LFE5UM-85F-6BG554C - ECP5-5G FPGA, 84K LUTs, 12 SERDES | Lattice
MPN: LFE5UM-85F-6BG554C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.25 | $18.25 |
| 10 | $16.42 | $164.20 |
| 100 | $14.78 | $1,478.00 |
| 500 | $13.95 | $6,975.00 |
| 1,000 | $13.1 | $13,100.00 |
LFE5UM-85F-6BG554C Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O resources that engineers configure after manufacturing to implement custom digital circuits. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as one of the three principal programmable-logic device categories. The ECP5/ECP5-5G family is specifically optimized for low-power, small-form-factor applications such as mobile, IoT, and serial connectivity bridging, where traditional high-power FPGAs would be unsuitable.
Key features of the LFE5UM-85F-6BG554C include 84,000 4-input LUTs, 156 18x18 multipliers for DSP operations, 259 user I/O pins, and SERDES channels rated up to 5 Gbps for protocols such as PCIe Gen 2, 10Gb Ethernet MAC, CPRI, and SLVS-EC. The device operates from a 1.1V core supply with auxiliary voltages for I/O banks. The -6 speed grade provides a balance of performance and power for most cost-sensitive applications.
Architecturally, the ECP5-5G combines a fabric of LUTs, distributed RAM, block RAM, DSP slices, and SERDES, with Lattice's proprietary routing and configuration logic. The 40nm process node enables lower static power than older 65nm FPGAs while maintaining high DSP throughput. Hardened SERDES IP eliminates the need for external transceivers in typical designs.
Typical applications include 5G small-cell baseband processing, PCIe Gen 2 endpoint cards, industrial machine vision cameras, IoT edge gateways with on-device acceleration, low-cost video bridging, and serial protocol conversion. The wide SERDES protocol support makes the part particularly attractive for cost-sensitive designs that need high-speed connectivity without paying for a larger FPGA.
When designing with this part, ensure proper decoupling on all supply rails and follow Lattice's PCB layout guidelines for SERDES channels (controlled-impedance routing, length matching, and AC coupling capacitors). Lattice Diamond software is required for synthesis, place-and-route, and bitstream generation; the Radiant toolchain supports newer ECP5-5G designs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for LFE5UM-85F-6BG554C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LFE5UM-85F-6BG554C (same form factor and footprint) — differing in SERDES Channels, Family, Mounting Type, Embedded Block RAM, MSL Level.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LFE5UM-85F-8BG554C
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →LFE5UM-85F-6BG554I
✅ Drop-In📋 Reference alternative (not in catalog)
LFE5UM-45F-6BG554C
✅ Drop-In✓ In Stock
$115.1 / Unit
View Datasheet →LFE5U-85F-6BG554C
✅ Drop-In📋 Reference alternative (not in catalog)
LFE5UM-85F-7BG554C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LFE5UM-85F-6BG256C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LFE5UM-85F-6BG554C Maximum Ratings & Electrical Characteristics
| Family | ECP5-5G (LFE5UM) |
| Logic Elements (LUT4) | 84000 |
| Embedded Block RAM | 3744 Kbits |
| DSP Slices (18x18 multipliers) | 156 |
| User I/O | 259 |
| SERDES Channels | 12 |
| SERDES Data Rate (max) | 5 Gbps |
| Core Voltage | 1.1 V |
| Process Node | 40 nm |
| Speed Grade | -6 |
| Package | 554-ball caBGA (BG554) |
| Package Body Size | 23 x 23 mm |
| Operating Temperature Grade | Commercial (C) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external boot) |
LFE5UM-85F-6BG554C 23 x 23 mm Pin Configuration Guide
Pin configuration for LFE5UM-85F-6BG554C (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LFE5UM-85F-6BG554C.
Refer to the datasheet for full pin configuration.
Typical Applications
LFE5UM-85F-6BG554C is suitable for 6 applications: 5G Small-Cell Baseband Processing, Industrial Machine Vision Cameras, PCIe Gen 2 Endpoint Cards, IoT Edge Gateways with On-Device Acceleration, Video Protocol Bridging and Conversion, Low-Cost Serial Connectivity Bridges.
5G Small-Cell Baseband Processing
The LFE5UM-85F-6BG554C is well-suited for 5G small-cell baseband processing where its 12 SERDES channels at 5 Gbps natively support CPRI and eCPRI fronthaul protocols, eliminating external PHY chips. The 84,000 LUTs and 156 DSP slices handle PHY-layer signal processing, channel coding, and FFT operations typical of small-cell baseband. The 40nm process node keeps static power below 1W typical, critical for dense small-cell deployments. Designers typically place this part between the RF front-end and the host processor, using SERDES for fronthaul and GPIO for JTAG/UART management.
Recommended
Industrial Machine Vision Cameras
For industrial machine vision cameras, the LFE5UM-85F-6BG554C provides the DSP throughput (156 18x18 multipliers) needed for real-time image preprocessing, Bayer demosaicing, and edge detection. Its 3,744 Kbits of block RAM accommodates line buffers for HD sensor streams, while 259 user I/O support parallel LVDS sensor interfaces. The commercial temperature grade is sufficient for factory-floor environments; for harsher deployments use the LFE5UM-85F-6BG554I industrial variant. The low power profile (under 1.5W typical) enables fanless compact camera designs.
