narrower x32 organization simplifies single-channel designs (vs K3KL3L30CM-BGCU)
- Industrial temperature range (vs K3KL8L80CM-MGCT)
Design Notes
At 7500 Mbps, LPDDR5X routing demands length-matched fly-by command/address topology and controlled-impedance data lanes. Keep data-group skews within +/-2 ps and use ODT (on-die termination) settings from the Samsung datasheet for the 7500 Mbps bin. Receiver DFE and CA training in the SoC memory controller must be enabled; skipping per-byte training calibration is the most common cause of failure to reach full speed bin.
The K3KL9L90CM-MGCT requires four supply domains: 1.8 V (VDD2/VDD1 auxiliaries per JLCPCB listing), 1.05 V and 900 mV core rails, and a 500 mV VDDQ rail. Sequence VDD2 first, then VDDQ/core, per LPDDR5X power-up requirements. The 500 mV rail carries the highest transient currents at 7500 Mbps - budget bulk and 100 nF per-ball-cluster decoupling and verify rail droop during simultaneous read/write bursts.
Use an 8-12 layer HDI stackup with solid reference planes under all LPDDR5X nets; the 0.8 mm ball pitch of the 315-ball FBGA allows via-in-pad escape on 4 mil traces. Avoid splitting the VDDQ reference plane under data lanes. Follow Samsung LPDDR5X package layout guidelines for ball-map fanout and keep the DRAM within 100 mm of the SoC when possible to hold eye margins at 7500 Mbps.
Compliance Information
RoHS compliance marked per JLCPCB listing. Lead-free consistent with RoHS BGA solder-ball construction. Obtain official Samsung material declarations from the Samsung compliance portal for lot-specific REACH and halogen-free statements.
