MC68EN360VR33L vs MC68EN360VR25L Comparison

Detailed side-by-side comparison of MC68EN360VR33L by NXP Semiconductors and MC68EN360VR25L by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC68EN360VR33L MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP

MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP

MC68EN360VR33L ✗ End of Life
NXP Semiconductors
MC68EN360VR25L MC68EN360VR25L - 25MHz QUICC M683XX MPU | NXP | 357-BGA

MC68EN360VR25L - 25MHz QUICC M683XX MPU | NXP | 357-BGA

MC68EN360VR25L Nrnd

Specification Comparison

Parameter MC68EN360VR33L MC68EN360VR25L
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life NRND
Stock Status In Stock In Stock
Unit Price (USD) $78.95 $71.41
Processor Type M683xx 32-bit CPU32+ —
Core Architecture CPU32+ with QUICC RISC communications engine M68000 (32-bit)
Core Count 1 —
Bus Speed / Operating Frequency 33 MHz —
Data Bus Width 32-bit 32-bit
Address Bus Width 32-bit (4 GB space) —
Supply Voltage 5 V —
Ethernet MAC Integrated 10/100 Ethernet (MII interface) - 'EN' suffix —
Serial Communication Channels (SCC) 4 (per QUICC engine) —
DMA Channels 2 (per QUICC engine) —
Timers 4 general-purpose 16-bit timers —
DRAM Controller Integrated, supports FPM/EDO DRAM —
Interrupt Controller Integrated, programmable priority —
Package 357-Ball PBGA, 25x25 mm, 1.27 mm pitch ('VR') 357-PBGA (25x25 mm)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Operating Temperature -40C to +85C (industrial) —
Instruction Set M68k (CPU32+) binary-compatible —
Packaging Tray —
Lead Free / RoHS Lead Free / RoHS Compliant —
Process Technology 0.57 um CMOS (per Freescale datasheet) —
Manufacturer — NXP Semiconductors
Manufacturer Legacy — Freescale Semiconductor / Motorola
Part Family — MC68300 (QUICC)
Processor Core — CPU32+
Maximum Clock Frequency — 25 MHz
Number of Cores — 1
Communications Processor Module (CPM) — Yes, integrated
On-chip Ethernet — Yes (10 Mbps Ethernet MAC)
On-chip HDLC Channels — Multiple (per CPM)
Temperature Grade — Commercial
RoHS Status — [DATA_NEEDED: RoHS status]
Lead Time (Heisener) — Aug 3 - Aug 8

Datasheets & Resources

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