K9HQGY8S5M - 3D V-NAND Flash, FBGA-316 | Samsung | SSD Storage
MPN: K9HQGY8S5M ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for K9HQGY8S5M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K9LPGY8S1M
✅ Drop-In📋 Reference alternative (not in catalog)
K9PRGY8S7M
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →K9HQGY8S5M Maximum Ratings & Electrical Characteristics
| Manufacturer | Samsung Electronics |
| Product Type | 3D V-NAND Flash Memory (stacked, client NAND) |
| Package Type | 316-ball Fine Pitch BGA (FBGA-316) |
| Die Configuration | 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis) |
| NAND Technology | 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis) |
| Memory Class | Non-volatile NAND flash |
| Mounting Type | Surface Mount (BGA) |
| Original Application | Samsung SSD 850 Pro solid-state drive |
K9HQGY8S5M 316-ball fine pitch bga (fbga-316) Pin Configuration Guide
Complete pinout information for K9HQGY8S5M (316-ball fine pitch bga (fbga-316) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K9HQGY8S5M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K9HQGY8S5M is suitable for 6 applications: Samsung SSD 850 Pro Storage, NAND Package Analysis and Reverse Engineering, Board-Level SSD Repair Services, Data Recovery and Chip-Off Forensics, Embedded Storage Prototyping, Enterprise Storage Long-Tail Maintenance.
Samsung SSD 850 Pro Storage
The K9HQGY8S5M is the original NAND component of the Samsung SSD 850 Pro 256 GB, paired with the Samsung MEX (S4LN045X01) SATA 6 Gbps controller and external DRAM cache. Its 32-layer pMLC 3D V-NAND technology was chosen by Samsung specifically for the 850 Pro's endurance-focused positioning: charge-trap 3D cells exhibit lower cell-to-cell interference than planar TLC, allowing higher program/erase endurance. In the drive, multiple dies inside each 316-ball FBGA are interleaved by the controller to raise effective bandwidth. Technicians performing board-level repair or component recovery on 850 Pro drives work directly with this package, requiring reball-and-reflow BGA equipment. Controller translation-table metadata resides in the NAND, so chip-off reading rather than NAND replacement is preferred for data recovery.
Recommended
NAND Package Analysis and Reverse Engineering
The K9HQGY8S5M serves as a reference device for package-analysis studies of early 3D NAND stacking. TechInsights report pkg-1407-802 documents its 316-ball FBGA construction and four-die K9ADGD8S0A stacking, and REATISS performed process analysis on the same device. Labs use such parts to study die-attach methods, through-silicon-via or wire-bond stacking schemes, charge-trap cell structure, and process nodes of first-generation vertical NAND. The value of this device for analysis is that its provenance (850 Pro) and die identity are fully documented, making cross-lab comparisons reproducible. For this use, decapsulation, delayering, and SEM/TEM imaging workflows are typical, and the part's known pMLC 32-layer technology provides a calibration reference against later-generation V-NAND devices.
Recommended
Board-Level SSD Repair Services
Independent repair shops use the K9HQGY8S5M to replace failed NAND packages on Samsung 850 Pro PCBs. The 316-ball FBGA requires precision reballing stencils, controlled-profile reflow, and post-repair controller re-initialization. Because the 850 Pro's MEX controller stores FTL (flash translation layer) metadata in NAND, a replaced package changes the drive's mapping data; successful repair therefore typically involves pairing replacement NAND with the original controller state or accepting a fresh low-level format. Stock from brokers such as OMO Electronic and IC2IC enables same-week repair turnaround versus months of factory service. Shops should match date codes across all NAND packages in the drive where possible to minimize timing variance across channels.
Recommended
Data Recovery and Chip-Off Forensics
Forensic and data-recovery labs remove the K9HQGY8S5M from 850 Pro drives via hot-air or infrared BGA rework, then read the four internal K9ADGD8S0A dies on dedicated NAND readers. Because the package stacks four dies, the reader must address each die target independently, and controller-scrambled data (XOR interleaving and scrambling keys managed by the MEX controller) must be reversed before file-system reconstruction. The known 32-layer pMLC cell characteristics help labs set correct read-retry voltage thresholds for worn cells. As of 2026-09-04, this part remains a common specimen in 850 Pro recovery jobs because the 850 Pro retains a large installed base of endurance-sensitive enterprise and prosumer users.
