MC908JL8CPE vs MC908JL3ECPE Comparação
Comparação detalhada lado a lado de MC908JL8CPE por NXP Semiconductors e MC908JL3ECPE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC908JL8CPE | MC908JL3ECPE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4,85 | $3,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Number | MC908JL8CPE | — |
| Core Architecture | HC08 (M68HC08 family), CISC 8-bit | — |
| Sub-Family | HC08JL | — |
| Maximum Bus Clock | 8 MHz | — |
| Program Memory | 8 KB Flash (8K x 8) | — |
| Data Memory (RAM) | 128 bytes | — |
| Data EEPROM | [DATA_NEEDED: EEPROM size if any] | — |
| On-Chip ADC | 8-bit, up to 8 input channels, successive-approximation | — |
| Timer Modules | 1 x 16-bit timer with PWM capability | — |
| Serial Interface | SCI (Serial Communications Interface) | — |
| I/O Pins | [DATA_NEEDED: number of general-purpose I/O pins] | — |
| Supply Voltage (VDD) | 3.0 V to 5.5 V | — |
| Temperatura de operação | -40 C to +85 C (industrial) | — |
| Encapsulamento | 28-pin PDIP (Plastic Dual In-line Package), through-hole | 28-pin PDIP (Through-Hole) |
| Package Code | DIP-28 | — |
| Tipo de montagem | Through-Hole (THT) | Through-Hole |
| Nível MSL | 1 (unlimited) | Not applicable (through-hole) |
| Status RoHS | Compliant per distributor listings | See manufacturer documentation |
| Core | — | HC08 (M68HC08 Family) |
| Largura do barramento de dados | — | 8 bit |
| Frequência máxima de clock | — | 8 MHz |
| Program Memory Size | — | 4 KB FLASH |
| RAM Size | — | 128 bytes |
| ADC | — | 8-channel, 10-bit |
| Supply Voltage Range | — | 3 V to 5.5 V |
| Faixa de temperatura de operação | — | -40C to +85C |
| Number of I/O Pins | — | 23 |
| Timers | — | 1 x 16-bit (TPM, 2 channels) |
| Communication Interface | — | Enhanced SCI (ESCI) |
| On-Chip Debug | — | Background Debug Module (BDM) |