K4B4G1646E-BCMA - 4Gb DDR3 SDRAM 1066MHz FBGA-96 | Samsung
MPN: K4B4G1646E-BCMA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.95 | $3.95 |
| 10 | $3.72 | $37.20 |
| 100 | $3.55 | $355.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.24 | $3,240.00 |
K4B4G1646E-BCMA Overview
DDR3 SDRAM (Double Data Rate Type Three Synchronous Dynamic Random Access Memory) is a JEDEC-standard memory technology that transfers data on both clock edges, doubling bandwidth relative to its clock frequency. Within the memory hierarchy it sits below DDR4/DDR5 generations but remains widely deployed as chip-down main memory next to SoCs and processors with DDR3 memory controllers in embedded and industrial systems.
Key features of the K4B4G1646E-BCMA include an operating temperature range of 0C to +95C, auto precharge function, asynchronous reset function, dynamic on-chip termination (ODT), ZQ calibration for output driver accuracy, and a data mask (DM) function for byte-level write masking. The x16 organization simplifies 16-bit and 32-bit bus designs common in cost-sensitive embedded platforms.
The E-die silicon uses Samsungs mature DDR3 process with a 1.5V core supply and 8n bank architecture supporting burst lengths of 8 (BL8) and on-the-fly addressing. The 96-ball FBGA (fine-pitch ball grid array) package minimizes parasitic inductance, supporting reliable operation at 1066 Mbps data rates with standard fly-by termination topologies on multi-drop or point-to-point buses.
Typical applications include single-board computers, set-top boxes, industrial PCs, networking equipment, smart home gateways, and digital TV platforms, where the 4Gb density and x16 interface match common 16/32-bit embedded memory buses.
When designing with this device, follow the datasheet termination and ZQ calibration guidelines; the ZQ ball requires a precision 240-ohm resistor to ground, and on-die termination settings must be tuned to trace impedance for signal integrity at full data rate.
This page synthesizes distributor pricing from LCSC and Octopart, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing comparative sourcing and engineering value in one place.
Drop-in alternatives for K4B4G1646E-BCMA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with K4B4G1646E-BCMA (same form factor and footprint) — differing in Package, Supply Voltage, Operating Temperature, Data Rate, Memory Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4B4G1646D-BCMA0
✅ Drop-In✓ In Stock
$5.9 / Unit
View Datasheet →K4B4G1646E-BMMA
✅ Drop-In✓ In Stock
$15.7 / Unit
View Datasheet →K4B4G1646E-BYMA
✅ Drop-In✓ In Stock
$14.3182 / Unit
View Datasheet →K4B4G1646E-BYK000
✅ Drop-In✓ In Stock
$0.5619 / Unit
View Datasheet →MT41K256M16HA-125
✅ Drop-In✓ In Stock
$6.3636 / Unit
View Datasheet →K4B4G1646E-BCMA Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3 SDRAM |
| Density | 4 Gbit |
| Organization | 256M x 16 |
| Clock / Data Rate | 1066 MHz / 1066 Mbps per data pin |
| Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) |
| Operating Temperature | 0C to +95C |
| Package | FBGA-96 (7.5 x 13.3 mm) |
| Operating Supply Current (IDD) | 55 mA |
| Standby Current | 2 mA |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| On-Die Termination (ODT) | Dynamic ODT supported |
| ZQ Calibration | Yes |
| Data Mask Function | Yes |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
K4B4G1646E-BCMA fbga-96 (7.5 x 13.3 mm) Pin Configuration Guide
Pin configuration for K4B4G1646E-BCMA (fbga-96 (7.5 x 13.3 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K4B4G1646E-BCMA.
Refer to the datasheet for full pin configuration.
Typical Applications
K4B4G1646E-BCMA is suitable for 6 applications: Single-Board Computers, Networking Equipment, Set-Top Boxes and Smart TV, Industrial PCs and HMI Terminals, Smart Home Gateways and IoT Hubs, Automotive Infotainment (Non-Safety).
Single-Board Computers
The K4B4G1646E-BCMA is a natural fit as chip-down main memory for single-board computers built around SoCs with integrated DDR3 controllers. Its 4Gb density in a single x16 component gives 512 MB of RAM on one chip, and two chips deliver 1 GB on a 32-bit bus. The 1.5V supply and 55 mA operating IDD keep power budgets low for fanless designs, while the FBGA-96 footprint is the de-facto standard accepted by mainstream ARM SoC reference designs. Dynamic ODT and ZQ calibration simplify signal integrity at 1066 Mbps on short point-to-point traces, reducing PCB layer count. Designers should configure the SoC memory controller timing for DDR3-1066 CL7 parameters from the Samsung datasheet.
Recommended
Networking Equipment
Switches, routers, and gateways use DDR3 SDRAM for packet buffering, routing tables, and firmware execution, and the K4B4G1646E-BCMA matches this role with 4Gb capacity and a proven 1066 Mbps interface. The asynchronous reset function allows the host CPU to re-initialize memory deterministically after watchdog events, improving network uptime. The x16 organization suits the 16-bit and 32-bit memory buses typical of communication processors, and auto precharge reduces controller overhead during burst buffer access. Its 0C to +95C range covers indoor telecom and enterprise equipment environments. For signal integrity on multi-inch traces, enable dynamic ODT and follow the datasheet fly-by topology recommendations.