Recommended
Embedded Storage Prototyping
Universities and storage-controller startups use recovered K9HQGY8S5M packages to prototype NAND controller firmware against real first-generation 3D V-NAND silicon. Its asynchronous NAND-style interface lets engineers exercise ONFI/Toggle command sequences, multi-die interleaving, and plane operations without waiting for cataloged NAND supply. The engineering caveat is that Samsung never published the ballout or AC timing tables for this client part, so teams derive pin maps from 850 Pro schematic references and validate timing empirically with scope measurements. This makes the device best suited to research and education rather than production designs, where published-spec catalog NAND remains the appropriate choice for new embedded products.
Recommended
Enterprise Storage Long-Tail Maintenance
Organizations maintaining fleets of Samsung 850 Pro-based storage maintain small K9HQGY8S5M inventories as spares for solder-down repair of out-of-warranty drives. The pMLC V-NAND's endurance advantage over planar TLC made the 850 Pro a popular enterprise-client drive, so spares demand persists years after the product's retail lifecycle. Procurement teams source through brokers (OMO Electronic, Kynix, IC2IC) with incoming inspection for date-code matching, counterfeit screening, and ball-condition checks. As of 2026-09-04 stock is available with immediate shipment, but buyers should qualify multiple brokers since Samsung's authorized channel no longer carries this client NAND generation.
Recommended
Recommended Products Summary
Engineering reference data for K9HQGY8S5M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9LPGY8S1M | K9PRGY8S7M |
|---|---|---|---|
| Package | FBGA-316 (316-ball fine-pitch BGA) | FBGA-316 class (same V-NAND family) | FBGA (V-NAND, outline [DATA_NEEDED]) |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| NAND Technology | 32-layer pMLC 3D V-NAND | 3D V-NAND (same first generation) | Later-generation 3D V-NAND |
| Die Configuration | 4 x K9ADGD8S0A dies | [DATA_NEEDED] | [DATA_NEEDED] |
| Original Platform | Samsung SSD 850 Pro | Samsung SSD 850 Pro platform | Current V-NAND product line |
| Public Datasheet | No (client NAND; TechInsights report only) | No public datasheet | [DATA_NEEDED] |
| Availability Channel | Independent brokers (in stock, as of 2026-09-04) | Independent brokers / teardown sources | XAIPART product page available |
| Unit Price (qty 1) | Quote-based (as of 2026-09-04) | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- First-generation 32-layer pMLC 3D V-NAND with documented provenance (vs K9LPGY8S1M)
- Endurance-oriented pMLC cell technology (vs K9PRGY8S7M)
- Exact-fit repair part for Samsung 850 Pro (vs K9LPGY8S1M)
Design Notes
Do not treat the K9HQGY8S5M as a cataloged standard-product NAND: Samsung publishes no ballout, AC timing, or density documentation for this client part. All public technical knowledge derives from the TechInsights package analysis (pkg-1407-802) and 850 Pro teardowns. Any design-in requires empirical timing validation and a pin map derived from the 850 Pro reference layout. Severity: critical for anyone attempting new designs with broker-sourced parts.
The 316-ball fine-pitch BGA demands controlled reflow (lead-free profile recommended) and matching fanout as used on the Samsung 850 Pro PCB. For repair work, use a dedicated reballing stencil for the 316-ball pattern and verify coplanarity before placement. Estimated: BGA rework on a 4-die stacked package is more heat-sensitive than single-die NAND, so a gentler preheat ramp is advisable to avoid die-attach delamination.
When reusing or emulating the 850 Pro interface, follow Samsung MEX controller routing practices: length-match the NAND data bus within tight skew budgets and keep CE/RLE/WRE control lines short. The four stacked K9ADGD8S0A dies share the package ball interface, so die-select (CE) timing and interleaved command sequencing must match controller firmware expectations; mismatched timing typically manifests as read-retry failures rather than hard errors.
Compliance Information
No compliance documentation was found in the provided verified web data for this client NAND component. Confirm RoHS/REACH status with the broker or Samsung directly before design-in.
