MC908JL8CPE vs MC908JL3ECPE Comparison
Detailed side-by-side comparison of MC908JL8CPE by NXP Semiconductors and MC908JL3ECPE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC908JL8CPE | MC908JL3ECPE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $4.85 | $3.80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MC908JL8CPE | — |
| Core Architecture | HC08 (M68HC08 family), CISC 8-bit | — |
| Sub-Family | HC08JL | — |
| Maximum Bus Clock | 8 MHz | — |
| Program Memory | 8 KB Flash (8K x 8) | — |
| Data Memory (RAM) | 128 bytes | — |
| Data EEPROM | [DATA_NEEDED: EEPROM size if any] | — |
| On-Chip ADC | 8-bit, up to 8 input channels, successive-approximation | — |
| Timer Modules | 1 x 16-bit timer with PWM capability | — |
| Serial Interface | SCI (Serial Communications Interface) | — |
| I/O Pins | [DATA_NEEDED: number of general-purpose I/O pins] | — |
| Supply Voltage (VDD) | 3.0 V to 5.5 V | — |
| Operating Temperature | -40 C to +85 C (industrial) | — |
| Package | 28-pin PDIP (Plastic Dual In-line Package), through-hole | 28-pin PDIP (Through-Hole) |
| Package Code | DIP-28 | — |
| Mounting Type | Through-Hole (THT) | Through-Hole |
| MSL Level | 1 (unlimited) | Not applicable (through-hole) |
| RoHS Status | Compliant per distributor listings | See manufacturer documentation |
| Core | — | HC08 (M68HC08 Family) |
| Data Bus Width | — | 8 bit |
| Maximum Clock Frequency | — | 8 MHz |
| Program Memory Size | — | 4 KB FLASH |
| RAM Size | — | 128 bytes |
| ADC | — | 8-channel, 10-bit |
| Supply Voltage Range | — | 3 V to 5.5 V |
| Operating Temperature Range | — | -40C to +85C |
| Number of I/O Pins | — | 23 |
| Timers | — | 1 x 16-bit (TPM, 2 channels) |
| Communication Interface | — | Enhanced SCI (ESCI) |
| On-Chip Debug | — | Background Debug Module (BDM) |