M1AFS1500-1FGG676I vs M1AFS1500-1FGG676 Comparison

Detailed side-by-side comparison of M1AFS1500-1FGG676I by Microchip Technology and M1AFS1500-1FGG676 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS1500-1FGG676I M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip

M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip

M1AFS1500-1FGG676I ✓ Active
Microchip Technology
M1AFS1500-1FGG676 M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip

M1AFS1500-1FGG676 - Fusion FPGA 1.5M Gates 676-FBGA | Microchip

M1AFS1500-1FGG676 ✓ Active

Specification Comparison

Parameter M1AFS1500-1FGG676I M1AFS1500-1FGG676
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $0.00
Family Fusion (Mixed-Signal FPGA) —
System Gates 1.5 M gates —
Logic Resources 276480 bits —
User I/O 252 —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm flash-based —
Configuration Memory Flash (non-volatile, instant-on) Flash (non-volatile, live at power-up)
Speed Grade -1 -1
Package 676-pin FBGA (FGG676) —
Operating Temperature -40C to +85C (industrial) —
Mounting Type Surface Mount —
Analog Peripherals Integrated configurable analog blocks (voltage, current, temperature monitoring) —
Embedded Flash Memory Large flash memory blocks integrated —
Clock Management Integrated clock generation and management circuitry —
On-Chip Frequency Characterization 1282.05 MHz (datasheet family metric) —
Packaging Tray Tray
RoHS Status [DATA_NEEDED: RoHS status] unknown
MSL Level [DATA_NEEDED: moisture sensitivity level] —
Manufacturer Part Number — M1AFS1500-1FGG676
Series — M1AFS1500 (Fusion)
Number of Equivalent Gates — 1,500,000 gates
Number of Logic Cells — 38,400
Maximum Clock Frequency — 350 MHz
Number of I/O — 252 I/O
Technology — 130 nm CMOS flash-based
Package / Case — FBGA-676 (676-ball BGA, 1.00 mm ball pitch)
Mounting Style — SMD/SMT
Minimum Operating Temperature — 0 C
Maximum Operating Temperature — +70 C
Analog Integration — Configurable analog blocks (mixed-signal Fusion architecture)

Datasheets & Resources

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