K4A8G165WB-BCPB vs K4A8G085WB-BCPB Comparison
Detailed side-by-side comparison of K4A8G165WB-BCPB by Samsung Electronics and K4A8G085WB-BCPB by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4A8G165WB-BCPB
K4A8G165WB-BCPB - 8Gb DDR4 SDRAM x16 2133Mbps | Samsung
K4A8G165WB-BCPB β Active
Specification Comparison
| Parameter | K4A8G165WB-BCPB | K4A8G085WB-BCPB |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.30 | $3.28 |
| Density | 8 Gb | 8 Gbit |
| Organization | 512M x 16 | 1G x 8 |
| Speed Grade | 2133 Mbps (PC4-17000) | BC |
| Supply Voltage | 1.2 V (1.14 V to 1.26 V) | 1.2 V (nominal) |
| Operating Temperature | 0Β°C to 85Β°C | β |
| Package | 96-ball FBGA (TFBGA-96) | 78-ball FBGA |
| Burst Length | 8 (BL8) | 8 |
| Burst Type | Sequential and Interleave | β |
| CAS Latency | Programmable (e.g., 15, 16, 18) | β |
| Refresh | Auto and Self Refresh | β |
| Number of Terminals | 96 | β |
| Package Code | TFBGA | β |
| Package Shape | RECTANGULAR | β |
| Terminal Position | BOTTOM | β |
| RoHS Status | Compliant | Compliant |
| Memory Type | β | DDR4 SDRAM |
| Data Rate | β | 3200 Mbps (PC4-25600) |
| CAS Latency (CL) | β | 22 |
| Bank Architecture | β | 16 banks (4 bank groups) |
| Refresh Interval | β | 7.8 us (up to 85C) |
| Interface Type | β | SSTL-12 |
| Termination | β | ODT / dynamic ODT |
| Self-Refresh | β | Temperature-Compensated Self-Refresh (TCSR) |
| Package Dimensions | β | 11 mm x 11 mm |
| Mounting Type | β | Surface Mount (BGA) |
| Operating Mode | β | DLL enabled |