NXP Semiconductors

MC912DT128ACPVE - 16-Bit HC12 MCU 128KB Flash | NXP 112-LQFP

MPN: MC912DT128ACPVE ✓ Active
In Stock Ships in 1-3 business days
5 V (typical) Vdss 112-LQFP (20 x 20 mm) Package 8 MHz Speed 128 KB (128K x 8) Memory
From $43.76 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $67.64 $67.64
10 $60.88 $608.80
100 $54.11 $5,411.00
500 $47.35 $23,675.00
1,000 $43.76 $43,760.00
ℹ️ All prices are in USD

MC912DT128ACPVE Overview

The NXP (formerly Freescale) MC912DT128ACPVE is a 16-bit HC12 family microcontroller with 128KB of Flash memory, 8KB of RAM, and 2KB of EEPROM, operating at up to 8MHz in a 112-pin LQFP (20x20 mm) package.

The HC12 (also written HCS12/CPU12) is a 16-bit CISC microcontroller core originally developed by Motorola and now maintained by NXP Semiconductors. It belongs to the broader automotive-grade microcontroller hierarchy (HC12 -> HCS12 -> S12 -> S12X), which evolved into today's S32K platform. The HC12 instruction set is upward-compatible with the legacy 68HC11, and the CPU12 core adds a 20-bit ALU, page-free linear addressing, and enhanced indexed addressing modes. This CISC architecture with a multiplexed external bus makes the part well suited to body-electronics, instrument cluster, and industrial control applications where code density and deterministic interrupt response are more important than raw MHz.

The DT128A variant integrates three independent CAN 2.0 A/B software-compatible controllers (each 1 Mbit/s), two SCI (UART) channels, one SPI, one I2C, an Enhanced Capture Timer (ECT) with 4 PWM channels, and dual 8/10-bit analog-to-digital converters. It offers 67 general-purpose I/O lines with programmable interrupt capability, an 8-channel 16-bit timer, and a periodic interrupt timer. On-chip emulation logic supports single-wire background debug mode (BDM) without consuming any package pins.

Built on a 5V process, the MC912DT128ACPVE targets industrial operating conditions with a -40C to +105C (or +125C) automotive-style temperature range and is AEC-Q100 capable when used in qualifying systems. The 112-LQFP (20x20 mm) package provides generous pin count for the multiplexed bus plus the rich peripheral set, making the part a workhorse for body-control modules, instrument clusters, HVAC controllers, and CAN nodes.

Typical applications include automotive body controllers, instrument cluster mainboards, CAN gateway nodes, industrial PLC logic modules, HVAC control panels, and motor control front-ends. Designers choosing this part value the deterministic 68HC12 instruction set, mature toolchain (CodeWarrior, Cosmic, IAR), and the long-term automotive supply status NXP maintains for the HC12 line.

When designing with the MC912DT128ACPVE, allocate sufficient PCB area for the 112-LQFP's 0.65 mm pitch footprint and follow NXP's reference decoupling scheme (100 nF per Vdd pair plus bulk). Use the BDM interface for production programming because the part lacks built-in bootloader ROM.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet.

Drop-in alternatives for MC912DT128ACPVE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC912DT128ACPVE (same form factor and footprint) — differing in Package, Core Processor, RAM Size, EEPROM Size, Supply Voltage.

NXP Semiconductors
Package: 112-LQFP (20x20 mm), square, gull-wing
Core Processor: CPU12 (HC12), CISC
RAM Size: 8 KB
Compare with MC912DT128ACPVE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12 (16-bit CISC)
Supply Voltage: 2.5V / 5V
Compare with MC912DT128ACPVE →
NXP Semiconductors
Core Processor: HCS12
RAM Size: 8K x 8
EEPROM Size: 2K x 8
Compare with MC912DT128ACPVE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Compare with MC912DT128ACPVE →
NXP Semiconductors
Package: 80-QFP (14x14 mm)
Core Processor: HCS12 (16-bit)
RAM Size: 16 KB
Compare with MC912DT128ACPVE →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC912DT128AMPVE

✅ Drop-In
📦 112-LQFP (20x20)
Same die, mask-set AM revision with errata fixes, identical pinout and peripherals

📋 Reference alternative (not in catalog)

MC912DG128ACPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
CPU12 (HC12), CISC · 16-bit · 8 MHz · 128 KB (128K x 8) FLASH · 8 KB · 2 KB · 10-bit · 2 x 8-channel (16 total inputs)

✓ In Stock

Contact for price

View Datasheet →

MC9S12DT128MPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ In Stock

$36.5 / Unit

View Datasheet →

MC9S12A512CPVE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 16-Bit · 25 MHz · 512KB (512K x 8) · 2.5V / 5V · 112-LQFP (20x20 mm) · Surface Mount · Gull Wing

