M1AFS250-FGG256 vs M1AFS250-1FG256I Comparison

Detailed side-by-side comparison of M1AFS250-FGG256 by Microchip Technology and M1AFS250-1FG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS250-FGG256 M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS250-FGG256 ✓ Active
Microchip Technology
M1AFS250-1FG256I M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip

M1AFS250-1FG256I ✓ Active

Specification Comparison

Parameter M1AFS250-FGG256 M1AFS250-1FG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $88.00 $96.50
Family Fusion (M1 series, mixed-signal FPGA) —
System Gates 250,000 250000 gates
Logic Cells 6144 —
User I/O 114 —
Embedded Processor ARM Cortex-M1 (M1 variants) ARM Cortex-M1 soft core
Maximum Clock Frequency 350 MHz —
Configuration Memory Flash-based, live at power-up —
Flash Memory Bits 36864 —
Technology CMOS —
Package 256-LBGA (FGG256), 1.0 mm ball pitch 256-LBGA (FBGA)
Mounting Type Surface Mount Surface Mount
RoHS Status RoHS Compliant —
Lead Free Status Lead Free —
Operating Temperature [DATA_NEEDED: operating temperature range] -40C to +85C (industrial, suffix I)
Supply Voltage [DATA_NEEDED: core supply voltage] —
Analog Peripherals Configurable analog (voltage/temperature monitoring) —
Clock Management On-chip clock generation and management circuitry —
Series — Fusion (M1 - with ARM Cortex-M1)
D Flip-Flops (DFF) — 36864
Total I/O — 114
Core Supply Voltage — 1.5 V (1.425 V to 1.575 V)
Configuration Type — Flash-based (live at power-up)
Analog Features — Configurable analog blocks, clock generation and management
On-chip Memory — Flash memory blocks
Speed Grade — -1
Package Dimensions — 17 mm x 17 mm x 1.2 mm height
Supplier Device Package — 256-LBGA
Total RAM — [DATA_NEEDED: Total RAM bits]
Embedded Block RAM (eSRAM) — [DATA_NEEDED: eSRAM size]
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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