M1AFS250-FGG256 - 250K-Gate Fusion Mixed-Signal FPGA | Microchip
MPN: M1AFS250-FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $124.14 | $124.14 |
| 10 | $118 | $1,180.00 |
| 100 | $104.51 | $10,451.00 |
| 500 | $96 | $48,000.00 |
| 1,000 | $88 | $88,000.00 |
Drop-in alternatives for M1AFS250-FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS250-FGG256I
✅ Drop-In✓ In Stock
$49.5 / Unit
View Datasheet →M1AFS250-FGG256Y
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS250-2FGG256I
✅ Drop-In✓ In Stock
$83.12 / Unit
View Datasheet →M1AFS250-2FGG256
✅ Drop-In✓ In Stock
$83.12 / Unit
View Datasheet →M1AFS250-1FGG256Y
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS250-FGG256 Maximum Ratings & Electrical Characteristics
| Family | Fusion (M1 series, mixed-signal FPGA) |
| System Gates | 250,000 |
| Logic Cells | 6144 |
| User I/O | 114 |
| Embedded Processor | ARM Cortex-M1 (M1 variants) |
| Maximum Clock Frequency | 350 MHz |
| Configuration Memory | Flash-based, live at power-up |
| Flash Memory Bits | 36864 |
| Technology | CMOS |
| Package | 256-LBGA (FGG256), 1.0 mm ball pitch |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Lead Free Status | Lead Free |
| Analog Peripherals | Configurable analog (voltage/temperature monitoring) |
| Clock Management | On-chip clock generation and management circuitry |
M1AFS250-FGG256 256-lbga (fgg256), 1.0 mm ball pitch Pin Configuration Guide
Complete pinout information for M1AFS250-FGG256 (256-lbga (fgg256), 1.0 mm ball pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS250-FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS250-FGG256 is suitable for 6 applications: Industrial Automation and Motor Control, Smart Power Management and Supply Supervision, Portable and Battery-Powered Instrumentation, Aerospace and Defense Subsystems, Test and Measurement Equipment, Building Automation and IoT Gateways.
Industrial Automation and Motor Control
The M1AFS250-FGG256 fits industrial automation nodes where programmable logic, system monitoring, and an embedded processor must coexist in one chip. Its 250,000 system gates and 6144 logic cells implement PWM generators, encoders, and state machines, while the ARM Cortex-M1 core handles protocol stacks such as CAN or Modbus. The configurable analog blocks monitor supply rails and motor temperature, replacing discrete supervisory ICs and saving board area on dense drives. Flash-based configuration makes the controller live at power-up with no external boot device, important for equipment that must respond within milliseconds of energization. The 114 user I/Os at 1.0 mm BGA pitch provide sufficient channels for sensor and actuator interfaces; designers should budget I/O bank voltages early since mixed-voltage assignments constrain routing.
Recommended
Smart Power Management and Supply Supervision
Fusion's headline differentiator is integrated analog, making the M1AFS250-FGG256 well suited to smart power-management and power-supply supervision boards. The on-die configurable analog conditioning and monitoring circuitry tracks multiple voltage channels and on-chip temperature with programmable thresholds, closing control loops or flagging faults through the fabric without an external ADC or supervisor. The 36864-bit flash blocks store event logs and calibration data, while the Cortex-M1 executes housekeeping firmware. Because configuration is flash-based, monitoring begins essentially at power-up, eliminating the blind window of SRAM FPGAs that require configuration loading. The 256-ball BGA consolidates what would otherwise be an MCU, supervisor, ADC, and EEPROM cluster, reducing BOM count and improving mean time between failures in long-lived infrastructure power systems.
Recommended
Portable and Battery-Powered Instrumentation
Handheld instruments benefit from the M1AFS250-FGG256's single-chip integration: logic glue, measurement sequencing, display interface, and firmware-controlled power gating all reside on one 1.0 mm-pitch BGA, minimizing board area and quiescent overhead compared with an MCU-plus-FPGA-plus-supervisor stack. The ARM Cortex-M1 sleeps while the fabric handles deterministic capture tasks, and the analog monitors watch battery voltage and die temperature with programmable alarms. Flash-based instant-on behavior lets the instrument be ready the instant the user presses power, an important usability trait. With 114 user I/Os there is room for keypads, LCD interfaces, and sensor front-ends. Designers should pay attention to the BGA's thermal path through the PCB, since portable enclosures limit airflow; adequate copper pour keeps junction temperature within the CMOS process envelope.
