LPC55S28JBD64K vs LPC55S26JBD64K Comparison
Detailed side-by-side comparison of LPC55S28JBD64K by NXP Semiconductors and LPC55S26JBD64K by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | LPC55S28JBD64K | LPC55S26JBD64K |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.60 | $3.89 |
| Core Processor | ARM Cortex-M33 (Armv8-M mainline) | ARM Cortex-M33 |
| Core Size | 32-bit | 32-Bit |
| Maximum Clock Frequency | 150 MHz | 150 MHz |
| Flash Memory | 512 KB | — |
| SRAM | 104 KB | — |
| Supply Voltage | 3.3 V (1.8 V to 3.6 V range) | [DATA_NEEDED: supply voltage range] |
| Security Features | TrustZone, secure boot (S variant) | ARM TrustZone (secure LPC55S2x variant) |
| Peripherals | Flexcomm serial interfaces, USB full-speed device, dual 12-bit ADC, timers/PWM, DMA | [DATA_NEEDED: peripheral list] |
| Connectivity | UART, SPI, I2C, I2S via Flexcomm | — |
| Number of I/O | [DATA_NEEDED: Number of GPIO pins] | [DATA_NEEDED: GPIO count] |
| Operating Temperature | [DATA_NEEDED: Operating temperature range] | -40C to +105C (TA) |
| Package | 64-HTQFP (10x10 mm) with exposed pad | 64-HTQFP (10 x 10 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Process Technology | 40-nm NVM | — |
| Product Family | LPC55S2x (LPC5500 Series, EdgeVerse platform) | — |
| Program Memory Type | FLASH | — |
| Data Converters | Dual 12-bit ADC | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Flash Memory Size | — | 256 KB (256K x 8) |
| RAM Size | — | 144 KB (144K x 8) |
| Memory Protection Unit | — | Yes (MPU) |
| Interrupt Controller | — | NVIC with NMI input (selectable sources) |
| Packaging | — | Tray |
| Series | — | LPC55S2x (EdgeVerse platform) |