MC68EN360VR33L vs MC68EN360VR25L Vergleich

Detaillierter Direktvergleich von MC68EN360VR33L von NXP Semiconductors und MC68EN360VR25L von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC68EN360VR33L MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP

MC68EN360VR33L - 33MHz M683xx QUICC CPU32+ MPU, 357-PBGA | NXP

MC68EN360VR33L ✗ Abgekündigt
NXP Semiconductors
MC68EN360VR25L MC68EN360VR25L - 25MHz QUICC M683XX MPU | NXP | 357-BGA

MC68EN360VR25L - 25MHz QUICC M683XX MPU | NXP | 357-BGA

MC68EN360VR25L Nrnd

Spezifikationsvergleich

Parameter MC68EN360VR33L MC68EN360VR25L
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $78,95 $71,41
Processor Type M683xx 32-bit CPU32+ —
Core Architecture CPU32+ with QUICC RISC communications engine M68000 (32-bit)
Core Count 1 —
Bus Speed / Operating Frequency 33 MHz —
Datenbusbreite 32-bit 32-bit
Address Bus Width 32-bit (4 GB space) —
Versorgungsspannung 5 V —
Ethernet MAC Integrated 10/100 Ethernet (MII interface) - 'EN' suffix —
Serial Communication Channels (SCC) 4 (per QUICC engine) —
DMA Channels 2 (per QUICC engine) —
Timers 4 general-purpose 16-bit timers —
DRAM Controller Integrated, supports FPM/EDO DRAM —
Interrupt Controller Integrated, programmable priority —
Gehäuse 357-Ball PBGA, 25x25 mm, 1.27 mm pitch ('VR') 357-PBGA (25x25 mm)
Montageart Surface Mount (BGA) Surface Mount (BGA)
Betriebstemperatur -40C to +85C (industrial) —
Instruction Set M68k (CPU32+) binary-compatible —
Packaging Tray —
Lead Free / RoHS Lead Free / RoHS Compliant —
Process Technology 0.57 um CMOS (per Freescale datasheet) —
Manufacturer — NXP Semiconductors
Manufacturer Legacy — Freescale Semiconductor / Motorola
Part Family — MC68300 (QUICC)
Processor Core — CPU32+
Maximale Taktfrequenz — 25 MHz
Number of Cores — 1
Communications Processor Module (CPM) — Yes, integrated
On-chip Ethernet — Yes (10 Mbps Ethernet MAC)
On-chip HDLC Channels — Multiple (per CPM)
Temperature Grade — Commercial
RoHS-Status — [DATA_NEEDED: RoHS status]
Lead Time (Heisener) — Aug 3 - Aug 8

Datenblätter & Ressourcen

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