MC7448VU1250ND vs MC7448VU1000ND Comparison
Detailed side-by-side comparison of MC7448VU1250ND by NXP Semiconductors and MC7448VU1000ND by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC7448VU1250ND - PowerPC G4 MPU 1.25GHz 1MB L2 | NXP Semiconductors
MC7448VU1250ND ✗ End of LifeNXP Semiconductors
MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA
MC7448VU1000ND ✗ End of LifeSpecification Comparison
| Parameter | MC7448VU1250ND | MC7448VU1000ND |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $128.00 | $92.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Part Family | MPC7448 (PowerPC G4) | — |
| Core | PowerPC G4 32-bit | — |
| Core Architecture | Power Architecture with AltiVec SIMD extension | — |
| Core Frequency | 1.25 GHz | 1.0 GHz |
| L2 Cache | 1 MB on-die (with ECC) | 1 MB unified on-chip |
| External Bus | MPX / 60x (64-bit) | — |
| Core Voltage | 1.1 V | 1.0 V (typical) |
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) flip-chip |
| Operating Temperature | -40C to +105C (industrial, APL8 RV2.2.1) | [DATA_NEEDED: full industrial temperature range] |
| Number of Cores | 1 | — |
| Instruction Set | 32-bit Power Architecture + AltiVec | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA socket or reflow) |
| Lifecycle Status | End of Life (per NXP product page) | — |
| RoHS Status | Compliant | RoHS Compliant |
| Part Series | — | MPC7448 |
| Processor Type | — | MPC74xx PowerPC G4 32-Bit MPU |
| Core Count | — | 1 |
| Data Bus Width | — | 32-bit (64-bit MPX/60x bus) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| SIMD Engine | — | AltiVec 128-bit vector unit |
| Process Technology | — | 90 nm Silicon-on-Insulator (SOI) |
| Bus Interface | — | MPX/60x, up to 200 MHz |
| Lead Free Status | — | Lead Free |
| Packaging | — | Tray |