M1AFS250-2PQG208 vs A3PE3000-PQG208X3 Comparison
Detailed side-by-side comparison of M1AFS250-2PQG208 by Microsemi and A3PE3000-PQG208X3 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microsemi
M1AFS250-2PQG208 - 250K Gate Fusion Mixed-Signal FPGA | Microsemi
M1AFS250-2PQG208 ✓ ActiveMicrochip Technology
A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip
A3PE3000-PQG208X3 ✓ ActiveSpecification Comparison
| Parameter | M1AFS250-2PQG208 | A3PE3000-PQG208X3 |
|---|---|---|
| Brand | Microsemi | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $205.00 | $128.00 |
| Logic Cells | 6144 | — |
| System Gates | 250,000 | 3,000,000 (3M) |
| RAM Bits | 36864 | — |
| Number of I/O | 93 | — |
| Supply Voltage | 1.425 V to 1.575 V | — |
| Speed Grade | -2 | — |
| Technology | 130 nm CMOS, flash-based | — |
| Family | Fusion (M1) Mixed-Signal FPGA | ProASIC3E Flash FPGA |
| Package | 208-BFQFP (208-PQFP) | 208-pin BFQFP (PQG208), 0.5 mm pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Junction Temperature Range | 0C to +85C | — |
| Programming Type | In-System Programmable (flash-based, non-volatile) | — |
| Analog Blocks | Yes (configurable analog mixed-signal peripherals) | — |
| Clock Management | On-chip clock generation and management circuitry | — |
| RoHS Status | Compliant (G = RoHS/green suffix) | [DATA_NEEDED: RoHS status] |
| Operating Temperature Ambient | [DATA_NEEDED: ambient operating temperature range] | — |
| Max Operating Frequency | [DATA_NEEDED: maximum system frequency] | — |
| Thermal Resistance theta-JA | [DATA_NEEDED: thermal resistance] | — |
| Maximum System Frequency | — | 231 MHz |
| Process Technology | — | 130 nm flash |
| Core Supply Voltage | — | 1.5 V |
| Number of I/Os (PQG208) | — | 147 |
| Total Memory Bits | — | 516096 |
| Configuration Technology | — | Nonvolatile Flash (Instant-On, single-chip) |
| Packing Option | — | Tape and Reel (X3 suffix) |
| Soft ARM Support | — | Optional (per family datasheet) |
| Reprogrammability | — | Yes (in-system reprogrammable) |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| I/O Bank Voltage Support | — | [DATA_NEEDED: supported I/O standards/voltages] |
| Applications Markets | — | Consumer, networking/communications, computing, avionics |