K9HUGY8J5B-BCK0 vs K9HQGY8S5M Comparison
Detailed side-by-side comparison of K9HUGY8J5B-BCK0 by Samsung Electronics and K9HQGY8S5M by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K9HUGY8J5B-BCK0 - Samsung V-NAND Flash Memory | Samsung
K9HUGY8J5B-BCK0 ✓ ActiveSamsung Electronics
K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage
K9HQGY8S5M ✓ ActiveSpecification Comparison
| Parameter | K9HUGY8J5B-BCK0 | K9HQGY8S5M |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Product Family | K9HUG (V-NAND flash) | — |
| Memory Type | NAND Flash (3D V-NAND) | — |
| Density | [DATA_NEEDED: device density] | [DATA_NEEDED: total bit density] |
| Cell Type | [DATA_NEEDED: SLC/MLC/TLC/QLC] | — |
| Organization | [DATA_NEEDED: page/block organization] | — |
| Bus Width | [DATA_NEEDED: x8 or x16] | — |
| Supply Voltage (VCC) | [DATA_NEEDED: VCC range] | — |
| Supply Voltage (VCCQ) | [DATA_NEEDED: VCCQ range] | — |
| Interface | [DATA_NEEDED: asynchronous/toggle DDR] | NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode] |
| Page Program Time | [DATA_NEEDED: tPROG] | — |
| Page Read Time | [DATA_NEEDED: tR] | — |
| Block Erase Time | [DATA_NEEDED: tBERS] | — |
| Endurance | [DATA_NEEDED: P/E cycles] | — |
| Package | [DATA_NEEDED: package code, e.g. FBGA] | — |
| Operating Temperature | [DATA_NEEDED: temperature range] | [DATA_NEEDED: operating temperature range] |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Product Type | — | 3D V-NAND Flash Memory (stacked, client NAND) |
| Package Type | — | 316-ball Fine Pitch BGA (FBGA-316) |
| Die Configuration | — | 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis) |
| NAND Technology | — | 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis) |
| Memory Class | — | Non-volatile NAND flash |
| Supply Voltage | — | [DATA_NEEDED: VCC range] |
| Page Size | — | [DATA_NEEDED: page size] |
| Block Size | — | [DATA_NEEDED: block size] |
| Program/Erase Cycles | — | [DATA_NEEDED: P/E endurance rating] |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |
| Original Application | — | Samsung SSD 850 Pro solid-state drive |