M7AFS600-1FG256I vs M7AFS600-FG256I Comparison

Detailed side-by-side comparison of M7AFS600-1FG256I by Microchip Technology and M7AFS600-FG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M7AFS600-1FG256I M7AFS600-1FG256I - Fusion Mixed-Signal FPGA 600K Gates | Microchip

M7AFS600-1FG256I - Fusion Mixed-Signal FPGA 600K Gates | Microchip

M7AFS600-1FG256I ✓ Active
Microchip Technology
M7AFS600-FG256I M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip

M7AFS600-FG256I ✓ Active

Specification Comparison

Parameter M7AFS600-1FG256I M7AFS600-FG256I
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $308.60 $0.00
Family Fusion Mixed-Signal FPGA —
System Gates 600K 600K
Processor Support ARM CoreMP7 —
Number of I/O 119 119 I/O
Total Memory Bits 110592 —
Maximum System Performance 350 MHz —
Process Technology 130 nm, 7-layer metal flash-based CMOS 130 nm
Program Memory Type Flash (nonvolatile) —
Core Voltage 1.5 V —
Live at Power-Up (LAPU) Yes —
Package 256-LBGA —
Mounting Type Surface Mount —
Operating Temperature -40C to +85C —
Temperature Grade I (Industrial) —
Speed Grade 1 —
Configuration Retention Retains program when powered off —
RoHS Status [DATA_NEEDED: RoHS status] —
Series — M7AFS600 (Fusion)
Logic Capacity (DigiKey listing) — 110592
Embedded Processor — ARM CoreMP7
Core Supply Voltage — 1.5 V
Package / Case — 256-LBGA (FBGA)
Terminal Form — Ball
Package Shape — Square
Mounting Style — SMD/SMT
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +85 C
Packaging — Tray
Programmable Logic Type — Flash-based, non-volatile
Analog Integration — Mixed-signal (configurable analog + flash memory)

Datasheets & Resources

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