K4B4G1646E-BCMA vs K4B4G1646E-BMMA Comparison
Detailed side-by-side comparison of K4B4G1646E-BCMA by Samsung Electronics and K4B4G1646E-BMMA by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646E-BCMA
K4B4G1646E-BCMA - 4Gb DDR3 SDRAM 1066MHz FBGA-96 | Samsung
K4B4G1646E-BCMA β ActiveSamsung Electronics
K4B4G1646E-BMMA
K4B4G1646E-BMMA - 4Gb DDR3L SDRAM 256Mx16 | Samsung
K4B4G1646E-BMMA β ActiveSpecification Comparison
| Parameter | K4B4G1646E-BCMA | K4B4G1646E-BMMA |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.24 | $15.70 |
| Memory Type | DDR3 SDRAM | DDR3L SDRAM |
| Density | 4 Gbit | 4 Gb |
| Organization | 256M x 16 | 256M x 16 |
| Clock / Data Rate | 1066 MHz / 1066 Mbps per data pin | β |
| Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.35 V |
| Operating Temperature | 0C to +95C | -40Β°C to +95Β°C |
| Package | FBGA-96 (7.5 x 13.3 mm) | 96-FBGA (9x13 mm) |
| Operating Supply Current (IDD) | 55 mA | β |
| Standby Current | 2 mA | β |
| Auto Precharge | Yes | β |
| Asynchronous Reset | Yes | β |
| On-Die Termination (ODT) | Dynamic ODT supported | β |
| ZQ Calibration | Yes | Yes |
| Data Mask Function | Yes | β |
| Mounting Type | Surface Mount (BGA) | β |
| RoHS Status | Compliant | β |
| Data Rate | β | 1600 Mbps |
| Number of Banks | β | 8 |
| Interface | β | Parallel |
| Clock Frequency | β | 800 MHz |
| CAS Latency | β | [DATA_NEEDED: CAS Latency] |
| Burst Length | β | 8, 4 (with burst chop) |
| On-Die Termination | β | Yes (Dynamic ODT) |
| RoHS | β | Compliant |
| Lead-Free | β | Yes |