M7AFS600-1FG256I - Fusion Mixed-Signal FPGA 600K Gates | Microchip
MPN: M7AFS600-1FG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $398.2 | $398.20 |
| 10 | $378.29 | $3,782.90 |
| 100 | $348.2 | $34,820.00 |
| 500 | $328.5 | $164,250.00 |
| 1,000 | $308.6 | $308,600.00 |
M7AFS600-1FG256I Overview
A mixed-signal FPGA is a programmable logic device that combines flash-based digital fabric with configurable analog peripherals, large flash memory blocks, and clock generation circuitry on a single monolithic die. Unlike SRAM FPGAs, flash-based FPGAs are nonvolatile, retaining their configuration when powered off, which places them in the power management and single-chip embedded control hierarchy alongside MCUs and SoCs.
Key differentiating features include live at power-up (LAPU) operation for instant-on behavior, up to 350 MHz system performance, integrated configurable analog blocks (ADC, voltage/temperature monitors), and secure nonvolatile flash programming that eliminates the external boot configuration device required by SRAM FPGAs.
Technically, the device integrates a 7-layer-metal flash fabric, embedded flash memory blocks, comprehensive clock conditioning circuitry (CCCs with PLLs), and analog peripherals such as a progressive-resolution ADC, making it a genuine single-chip solution for mixed-signal board-level integration. The ARM CoreMP7 soft/hard processor option enables embedded control within the programmable fabric.
Typical applications include industrial control and automation, power supply and energy monitoring, medical instrumentation, and test equipment, where combining analog measurement with programmable digital logic reduces BOM count and board area.
Design consideration: verify power sequencing and analog reference layout early - the mixed-signal nature demands clean analog ground partitioning unlike pure digital FPGAs.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for M7AFS600-1FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with M7AFS600-1FG256I (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Family, System Gates.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M7AFS600-1FG256
✅ Drop-In✓ In Stock
$251 / Unit
View Datasheet →M7AFS600-1FGG256
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$92 / Unit
View Datasheet →M7AFS600-FG256
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$198.75 / Unit
View Datasheet →M7AFS600-FGG256
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$232.4 / Unit
View Datasheet →M7AFS600-FG256I
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Contact for price
View Datasheet →A3P600-1FG256I
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$41.8 / Unit
View Datasheet →M7AFS600-1FG256I Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 600K |
| Processor Support | ARM CoreMP7 |
| Number of I/O | 119 |
| Total Memory Bits | 110592 |
| Maximum System Performance | 350 MHz |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS |
| Program Memory Type | Flash (nonvolatile) |
| Core Voltage | 1.5 V |
| Live at Power-Up (LAPU) | Yes |
| Package | 256-LBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C |
| Temperature Grade | I (Industrial) |
| Speed Grade | 1 |
| Configuration Retention | Retains program when powered off |
M7AFS600-1FG256I 256-lbga Pin Configuration Guide
Pin configuration for M7AFS600-1FG256I (256-lbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-1FG256I.
Refer to the datasheet for full pin configuration.
Typical Applications
M7AFS600-1FG256I is suitable for 6 applications: Industrial Control and Automation, Power Supply and Energy Monitoring, Medical Instrumentation, Test and Measurement Equipment, Secure Embedded Systems, Aerospace and Defense Subsystems.
Industrial Control and Automation
The M7AFS600-1FG256I fits industrial control nodes because its industrial -40C to +85C rating, 119 user I/O, and live-at-power-up (LAPU) flash configuration let controllers begin polling sensors the instant factory power is applied, with no external boot flash delay. The 600K-gate fabric at up to 350 MHz handles PWM generation, quadrature decoding, and safety interlock logic, while the ARM CoreMP7 runs supervisory and communication tasks on the same die. Integration of configurable analog measurement on-chip removes a discrete ADC from the BOM. Performance consideration: at grade-1 speed, verify worst-case timing closure for high-speed motion loops, and partition analog-sensitive routing away from switching I/O banks to protect on-chip measurement accuracy.
Recommended
Power Supply and Energy Monitoring
Power-management and energy-monitoring hardware benefits directly from Fusion's integrated configurable analog blocks: voltage, current, and temperature channels are digitized by the on-chip progressive-resolution ADC and processed by the 600K-gate fabric without an external data-acquisition front end. The nonvolatile flash fabric keeps calibration data and the measurement engine resident through power cycles, and LAPU operation ensures the monitor is alive before the host processor boots - critical for brown-out and sequencing supervision. The 1.5 V core keeps device dissipation modest in always-on metering products. Design consideration: give the analog balls clean reference grounding and filter the ADC input network, because switching digital I/O on adjacent banks can degrade measurement resolution in dense 256-ball layouts.
Recommended
Medical Instrumentation
Portable and benchtop medical instruments use the M7AFS600-1FG256I where mixed-signal acquisition and deterministic logic coexist: the on-chip analog blockset samples physiological front-end signals while the 350 MHz fabric applies digital filtering and protocol formatting, and the ARM CoreMP7 manages the user interface stack. Nonvolatile flash configuration supports fast instrument startup and simplifies regulatory configuration-management audits because the bitstream resides on-chip and cannot be altered by a corrupted boot device. The 119 user I/O interconnect display, sensors, and communication interfaces. Performance consideration: the industrial temperature grade exceeds typical medical ambient requirements, adding margin, while the 256-LBGA thermal footprint suits fanless enclosures demanded by patient-contact equipment.
