K4B4G1646E-BCNB vs H5TQ4G63AFR-H9C Comparison

Detailed side-by-side comparison of K4B4G1646E-BCNB by Samsung Electronics and H5TQ4G63AFR-H9C by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Samsung Electronics
K4B4G1646E-BCNB K4B4G1646E-BCNB - 4Gb DDR3 SDRAM, 256Mx16, 1.35V | Samsung

K4B4G1646E-BCNB - 4Gb DDR3 SDRAM, 256Mx16, 1.35V | Samsung

K4B4G1646E-BCNB βœ“ Active
SK hynix
H5TQ4G63AFR-H9C H5TQ4G63AFR-H9C - 4Gb DDR3 SDRAM 256Mx16 | SK Hynix

H5TQ4G63AFR-H9C - 4Gb DDR3 SDRAM 256Mx16 | SK Hynix

H5TQ4G63AFR-H9C βœ“ Active

Specification Comparison

Parameter K4B4G1646E-BCNB H5TQ4G63AFR-H9C
Brand Samsung Electronics SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $13.52 $6.50
Memory Type DDR3 SDRAM DDR3 SDRAM
Memory Size 4 Gb β€”
Organization 256M x 16 256M x 16
Supply Voltage 1.35 V (1.283 V to 1.45 V) 1.5 V
Data Rate 1866 Mbps 3.9 Gbps per pin (approx)
CAS Latency [DATA_NEEDED: CAS Latency] β€”
Operating Temperature 0C to +95C β€”
Package 96-ball FBGA 96-ball TFBGA
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant β€”
Number of Pins 96 β€”
Interface Type Parallel β€”
Refresh 8K / 64 ms β€”
Burst Length 8, 4 (fixed) β€”
Write Recovery Time [DATA_NEEDED: tWR] β€”
Row Cycle Time [DATA_NEEDED: tRC] β€”
Row Address Strobe to Column Address Strobe Delay [DATA_NEEDED: tRCD] β€”
Row Precharge Time [DATA_NEEDED: tRP] β€”
Active to Precharge Time [DATA_NEEDED: tRAS] β€”
Density β€” 4 Gb
Clock Speed (tCK) β€” 0.255 ns
Package Shape β€” RECTANGULAR
Refresh Cycles β€” 8192
Number of Terminals β€” 96
Temperature Grade β€” OTHER
RoHS β€” Compliant
Halogen Free β€” Yes
Ball Pitch β€” 0.8 mm

Datasheets & Resources

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