LFE5UM-85F-8BG554C vs LFE5UM-85F-6BG554C Comparison
Detailed side-by-side comparison of LFE5UM-85F-8BG554C by Lattice Semiconductor and LFE5UM-85F-6BG554C by Lattice Semiconductor. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Lattice Semiconductor
LFE5UM-85F-8BG554C - ECP5 FPGA 84K LUTs SERDES 554-BGA | Lattice
LFE5UM-85F-8BG554C ✓ ActiveLattice Semiconductor
LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
LFE5UM-85F-6BG554C ✓ ActiveSpecification Comparison
| Parameter | LFE5UM-85F-8BG554C | LFE5UM-85F-6BG554C |
|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $142.00 | $13.10 |
| Family | LatticeECP5 | ECP5-5G (LFE5UM) |
| Series | LFE5UM | — |
| Logic Elements / Cells | 84000 | — |
| Number of LUTs | 83600 (83.6K) | — |
| Embedded Memory (EBR) | 3833856 bits (3.83 Mbit, 208 blocks) | — |
| Distributed RAM | [DATA_NEEDED: distributed RAM in Kbits] | [DATA_NEEDED: distributed RAM Kbits] |
| Number of I/O | 259 | — |
| Supply Voltage - Core | 1.1 V | — |
| Supply Voltage - I/O Banks | 1.2 V to 3.3 V | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Package / Case | 554-FBGA / cABGA-554 | — |
| Operating Temperature | 0C to +85C (Commercial) | — |
| Number of Multipliers (18x18) | 156 | — |
| SERDES Channels | Yes, integrated | 12 |
| SERDES Data Rate | Up to 3.2 Gbps | — |
| Process Technology | 40 nm CMOS | — |
| MSL Level | 3 | [DATA_NEEDED: MSL rating] |
| RoHS Status | Compliant | Compliant |
| Logic Elements (LUT4) | — | 84000 |
| Embedded Block RAM | — | 3744 Kbits |
| DSP Slices (18x18 multipliers) | — | 156 |
| User I/O | — | 259 |
| SERDES Data Rate (max) | — | 5 Gbps |
| Core Voltage | — | 1.1 V |
| Process Node | — | 40 nm |
| Speed Grade | — | -6 |
| Package | — | 554-ball caBGA (BG554) |
| Package Body Size | — | 23 x 23 mm |
| Operating Temperature Grade | — | Commercial (C) |
| Configuration Memory | — | SRAM-based (volatile, requires external boot) |