MC912DT128ACPVE vs MC9S12DG128MPV Comparison

Detailed side-by-side comparison of MC912DT128ACPVE by NXP Semiconductors and MC9S12DG128MPV by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC912DT128ACPVE MC912DT128ACPVE - 16-Bit HC12 MCU 128KB Flash | NXP 112-LQFP

MC912DT128ACPVE - 16-Bit HC12 MCU 128KB Flash | NXP 112-LQFP

MC912DT128ACPVE ✓ Active
NXP Semiconductors
MC9S12DG128MPV MC9S12DG128MPV - 16-bit HCS12 MCU 128KB Flash 112-LQFP | NXP

MC9S12DG128MPV - 16-bit HCS12 MCU 128KB Flash 112-LQFP | NXP

MC9S12DG128MPV Obsolete

Specification Comparison

Parameter MC912DT128ACPVE MC9S12DG128MPV
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $43.76 $0.00
Product Type 16-bit Microcontroller (MCU) —
Core Architecture CPU12 (HC12 / HCS12 CISC) —
Program Memory (Flash) 128 KB (128K x 8) —
RAM Size 8 KB (8K x 8) 8K x 8
EEPROM Size 2 KB 2K x 8
Maximum Clock Frequency 8 MHz —
Supply Voltage 5 V (typical) 2.5V / 5V
Number of I/O Pins 67 —
Package 112-LQFP (20 x 20 mm) —
Mounting Type Surface Mount Surface Mount
CAN Modules 3 x CAN 2.0 A/B (DT128A variant) —
Serial Interfaces 2 x SCI (UART), 1 x SPI, 1 x I2C —
Timers / PWM Enhanced Capture Timer (ECT), 4 PWM channels —
ADC Dual 8/10-bit ADC —
Operating Temperature -40 C to +105 C —
MSL Level 3 (168 hours) —
RoHS Status Compliant —
Debug Interface Background Debug Mode (BDM), single-wire —
Core Processor — HCS12
Core Size — 16-Bit
Architecture — CISC
Speed — 25 MHz
Program Memory Size — 128KB (128K x 8)
Program Memory Type — FLASH
Number of I/O — 91
Connectivity — CANbus, I2C, SCI, SPI
Peripherals — PWM, WDT
ADC Resolution — 10-bit
Package / Case — 112-LQFP (20 x 20 mm)
Part Status — Obsolete
Series — HCS12 (MC9S12D family)

Datasheets & Resources

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