Recommended
Set-Top Boxes and Smart TV
Digital TV and set-top box SoCs commonly pair with 4Gb x16 DDR3, making the K4B4G1646E-BCMA a direct-fit main memory for video decoding buffers and application execution. The 1066 Mbps data rate provides bandwidth sufficient for 1080p decode pipelines in cost-optimized consumer platforms, while the 1.5V operation aligns with consumer power-supply rails. Data mask support enables efficient partial writes for frame buffer updates, and ZQ calibration keeps output drivers accurate across manufacturing corners. The FBGA-96 package footprint is identical across the Samsung K4B4G1646E family, so OEMs can qualify multiple speed grades on one PCB. Consumer ambient temperatures stay well within the 0C to +95C rating.
Recommended
Industrial PCs and HMI Terminals
Industrial PCs, HMI panels, and edge controllers require stable main memory under continuous duty, and the K4B4G1646E-BCMA delivers 4Gb per component with low 2 mA standby current for standby-power-sensitive designs. Where ambient temperatures drop below 0C, the identical-package -BMMA variant extends the range to -40C with no layout change, which is the key selection decision for outdoor or cold-storage installations. The 1066 Mbps interface is conservative for DDR3 controllers, easing signal integrity margin on longer industrial PCB traces, and dynamic ODT compensates for trace impedance variations. The part also supports memory-burn-in screening in production, a common requirement for industrial quality programs.
Recommended
Smart Home Gateways and IoT Hubs
Smart home gateways, Zigbee/Wi-Fi hubs, and IoT edge nodes use 4Gb DDR3 for Linux-class workloads, and the K4B4G1646E-BCMA fits with a single 512 MB chip on a 16-bit bus - minimizing BOM count versus two x8 parts. Its 55 mA operating IDD supports always-on operation, and the 2 mA standby current matters for nodes with deep-sleep duty cycles. The FBGA-96 (7.5 x 13.3 mm) package suits compact gateway PCBs, and 1066 Mbps timing relaxes layout constraints on two-layer-core consumer boards. Auto precharge and data mask reduce controller firmware complexity in cost-optimized SoC families commonly used in this segment. The part is RoHS compliant for global consumer markets.
Recommended
Automotive Infotainment (Non-Safety)
Aftermarket and entry-level automotive infotainment and telematics platforms frequently adopt commercial DDR3, and the K4B4G1646E-BCMA serves as main memory where cabin temperature ranges fall within its 0C to +95C rating. The 4Gb x16 single-chip organization provides 512 MB for map data, media buffering, and OS execution with one component. Note this part is not AEC-Q100 qualified; for harsher under-dash environments with extended temperature requirements, the -BMMA industrial variant or an automotive-qualified DRAM should be evaluated. The dynamic ODT and asynchronous reset features support robust operation in electrically noisy 12V vehicle environments where power cycles and resets are frequent.
Recommended
Recommended Products Summary
Engineering reference data for K4B4G1646E-BCMA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4B4G1646D-BCMA | K4B4G1646E-BMMA | K4B4G1646E-BYK000 | MT41K256M16HA-125 |
|---|---|---|---|---|---|
| Package | FBGA-96 (7.5 x 13.3 mm) | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics | Micron Technology |
| Density / Organization | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 | 4 Gbit / 256M x 16 |
| Data Rate | 1066 Mbps | 1066 Mbps | 1066 Mbps | 1600 Mbps class | 1066 Mbps class (-125) |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Cost-optimized 1066 Mbps speed grade (vs K4B4G1646E-BYK000)
- Extended industrial temperature option in same footprint (vs K4B4G1646E-BMMA)
- Samsung direct die versus cross-brand second source (vs MT41K256M16HA-125)
Design Notes
At 1066 Mbps, the K4B4G1646E-BCMA is tolerant of moderate trace lengths, but signal integrity still depends on disciplined DDR3 layout: route DQ/DQS/DM as length-matched groups (DQS to its DQ byte within +/-10 mils), use the fly-by topology for address/command with appropriate ODT settings, and reference all high-speed layers to solid ground planes. Enable dynamic ODT during writes and calibrate output drive via the ZQ ball with a precision 240-ohm, 1% resistor to ground placed within a few millimeters of the ball.
Plan separate VDD (1.5V core) and VDDQ (1.5V I/O) rails filtered with bulk capacitance (e.g., 2x22uF) plus per-ball 0.1uF ceramic decoupling placed on the BGA via fanout. Estimated: at 55 mA operating IDD per device, rail noise stays manageable, but during simultaneous burst activity transient currents peak several times higher, so power-plane integrity (low PDN impedance) matters more than average current. Keep VTT termination rail (VDDQ/2) sourced from a dedicated LDO or sinking-capable regulator per standard DDR3 power tree practice.
Two frequent mistakes with this family: (1) mixing speed-grade suffixes without retiming the controller - a -BCMA (1066 Mbps) boots fine with -BYK0 (1600 Mbps) timing only if the controller runs at the slower grade, but not vice versa; (2) ignoring the RESET# ball - DDR3 requires the asynchronous reset function to be driven correctly at power-up with init sequence delays per the Samsung datasheet, otherwise ZQ calibration and mode register programming fail intermittently. Confirm temperature suffix (-BCMA 0-95C vs -BMMA -40-95C) matches the enclosure thermal profile.
Compliance Information
RoHS compliant and lead-free per LCSC and JLCPCB product listings for part C500277. Not an automotive AEC-Q100 part. REACH and halogen-free status not stated in provided data.
