MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA
MPN: MC7448VU1000ND ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $119 | $11,900.00 |
| 500 | $105.5 | $52,750.00 |
| 1,000 | $92 | $92,000.00 |
MC7448VU1000ND Overview
A microprocessor (MPU) is an integrated circuit that contains the central processing unit of a computer system, including the control unit, arithmetic logic unit, registers, and cache memory. The MC7448VU1000ND sits in the hierarchy as follows: microprocessor -> CPU -> processor IC -> integrated circuit -> semiconductor. It belongs to the embedded PowerPC microprocessor category, succeeding the MPC7447 family while remaining pin-compatible with earlier MPC74xx platforms. Its AltiVec SIMD engine accelerates multimedia, signal-processing, and packet-processing workloads while preserving backward compatibility with legacy PowerPC code.
Key features include a 1.0 GHz core frequency, 1 MB unified L2 cache with on-chip tag SRAM, a 128-bit AltiVec vector unit with 32 vector registers, a 64-bit MPX/60x bus interface supporting multiprocessing, dynamic frequency switching, and support for hardware virtualization primitives. The 1V core voltage and SOI process minimize power consumption (typically under 10W at full load), making it suitable for thermally constrained embedded chassis. The 360-FCCBGA flip-chip package exposes the die directly for thermal dissipation, enabling reliable operation in industrial-temperature environments with proper heatsinking.
The MC7448VU1000ND's 90 nm SOI architecture integrates seven metal layers with copper interconnect and low-k dielectric, allowing higher clock frequencies and lower dynamic power than the previous 130 nm MPC7447 generation. Thermal management requires an active heatsink because the flip-chip BGA package has no top surface for natural convection; thermal resistance values depend on the heatsink solution chosen. Hardware designers should pair this MPU with compatible northbridge chipsets such as the MPC107 or MPX chipsets that interface the MPX bus to PCI, DDR memory, and Ethernet peripherals.
Typical applications include industrial routers, defense and aerospace embedded controllers, medical imaging equipment, single-board computers, and legacy PowerPC computing platforms. The AltiVec engine is especially valuable in voice-over-IP gateways, baseband DSP acceleration, and image-processing pipelines. Designers choose this part for long-life-cycle embedded products where PowerPC code bases must be preserved.
When designing with the MC7448VU1000ND, ensure the PCB layout follows NXP's application note on MPX bus impedance control (typically 50 ohm controlled impedance), place bulk decoupling capacitors adjacent to every power pin pair, and verify the heatsink interface material has sufficient thermal conductivity (greater than 3 W/m-K). Designers should also confirm that the BIOS/firmware supports the MPC7448 CPUID and revision ID for proper power-management initialization.
This page synthesizes distributor availability, drop-in speed-grade alternatives, and practical thermal design notes not collected in the NXP hardware specifications addendum, providing engineers a single decision-ready reference.
Drop-in alternatives for MC7448VU1000ND — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC7448VU1000ND (same form factor and footprint) — differing in L2 Cache, Mounting Type, Package, Process Technology, SIMD Engine.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesMC7448VU1000ND Maximum Ratings & Electrical Characteristics
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 |
| Processor Type | MPC74xx PowerPC G4 32-Bit MPU |
| Core Count | 1 |
| Data Bus Width | 32-bit (64-bit MPX/60x bus) |
| Core Frequency | 1.0 GHz |
| L1 Cache | 32 KB instruction + 32 KB data |
| L2 Cache | 1 MB unified on-chip |
| SIMD Engine | AltiVec 128-bit vector unit |
| Core Voltage | 1.0 V (typical) |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) |
| Bus Interface | MPX/60x, up to 200 MHz |
| Package | 360-FCCBGA (25x25 mm) flip-chip |
| Mounting Type | Surface Mount (BGA socket or reflow) |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Packaging | Tray |
MC7448VU1000ND 360-fccbga (25x25 mm) flip-chip Pin Configuration Guide
Pin configuration for MC7448VU1000ND (360-fccbga (25x25 mm) flip-chip package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC7448VU1000ND.
Refer to the datasheet for full pin configuration.
Typical Applications
MC7448VU1000ND is suitable for 6 applications: Industrial Routers and Networking Equipment, Defense and Aerospace Embedded Controllers, Medical Imaging Equipment, Single-Board Computers (SBC) for Embedded Systems, Voice-over-IP and Multimedia Gateways, Legacy PowerPC Computing Platforms.
Industrial Routers and Networking Equipment
The MC7448VU1000ND's 1.0 GHz PowerPC G4 core and AltiVec SIMD engine accelerate packet processing, encryption, and QoS classification tasks in industrial router designs. With the MPX bus supporting up to 200 MHz transfers, the MPU moves data between PCI-attached network processors and DDR memory at line-rate for gigabit Ethernet forwarding. The 1V core voltage and flip-chip BGA package enable compact router chassis where thermal headroom is limited, while the long-life PowerPC architecture supports the 10+ year deployment windows demanded by telecom customers. Compared to switching ASICs, the AltiVec unit handles deep packet inspection at lower BOM cost for mid-range routers.
Recommended
Defense and Aerospace Embedded Controllers
The MC7448VU1000ND's 32-bit PowerPC architecture has been qualified for defense and aerospace platforms where software certification and long-term availability matter more than raw clock speed. The 360-FCCBGA package withstands vibration and shock when properly socketed or underfilled, while the SOI process provides radiation tolerance for high-altitude and space applications. Designers integrate the MPU with avionics buses (MIL-STD-1553, ARINC 429) through companion bridges, using AltiVec for sensor-fusion DSP workloads. The legacy code base preservation enables cost-effective upgrades from MPC7447 designs already deployed in the field.
