A3PE3000-PQG208X3 - 3M-Gate Flash FPGA, 231MHz | Microchip
MPN: A3PE3000-PQG208X3 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172 | $1,720.00 |
| 100 | $155 | $15,500.00 |
| 500 | $140 | $70,000.00 |
| 1,000 | $128 | $128,000.00 |
Drop-in alternatives for A3PE3000-PQG208X3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000L-1PQG208
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View Datasheet →A3PE3000L-PQ208I
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View Datasheet →A3PE1500-1PQG208
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View Datasheet →A3PE1500-2PQG208
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$48 / Unit
View Datasheet →M1AFS250-PQG208I
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$54.8 / Unit
View Datasheet →M1AFS250-2PQG208
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View Datasheet →A3PE3000-PQG208X3 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 (3M) |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of I/Os (PQG208) | 147 |
| Total Memory Bits | 516096 |
| Configuration Technology | Nonvolatile Flash (Instant-On, single-chip) |
| Package | 208-pin BFQFP (PQG208), 0.5 mm pitch |
| Mounting Type | Surface Mount |
| Packing Option | Tape and Reel (X3 suffix) |
| Soft ARM Support | Optional (per family datasheet) |
| Reprogrammability | Yes (in-system reprogrammable) |
| Applications Markets | Consumer, networking/communications, computing, avionics |
A3PE3000-PQG208X3 208-pin bfqfp (pqg208), 0.5 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000-PQG208X3 (208-pin bfqfp (pqg208), 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-PQG208X3.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-PQG208X3 is suitable for 6 applications: Industrial Control and Automation, Networking and Communications Equipment, Avionics and Aerospace Systems, ASIC Prototyping and Low-Volume ASIC Replacement, Consumer Electronics, Computing Platforms and Embedded Processing.
Industrial Control and Automation
The A3PE3000-PQG208X3 fits industrial control because its nonvolatile Instant-On flash configuration brings control logic live within microseconds of power application - no boot delay from an external configuration device, which matters for safety interlocks and motor-drive sequencing. The 3M-gate fabric and 516,096 memory bits integrate multi-axis state machines, communication stacks, and buffering on one chip, while 147 user I/Os in the 208-pin PQFP drive sensors, encoders, and actuators at 3.3V or lower I/O standards. The family datasheet positions ProASIC3E explicitly as a cost-effective ASIC replacement for automation equipment at low-to-medium volumes. Placing the device behind a clean 1.5V core rail with local decoupling keeps switching-noise coupling into I/O banks low; the trade-off versus an SRAM FPGA is fewer hardened peripherals, so timing-critical functions must use the 231 MHz fabric budget.
Recommended
Networking and Communications Equipment
Line-card glue logic, protocol bridging, and backplane interfacing suit the A3PE3000-PQG208X3: the family datasheet names networking/communications as a core ProASIC3E market. The 231 MHz maximum system frequency supports pipelined packet-processing datapaths, and 516,096 memory bits provide FIFO buffering for rate adaptation between interfaces. Flash-based single-chip configuration eliminates the external boot PROM - an availability and security benefit in always-on network hardware that must resume forwarding instantly after power interruption. With 147 I/Os across I/O banks on the 208-pin PQFP, designers can mix 3.3V, 2.5V, and 1.8V standards for legacy PHY and modern ASIC interfaces; the constraint versus fine-pitch BGA family members (FG324/FGG484) is total signal count, so plan bus widths before locking the pinout in Libero.
Recommended
Avionics and Aerospace Systems
ProASIC3E flash FPGAs are used in avionics because on-chip flash configuration is inherently more robust than SRAM configuration in radiated environments and removes the external bitstream bus from the attack and upset surface; the family datasheet explicitly lists avionics as a target market. The A3PE3000-PQG208X3's Instant-On behavior suits systems that must be operational during power-transient profiles typical of aircraft electrical systems, and the single-chip solution reduces parts count and associated qualification burden. The 3M gates implement sensor-interface glue logic, ARINC-style bus bridging, and voter/monitor structures around a processor. For flight programs, order industrial-grade suffixes with traceability, verify qualification documentation with Microchip, and budget the 1.5V core rail with fault-tolerant regulation; the 208-pin PQFP's gull-wing leads also simplify inspection for high-reliability solder processes.
Recommended
ASIC Prototyping and Low-Volume ASIC Replacement
Microchip positions ProASIC3E as a cost-effective ASIC replacement, and the A3PE3000-PQG208X3 serves this role directly: at ASIC-level unit cost with no mask charges, 3M gates absorb gate-array-scale logic that would otherwise justify a full ASIC only at high volume. Nonvolatile flash means the prototype or production board is a single-chip solution - no configuration PROM, no bitstream load time - matching the power-up behavior of the ASIC it replaces. The 130 nm fabric accommodates control-dominated designs, bus interfaces, and moderate datapaths within the 231 MHz envelope and 516,096 memory bits. Migration path is a strength: the same die ships in FG324, FGG484, and FGG896 packages, so a prototype proven on the 208-pin PQFP can move to a higher-I/O package if production requirements grow, preserving design investment in Libero projects and verification collateral.