Recommended
PCIe Gen 2 Endpoint Cards
The LFE5UM-85F-6BG554C's hard PCIe Gen 2 endpoint block (via SERDES) makes it an efficient choice for low-cost PCIe endpoint cards such as data acquisition, test instrumentation, and FPGA accelerator daughtercards. With 84K LUTs available, designers can implement custom DMA engines, protocol converters, or signal processing pipelines. Power consumption below 1.5W allows passive cooling in small form-factor cards (low-profile, M.2). Reference designs from Lattice show typical PCIe Gen 2 x1 implementations consuming under 20% of available LUTs.
Recommended
IoT Edge Gateways with On-Device Acceleration
IoT edge gateways benefit from the LFE5UM-85F-6BG554C's balance of logic capacity and low power for on-device inference, sensor fusion, and protocol bridging. The SERDES channels support industrial Ethernet (EtherCAT, PROFINET) and high-speed serial sensor interfaces, while the DSP slices accelerate lightweight ML models. The caBGA package (23x23 mm) fits compact gateway enclosures. Designers typically use the FPGA to pre-process sensor data before forwarding to a host MCU or SoC over SPI or PCIe.
Recommended
Video Protocol Bridging and Conversion
For video protocol bridging (MIPI CSI-2 to LVDS, HDMI to MIPI, etc.), the LFE5UM-85F-6BG554C's 12 SERDES channels and high user I/O count provide the parallel and serial bandwidth needed for multi-stream conversions. Block RAM (3,744 Kbits) accommodates line buffers for 4K@30 conversions. The Lattice soft IP library includes pre-built MIPI D-PHY/CSI-2, HDMI, and DisplayPort bridges that run efficiently on this device. Low power enables fanless operation in compact video adapters.
Recommended
Low-Cost Serial Connectivity Bridges
The LFE5UM-85F-6BG554C is an efficient solution for multi-protocol serial bridges (USB 3.0 to SATA, PCIe to UART, I2C to SPI), using its SERDES for high-speed lanes and abundant GPIO for legacy interfaces. The 84K LUTs support protocol stacks and DMA controllers, while low power simplifies thermal design in compact dongle-style products. Reference designs from Lattice and partners shorten development time for common bridging topologies.
Recommended
Recommended Products Summary
Engineering reference data for LFE5UM-85F-6BG554C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LFE5UM-85F-8BG554C | LFE5UM-85F-6BG554I | LFE5UM-45F-6BG554C | LFE5U-85F-6BG554C |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 554-ball caBGA (BG554) | 554-ball caBGA (BG554) - same | 554-ball caBGA (BG554) - same | 554-ball caBGA (BG554) - same | 554-ball caBGA (BG554) - same |
| Logic Elements (LUT4) | 84000 | 84000 | 84000 | 44000 | 84000 |
| SERDES Channels | 12 | 12 | 12 | 12 | 0 (no SERDES) |
| User I/O | 259 | 259 | 259 | 259 | 259 |
| Block RAM (Kbits) | 3744 | 3744 | 3744 | 1944 | 3744 |
| DSP Slices (18x18) | 156 | 156 | 156 | 84 | 156 |
| Speed Grade | -6 | -8 | -6 | -6 | -6 |
| Temperature Grade | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) | Commercial (C) |
Key Differentiators
- 12 integrated SERDES channels at 5 Gbps (vs LFE5U-85F-6BG554C)
- Higher LUT density (84K) in same BG554 package (vs LFE5UM-45F-6BG554C)
- 40nm process node for ultra-low static power (vs Cyclone IV (Altera/Intel))
Design Notes
The 554-ball caBGA package (23x23 mm, 1.0 mm pitch) requires HDI PCB construction with microvias and laser-drilled blind/buried vias. Use 8 or more PCB layers with dedicated ground and power planes. Follow Lattice's TN1098 PCB layout guide for SERDES routing: 100 ohm differential impedance, length-matched pairs within 5 mils, and AC-coupling capacitors within 1 inch of the receiver. Decoupling requires 100nF and 10uF capacitors on every supply pin.
Estimated: The LFE5UM-85F-6BG554C core draws approximately 0.5-1.5W typical depending on utilization and SERDES activity. Use a 1.1V LDO or DC-DC regulator with at least 3A peak capability to handle inrush during configuration. Power-on sequencing requires VCC core before VCCIO and VCCAUX; violation can cause latch-up or configuration failure. The Diamond/Radiant software includes a power estimator that should be run during design to size rails correctly.
The BG554 caBGA package has a typical theta-JA of approximately 15-20 C/W with proper PCB thermal via array under the package. For continuous 1.5W+ operation, include a thermal via farm (0.3mm pitch, 0.2mm drill) connecting the BGA ground balls to inner ground planes. At 85C ambient, junction temperature stays well below the 125C commercial limit. For industrial-grade deployments using LFE5UM-85F-6BG554I, verify thermal performance at 100C ambient.
Common pitfalls when designing with the LFE5UM-85F-6BG554C include: (1) omitting SPI flash for bitstream storage - the SRAM-based fabric is volatile and must be reconfigured at power-up; (2) mixing SERDES protocols that are not compatible in the same quad - check the ECP5-5G datasheet SERDES protocol matrix; (3) forgetting Dual-Boot or Multi-Boot image configuration for fail-safe updates; (4) using JTAG pins as regular I/O without disabling the JTAG port in software. Always run Diamond/Radiant bitstream generation with the correct device and package combination selected.
Compliance Information
RoHS and REACH compliance per Lattice product declarations. Not AEC-Q100 qualified (FPGAs typically not automotive-qualified). Halogen-free status not explicitly listed in verified data; set to unknown per Data Authenticity Rules.