Recommended
Medical Imaging Equipment
The MC7448VU1000ND powers medical imaging controllers in ultrasound carts, patient monitors, and portable diagnostic devices where deterministic real-time response and long product life outweigh peak compute. The 1 MB L2 cache accelerates image buffer access while the AltiVec unit processes pixel pipelines for image reconstruction and filtering. The 1V core and SOI process keep thermal output manageable in sealed enclosures, and the BGA package integrates cleanly into miniaturized handheld chassis. Medical designs typically pair the MPU with a dedicated image acquisition FPGA and PCI-attached video encoder for system-level integration.
Recommended
Single-Board Computers (SBC) for Embedded Systems
Single-board computers targeting VME, CompactPCI, and custom embedded form factors use the MC7448VU1000ND as the main compute engine due to its compact 360-FCCBGA footprint and mature toolchain support. Board designers combine the MPU with the MPC107 bridge to expose PCI, Ethernet, serial, and GPIO headers, while on-board DDR memory supports the 1 MB L2 cache with low-latency access. The 90 nm SOI process keeps the bill of materials manageable by eliminating external L2 cache and simplifying power delivery. SBC vendors value the long-term PowerPC software ecosystem including VxWorks, Linux, and INTEGRITY real-time operating systems.
Recommended
Voice-over-IP and Multimedia Gateways
The AltiVec 128-bit SIMD engine accelerates voice-over-IP codec processing, echo cancellation, and conferencing bridges on the MC7448VU1000ND, offloading DSP tasks that would otherwise require a separate audio processor. At 1.0 GHz, the MPU handles dozens of simultaneous G.711/G.729 transcoding channels, while the MPX bus interfaces to TDM framers and Ethernet PHYs. Designers favor the part for enterprise-class media gateways and IP-PBX platforms due to its low power per channel. Compared to software-only DSP implementations on ARM cores, the AltiVec unit delivers 2-4x higher channel density at the same clock frequency.
Recommended
Legacy PowerPC Computing Platforms
The MC7448VU1000ND serves as a drop-in upgrade for legacy PowerPC G3 and G4 systems including older Mac-compatible computing platforms, industrial workstations, and custom PowerPC appliances. The 360-FCCBGA pinout matches the MPC7447 family, enabling direct substitution when a faster CPU is needed without board redesign. Open-source firmware projects maintain PowerPC bootloaders and kernels for the MPC7448 silicon, simplifying integration for hobbyists and embedded integrators. Designers preserve software investment in PowerPC code bases while gaining the lower-power 90 nm SOI process advantages.
Recommended
Recommended Products Summary
Engineering reference data for MC7448VU1000ND — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC7448VU1000LD | MC7448VU1400ND | MC7448VU867ND | MC7448HX1000ND | MPC7448HX1000ND | MC7447AHX1000LB |
|---|---|---|---|---|---|---|---|
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Frequency | 1.0 GHz | 1.0 GHz | 1.4 GHz (+40%) | 867 MHz (-13.3%) | 1.0 GHz | 1.0 GHz | 1.0 GHz |
| L2 Cache | 1 MB on-chip | 1 MB on-chip | 1 MB on-chip | 1 MB on-chip | 1 MB on-chip | 1 MB on-chip | External L2 via MPC107 |
| Process Technology | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 90 nm SOI | 130 nm |
| AltiVec SIMD Engine | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.1 V |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL | EOL |
Key Differentiators
- Pin-compatible speed-grade upgrade path within same package (vs MC7448VU1400ND)
- Lower-power SOI process versus previous-generation silicon (vs MC7447AHX1000LB)
- Compact drop-in solution for industrial routers (vs MC7448VU867ND)
Design Notes
The MC7448VU1000ND's 360-FCCBGA flip-chip package exposes the silicon die directly for heatsink attachment. Estimated: at 1.0 GHz and typical 8-10 W power dissipation, junction-to-ambient thermal resistance with a passive heatsink is around 1.5 C/W, requiring either active airflow or a large copper heat spreader. Designers should follow the NXP application note on thermal management for flip-chip BGAs and use thermal interface material with conductivity greater than 3 W/m-K between die and heatsink.
Route the MPX/60x processor bus as a 50 ohm controlled-impedance differential pair with matched trace lengths. Place bulk decoupling capacitors (10 uF ceramic plus 0.1 uF high-frequency bypass) within 5 mm of every power pin pair. Follow NXP application note AN2185 for PCB layout guidelines including via stitching around the BGA break-out area and a continuous ground plane beneath the MPU footprint for return path integrity.
Do not confuse the 'ND' (industrial temperature, dry-pack tray) and 'LD' (industrial temperature, different packing) suffixes: both share the same silicon but differ in shipping moisture sensitivity handling. Ensure the firmware bootloader recognizes the MPC7448 CPUID and revision ID before enabling dynamic frequency scaling, otherwise the part may operate at default voltage and waste power. Verify the BIOS supports the part's specific stepping to enable all power-saving modes.
The MPX/60x bus runs up to 200 MHz with source-synchronous clocks; maintain 100 ohm differential impedance for the clock pairs and keep signal trace length matching within 5 mil across the bus. Use series termination resistors at the MPU end of each bus segment to dampen reflections. Designers should perform signal integrity simulation with IBIS models from NXP before committing to PCB layout to avoid cross-talk between adjacent byte lanes.
Compliance Information
RoHS compliant and lead-free per manufacturer product page. AEC-Q100 not applicable for microprocessor ICs in industrial/commercial applications. REACH, halogen-free, and conflict minerals status not explicitly stated in verified web data.
