K4B4G1646D-BFMA vs K4B4G1646D-BHMA Comparison
Detailed side-by-side comparison of K4B4G1646D-BFMA by Samsung Electronics and K4B4G1646D-BHMA by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | K4B4G1646D-BFMA | K4B4G1646D-BHMA |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Memory Type | DDR3 SDRAM | DDR3L SDRAM |
| Density | 4Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 |
| Data Rate | 1866 Mbps | 1866 Mbps |
| Supply Voltage | 1.5V | 1.35 V (1.283 V to 1.45 V) |
| Package | 96-ball FBGA | 96-ball FBGA |
| Ball Pitch | 0.8mm | — |
| Number of Banks | 8 | — |
| Burst Length | 8 and 4 (with burst chop) | 8 and 4 |
| CAS Latency | Programmable | 13 (at 1866 Mbps) |
| On-Die Termination | Yes | — |
| Temperature Range | 0°C to 95°C (case) | — |
| RoHS | Compliant | — |
| Lead-Free | Yes | Yes |
| Halogen Free | Yes | Yes |
| Operating Temperature | — | -40°C to +95°C (TC) |
| Number of Terminals | — | 96 |
| RoHS Compliant | — | Yes |
| Die Version | — | D-die |
| Refresh Mode | — | Auto and Self Refresh |