M7AFS600-2FG484 vs M7AFS600-1FG484I Comparison

Detailed side-by-side comparison of M7AFS600-2FG484 by Microsemi and M7AFS600-1FG484I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M7AFS600-1FG484I M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I - Fusion FPGA 600K Gates, 484 FBGA | Microchip

M7AFS600-1FG484I ✓ Active

Specification Comparison

Parameter M7AFS600-2FG484 M7AFS600-1FG484I
Brand Microsemi Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $276.95 $198.00
Family Fusion (Mixed-Signal FPGA) Fusion (Flash FPGA with optional ARM CoreMP7 support)
System Gates 600K 600000
User I/O 172 172
Core Cells 110592 —
Core Voltage 1.5 V —
Process Technology 130 nm flash-based 130 nm, 7-layer metal, Flash-based CMOS
Speed Grade -2 1
Package 484-ball FBGA (FG484) 484-ball FBGA (FG484), 23 x 23 x 2.44 mm
Embedded Processor ARM CoreMP7 —
Configuration Memory On-chip flash, instant-on Nonvolatile Flash, retains program when powered off
Mounting Type Surface Mount Surface Mount
Operating Temperature (commercial) 0C to +70C (standard grade per -2FG suffix) —
Mixed-Signal Peripherals On-chip voltage/temperature monitoring (ADC) —
Security Flash lock, AES bitstream protection —
Packaging Tray —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
MSL Level [DATA_NEEDED: moisture sensitivity level] —
Programmable Logic Tiles — 110592
Power-Up Feature — Live at Power-Up (LAPU)
Supply Voltage (Core) — 1.5 V
Logic Family — CMOS
Ball Pitch — 1.0 mm
Operating Temperature — Industrial, -40C to +85C
Embedded Processor Support — ARM CoreMP7

Datasheets & Resources

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