Recommended
Aerospace and Defense Subsystems
Microsemi (now Microchip) FPGAs have a long heritage in aerospace programs, and the flash-based, single-chip M1AFS250 suits satellite payloads, avionics glue logic, and ground-support equipment where configuration-storage integrity matters. Flash cells retain configuration through radiation-induced SEU events affecting only registers, simplifying scrubbing architectures compared with SRAM FPGAs that lose their bitstream entirely. The integrated analog monitoring replaces external housekeeping circuitry, and the Cortex-M1 implements lightweight telemetry firmware. The 256-ball BGA's 1.0 mm pitch eases inspection for high-reliability assembly. Actel/Microchip also supplies space-grade relatives in the RTAX series available on XAIPART for radiation-critical missions. Verify program-specific screening flows (temperature grade, lot traceability) with the manufacturer, since commercial FGG256 parts differ in qualification level from dedicated aerospace orderable types.
Recommended
Test and Measurement Equipment
Benchtop and modular instruments use the M1AFS250-FGG256 as a timing, interface, and housekeeping controller. The fabric's deterministic routing implements trigger engines, counters, and bus bridges, while the ARM Cortex-M1 manages SCPI command parsing and calibration routines. The 350 MHz maximum clock capability supports fast timing measurements, and on-chip clock generation and management circuitry simplifies distribution of a single reference to multiple clock domains, reducing jitter sources. Analog monitors watch internal rails and temperature, feeding self-test routines that lab instruments require. Flash configuration means the instrument is operational before an operator completes connection setup. With 114 I/Os, the device bridges front-panel peripherals, acquisition front-ends, and backplane interfaces in one monolithic CMOS die, cutting component count and improving long-term firmware maintainability.
Recommended
Building Automation and IoT Gateways
Smart-building controllers and compact IoT gateways leverage the M1AFS250-FGG256 to merge connectivity bridging, sensor aggregation, and system health monitoring on one chip. The Cortex-M1 runs lightweight network firmware while the fabric implements custom peripherals such as multi-UART clusters, PWM dimming channels, and bit-banged proprietary sensor interfaces that fixed-function MCUs cannot match. Configurable analog inputs supervise the 24V field bus and enclosure temperature, raising alerts before failures propagate. The 36864-bit flash stores device configuration and fault logs locally, and flash-based boot means the controller resumes operation instantly after outages, which matters for always-on HVAC and lighting systems. Its single-chip 256-ball BGA footprint (about 17 mm square class) fits compact DIN-rail and ceiling-module form factors where multiple ICs would not.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS250-FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS250-FGG256I | M1AFS250-FGG256Y | M1AFS250-2FGG256I | M1AFS250-1FGG256Y |
|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256), 1.0 mm pitch | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 6144 | 6144 | 6144 | 6144 | 6144 |
| User I/O | 114 | 114 | 114 | 114 | 114 |
| Speed Grade | Standard | Standard | Standard | -2 (faster) | -1 (slower) |
| Embedded Processor | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 |
| Configuration Type | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up | Flash-based, live at power-up |
| Price (Qty 1, as of 2026-09-02) | ~$54.29-$124.14 (distributor range) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Integrated ARM Cortex-M1 hard processor (vs A3P600-1FG256I)
- Integrated analog monitoring replaces discrete supervisory ICs (vs M1AFS250-FGG256I (digital spec-identical))
- Flash-based, live-at-power-up configuration (vs SRAM FPGAs (e.g., Artix/Cyclone class))
Design Notes
The FGG256 is a 256-ball BGA with 1.0 mm ball pitch. Typical routing for this pitch class uses 4-6 signal layers with via-in-pad or dogbone fanout; verify your fabricator's minimum BGA pitch capability before layout. Provide a solid ground plane under the package and a dense via array connecting ground balls to the plane for both power integrity and thermal dissipation, since a BGA has no exposed heatsink pad - the PCB is the primary heat path.
The Fusion family uses multiple supply rails (core, I/O banks, analog). Estimate power with Microchip/Microsemi Libero SoC power tools after place-and-route, before finalizing regulators. Because configuration is flash-based and live at power-up, ensure rail sequencing reaches the appropriate levels before fabric operation; consult the Fusion family datasheet power-up section for allowed ramp rates and sequencing constraints rather than assuming SRAM-FPGA behavior.
Assign I/O standards and bank voltages in Libero SoC early: the 114 user I/Os are grouped into banks whose supply defines compatible standards, and mixed 3.3V/2.5V/1.8V assignments must not span banks incorrectly. Keep analog monitoring input traces short, guarded, and away from switching signals, since the on-die analog block accuracy depends on clean external routing. Series terminate fast single-ended outputs when trace lengths exceed roughly 1/6 of the signal rise-time electrical length.
Do not confuse FGG256 with FG256 package orderables: both are 256-ball parts but with different pitch/naming (Findchips lists M1AFS250-FG256I and M1AFS250-FGG256I as distinct parts), and the footprints are not interchangeable. Also confirm speed-grade selection in your Libero SoC project matches the ordered MPN suffix; a timing-closed design on a -2 part may fail timing on a -1 part.
Compliance Information
RoHS Compliant and Lead Free per DigChip datasheet specification record. REACH, halogen-free, and conflict-minerals status not stated in provided data - request certificates from Microchip.