Recommended
Consumer Electronics
The family datasheet lists consumer markets among ProASIC3E's targets, and the A3PE3000-PQG208X3 fits cost-sensitive consumer platforms needing flexible glue logic with secure, single-chip configuration - display timing controllers, peripheral bridging, and feature-customization fabric that differentiates product SKUs without new silicon. Flash configuration protects design IP because no external bitstream is readable at boot, and Instant-On behavior matches consumer expectations of immediate functionality. The 130 nm process yields the low unit costs that make reprogrammable fabric viable against hard ASICs at mid volumes, and the 208-pin PQFP is inexpensive to assemble on high-volume lines, with the X3 tape-and-reel packing supporting automated pick-and-place. Designers should budget the 1.5V core regulator into the platform power tree and confirm I/O bank voltages against the specific consumer interface standards used on the 147 available pins.
Recommended
Computing Platforms and Embedded Processing
For computing hardware, the A3PE3000-PQG208X3 serves as flexible system interconnect and boot/control logic, with optional soft ARM support enabling embedded processing without a separate microcontroller - a feature the family datasheet highlights. The 516,096 memory bits implement scratch RAM and queue structures for data-flow management between a host processor and peripherals, and the 231 MHz fabric keeps interface bridging off the critical path of the host bus. Single-chip flash configuration simplifies platform bring-up: the FPGA is functional immediately at power-on and can even sequence or gate other rails' logic. On a 208-pin PQFP with 147 I/Os, designers typically map a processor bus plus a handful of peripheral interfaces; heavier computing interconnect should step up to the FGG896 package options. Decouple per I/O bank and keep the 1.5V core on a dedicated low-noise regulator for clean timing margins.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-PQG208X3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1PQG208 | A3PE3000L-PQ208I | A3PE1500-1PQG208 | M1AFS250-PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (PQG208) | 208-PQFP (PQG208) - same | 208-PQFP (PQ208) - same footprint | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 1,500,000 | 250,000 |
| Max System Frequency | 231 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash | 130 nm flash (low-power) | 130 nm flash (low-power) | 130 nm flash | 130 nm flash (Fusion, mixed-signal) |
| Low-Power Variant | No (standard A3PE3000) | Yes (-L process) | Yes (-L process) | No | Low-power Fusion family |
| Configuration | Nonvolatile flash, Instant-On, single-chip | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On | Nonvolatile flash, Instant-On |
| User I/Os (this package) | 147 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Family | ProASIC3E | ProASIC3E (L) | ProASIC3E (L) | ProASIC3E | Fusion |
Key Differentiators
- Full 3M-gate density in the PQG208 footprint (vs A3PE1500-1PQG208)
- Standard process for maximum 231 MHz system performance (vs A3PE3000L-1PQG208)
- Pure digital fabric versus mixed-signal Fusion (vs M1AFS250-PQG208I)
Design Notes
Supply the A3PE3000 core from a dedicated 1.5 V low-noise regulator sized for the fabric's dynamic current at 231 MHz operation; do not share the core rail with high-switching-noise loads. I/O bank rails must match the voltage standards assigned per bank in Libero - mixing standards on one rail causes drive-strength violations. Because flash configuration is nonvolatile and Instant-On, there is no configuration current surge at power-up, simplifying supply sequencing versus SRAM FPGAs; still add bulk capacitance at the board entry and 0.1 uF ceramic decoupling at each supply pin pair.
The 208-pin PQFP has 0.5 mm gull-wing leads - specify a solder-mask-defined or non-SMD pad per IPC-recommended PQFP land patterns and inspect with AOI or X-ray for solder bridging on the dense lead rows. Route high-speed buses on inner layers with a solid ground reference to control impedance, and keep stub lengths short on the outer lead exits. Distribute I/O assignments so wide buses stay within a single I/O bank to avoid crossing bank voltage domains; reassigning pins late in a PQFP design is painful due to the two-row leadframe geometry.
Common pitfalls: (1) assuming the -X3 suffix changes silicon - it is a tape-and-reel packing code only; verify the temperature grade from the base order code. (2) Designing to 3M gates without checking routed utilization - flash FPGA routing overhead means achieving above roughly 70-80% utilization at 231 MHz targets requires early timing closure in Libero. (3) Treating A3PE3000L as identical silicon - the -L low-power process trades some speed for static current, so re-run timing after any L-family substitution even on the same footprint.
Compliance Information
Compliance data was not present in the provided verified web data; verify RoHS/REACH status on the official Microchip product page for the exact order code before export or automotive/avionics use.
