K4A8G085WB-BCPB - 8Gb DDR4 SDRAM 1Gx8 | Samsung | FBGA-78
MPN: K4A8G085WB-BCPB ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.02 | $4.02 |
| 10 | $3.85 | $38.50 |
| 100 | $3.5 | $350.00 |
| 500 | $3.2 | $1,600.00 |
| 1,000 | $2.95 | $2,950.00 |
Drop-in alternatives for K4A8G085WB-BCPB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A8G085WB-BCRC
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View Datasheet →K4A8G085WC-BIWE
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View Datasheet →K4A8G085WB-BITD
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View Datasheet →K4A8G085WB-BIWE
✅ Drop-In✓ In Stock
$6.5 / Unit
View Datasheet →K4A8G085WG-BIWE
✅ Drop-In📋 Reference alternative (not in catalog)
MT40A1G8SA-062E
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$5.5 / Unit
View Datasheet →H5AN8G6NDJR-XNC
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View Datasheet →K4A8G085WB-BCPB Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Memory Size | 8 Gb (1G x 8) |
| Supply Voltage | 1.2 V |
| Data Rate | 3200 Mbps |
| CAS Latency | 22 |
| Package | FBGA-78 |
| Package Dimensions | 11 mm x 11 mm |
| Number of Pins | 78 |
| Operating Temperature Range | 0C to +95C (Tc) |
| Refresh Interval | 7.8 us at 85C |
| Burst Length | 8 |
| Number of Banks | 16 (4 bank groups) |
| Interface | CMOS |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
K4A8G085WB-BCPB Pin Configuration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDD — Power supply |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ4 — Data input/output 4 |
| Pin B3 | DQ5 — Data input/output 5 |
| Pin B4 | VDD — Power supply |
| Pin B5 | DQ6 — Data input/output 6 |
| Pin B6 | DQ7 — Data input/output 7 |
| Pin B7 | VSS — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A8G085WB-BCPB is suitable for 6 applications: High-Performance Computing, Networking Equipment, Consumer Electronics, Embedded Systems, Data Center Servers, Automotive Infotainment.
High-Performance Computing
The K4A8G085WB-BCPB provides 8Gb density and 3200 Mbps data rate, making it ideal for HPC systems that require large memory capacity and high bandwidth. Its low 1.2V operation reduces power consumption in data centers, and the FBGA-78 package allows for high-density board layouts. When used in multi-channel configurations, it can deliver the memory throughput needed for complex simulations and data analytics.
Recommended
Networking Equipment
In routers and switches, the K4A8G085WB-BCPB offers the speed and density needed for packet buffering and forwarding tables. Its 3200 Mbps data rate ensures low latency, while the 1.2V supply helps manage thermal budgets in compact chassis. The device's on-die termination improves signal integrity on high-speed traces, reducing bit errors in demanding network environments.
Recommended
Consumer Electronics
For laptops and desktops, the K4A8G085WB-BCPB provides a balance of performance and power efficiency. Its 8Gb density supports multitasking and multimedia applications, while the low operating voltage extends battery life in portable devices. The FBGA-78 package is compatible with standard PCB assembly processes, enabling cost-effective manufacturing.
Recommended
Embedded Systems
The K4A8G085WB-BCPB is suitable for embedded systems requiring high memory bandwidth, such as industrial PCs and medical devices. Its wide operating temperature range and low power consumption make it reliable in harsh environments. The device's 1.2V operation simplifies power supply design, and the 78-ball FBGA package is easy to route on multi-layer PCBs.
Recommended
Data Center Servers
In server applications, the K4A8G085WB-BCPB enables high memory capacity per DIMM, supporting virtualization and large databases. Its 3200 Mbps data rate matches the requirements of modern server processors, and the low voltage reduces overall system power. The device's advanced features like dynamic ODT help maintain signal integrity in multi-rank configurations.
Recommended
Automotive Infotainment
The K4A8G085WB-BCPB can be used in automotive infotainment systems that require high-speed memory for navigation, multimedia, and driver assistance. Its industrial temperature grade variants (e.g., -BIWE) support operation in extreme conditions. The 1.2V supply is compatible with automotive power rails, and the FBGA-78 package withstands vibration and thermal cycling.
Recommended
Recommended Products Summary
Engineering reference data for K4A8G085WB-BCPB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A8G085WB-BCRC | K4A8G085WC-BIWE | MT40A1G8SA-062E |
|---|---|---|---|---|
| Package | FBGA-78 | FBGA-78 | FBGA-78 | FBGA-78 |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Memory Size | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Data Rate | 3200 Mbps | [DATA_NEEDED] | [DATA_NEEDED] | 3200 Mbps |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| CAS Latency | 22 | [DATA_NEEDED] | [DATA_NEEDED] | 22 |
| Operating Temperature | 0C to +95C | [DATA_NEEDED] | -40C to +95C | 0C to +95C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- High data rate of 3200 Mbps (vs K4A8G085WB-BCRC)
- Industrial temperature grade option (vs K4A8G085WB-BCPB)
- Samsung's advanced process technology (vs MT40A1G8SA-062E)
Design Notes
Ensure a stable 1.2V supply with low ripple. Use a dedicated voltage regulator with at least 1A capability and place 0.1uF and 10uF decoupling capacitors close to the VDD pins. The VDDQ supply should be separate and also decoupled to minimize noise coupling.
Route high-speed DQ and DQS signals with controlled impedance (typically 40-50 ohms). Keep trace lengths matched within +/- 10 mils to minimize skew. Use ground planes beneath the memory to provide a return path and reduce EMI.
The FBGA-78 package has a thermal resistance of approximately 20C/W. For high-speed operation, ensure adequate airflow or a heatsink if the ambient temperature exceeds 70C. Monitor the case temperature to stay within the 95C limit.
Compliance Information
RoHS compliance indicated in datasheet. Other compliance data not specified in provided sources.