Recommended
Test and Measurement Equipment
Bench instruments and embedded test modules exploit the M7AFS600-1FG256I's 110592 memory bits and 600K gates to implement pattern generators, logic analyzers, and timing measurement engines, while the on-chip ADC digitizes supply and temperature telemetry for self-test reporting. LAPU flash configuration means the instrument's trigger state machine is functional within microseconds of power-on - a measurable benefit for rack systems that must be ready when triggered. The ARM CoreMP7 offloads SCPI command parsing from the fabric. Design consideration: grade-1 speed timing should be closed at worst-case corner for high-resolution timestamping paths, and the 1.5 V core rail requires clean point-of-load regulation to keep clock jitter within measurement-error budgets.
Recommended
Secure Embedded Systems
Because the M7AFS600-1FG256I stores its configuration in on-chip flash rather than an external SRAM-config bitstream, it is a natural fit for secure embedded systems where IP protection matters: there is no external configuration device to intercept during boot, and the fabric is live at power-up, closing the window in which SRAM FPGAs load unencrypted data. The ARM CoreMP7 executes application firmware alongside hardware-security logic in the 600K-gate fabric, and 119 I/O connect secure storage and communication peripherals. The industrial -40C to +85C range covers harsh deployment. Performance consideration: consult the manufacturer's security application notes for flash-lock and programming-interface lockdown procedures before field deployment, as default programming access should be disabled in production units.
Recommended
Aerospace and Defense Subsystems
Flash-based FPGAs are widely used in aerospace and defense ground equipment and subsystems because flash fabric is inherently immune to configuration upset from radiation-induced bit flips that affect SRAM cells, and the M7AFS600-1FG256I retains its program through power transients in mobile and avionics test racks. LAPU operation and single-chip integration (analog telemetry plus 350 MHz logic plus CoreMP7 control) reduce component count and board mass in size-constrained enclosures. The industrial -40C to +85C grade supports unconditioned environments. Performance consideration: for flight programs, escalate to Microchip's dedicated radiation-taxed RTAX family (e.g., RTAX2000S) instead - the commercial Fusion device is appropriate for ground-based and lab instrumentation rather than orbit.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-1FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-1FG256 | M7AFS600-1FGG256 | M7AFS600-FGG256 | A3P600-1FG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| Speed Grade | 1 | 1 | 1 | Standard (slower) | 1 (ProASIC3 fabric) |
| Integrated Analog Blocks | Yes (Fusion mixed-signal) | Yes | Yes | Yes | No (digital-only ProASIC3) |
Key Differentiators
- Integrated configurable analog blocks on-chip (vs A3P600-1FG256I)
- Industrial temperature with speed grade 1 (vs M7AFS600-1FG256)
- Nonvolatile flash fabric with LAPU (vs SRAM FPGAs (cross-brand))
Design Notes
Estimated: the Fusion 600K device operates from a 1.5 V core per the verified data; a complete Fusion design additionally requires I/O bank and analog auxiliary rails, whose exact voltages should be taken from the manufacturer datasheet power-supply table. Budget each I/O bank's current from your V/I table in Libero rather than assuming a flat per-pin figure, and provide dedicated point-of-load regulation with local 100 nF decoupling per bank. Because the flash fabric is static and does not draw configuration current at power-up, inrush is dominated by bulk capacitance charging rather than bitstream loading - a key advantage versus SRAM FPGAs when sizing hot-swap protection.
The 256-LBGA footprint requires controlled fanout: use a 1.0 mm pitch BGA escape pattern with via-in-pad or dog-bone fanout, and reserve at least two inner layers as solid ground planes beneath the die region. Because Fusion integrates analog blocks, partition analog ball routing onto a quiet region of the board, keep the ADC reference network short, and star-connect analog ground to digital ground at a single point under the device. Do not assign analog-capable balls to fast-switching digital signals without reviewing the datasheet's analog section first - recovering analog performance after the board is fabricated usually requires a respin.
Three frequent mistakes with the M7AFS600 family: (1) ordering FG256 when the board must operate below 0C - only the -I industrial suffix guarantees -40C operation; (2) treating speed grade as optional - grade 1 (the '-1' in the MPN) is required if your timing closure was performed at grade 1, and substituting a standard-speed part can break 350 MHz-class paths; (3) omitting JTAG/FlashPro programming access in production layouts - keep the programming header populated or route it to a test point because the flash fabric must be reprogrammable for field updates. Always regenerate the programming file in Libero after any part substitution.
Compliance Information
Compliance status not stated in retrieved distributor data. The FGG package suffix within the Fusion family denotes the lead-free/green option; verify the exact M7AFS600-1FG256I environmental profile on Microchip's official product page before specifying in regulated products.