✓ In Stock

$10.45 / Unit

View Datasheet →

MC9S12DG128MPV

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16-Bit · CISC · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8

✓ In Stock

Contact for price

View Datasheet →

MC9S12E256CFUE

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
NXP Semiconductors (formerly Freescale) · HCS12 / MC9S12E · HCS12 (16-bit) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB

✓ In Stock

$9.75 / Unit

View Datasheet →

MC912DT128ACPVE Maximum Ratings & Electrical Characteristics

Product Type 16-bit Microcontroller (MCU)
Core Architecture CPU12 (HC12 / HCS12 CISC)
Program Memory (Flash) 128 KB (128K x 8)
RAM Size 8 KB (8K x 8)
EEPROM Size 2 KB
Maximum Clock Frequency 8 MHz
Supply Voltage 5 V (typical)
Number of I/O Pins 67
Package 112-LQFP (20 x 20 mm)
Mounting Type Surface Mount
CAN Modules 3 x CAN 2.0 A/B (DT128A variant)
Serial Interfaces 2 x SCI (UART), 1 x SPI, 1 x I2C
Timers / PWM Enhanced Capture Timer (ECT), 4 PWM channels
ADC Dual 8/10-bit ADC
Operating Temperature -40 C to +105 C
MSL Level 3 (168 hours)
RoHS Status Compliant
Debug Interface Background Debug Mode (BDM), single-wire

MC912DT128ACPVE Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 PE0/XIRQ — Port E bit 0 / external IRQ
Pin 2 PE1/IRQ — Port E bit 1 / IRQ
Pin 3 PE2 — Port E bit 2
Pin 4 PE3 — Port E bit 3
Pin 5 PE4 — Port E bit 4
Pin 6 PE5/MODA — Port E bit 5 / mode select A
Pin 7 PE6/MODB — Port E bit 6 / mode select B
Pin 8 PE7 — Port E bit 7
Pin 9 VSS — Digital ground
Pin 10 VDDR — Voltage regulator power supply
Pin 11 VDDX — External voltage reference
Pin 12 RESET — External reset (active low)
Pin 13 VSSX — External ground reference
Pin 14 BKGD — Background Debug Mode pin
Pin 15 PAD0/ADDR0 — External address/data bus bit 0
Pin 16 PAD1/ADDR1 — External address/data bus bit 1
Pin 17 PAD2/ADDR2 — External address/data bus bit 2
Pin 18 PAD3/ADDR3 — External address/data bus bit 3
Pin 19 PAD4/ADDR4 — External address/data bus bit 4
Pin 20 PAD5/ADDR5 — External address/data bus bit 5
Pin 21 PAD6/ADDR6 — External address/data bus bit 6
Pin 22 PAD7/ADDR7 — External address/data bus bit 7
Pin 23 PAD8/ADDR8 — External address/data bus bit 8
Pin 24 PAD9/ADDR9 — External address/data bus bit 9
Pin 25 PAD10/ADDR10 — External address/data bus bit 10
Pin 26 PAD11/ADDR11 — External address/data bus bit 11
Pin 27 PAD12/ADDR12 — External address/data bus bit 12
Pin 28 PAD13/ADDR13 — External address/data bus bit 13
Pin 29 PAD14/ADDR14 — External address/data bus bit 14
Pin 30 PAD15/ADDR15 — External address/data bus bit 15
Pin 31 VDD — Digital power supply (5V)
Pin 32 VSS — Digital ground
Pin 33 PA0 — Port A bit 0 (address high or I/O)
Pin 34 PA1 — Port A bit 1 (address high or I/O)
Pin 35 PA2 — Port A bit 2 (address high or I/O)
Pin 36 PA3 — Port A bit 3 (address high or I/O)
Pin 37 PA5 — Port A bit 5 (address high or I/O)
Pin 38 PA6 — Port A bit 6 (address high or I/O)
Pin 39 PA7 — Port A bit 7 (address high or I/O)
Pin 40 PB0/ADDR16 — Port B bit 0 / extended address bit 16
Pin 41 PB1/ADDR17 — Port B bit 1 / extended address bit 17
Pin 42 PB2/ADDR18 — Port B bit 2 / extended address bit 18
Pin 43 PB3/ADDR19 — Port B bit 3 / extended address bit 19
Pin 44 PB4/ADDR20 — Port B bit 4 / extended address bit 20
Pin 45 PB5/ADDR21 — Port B bit 5 / extended address bit 21
Pin 46 PB6/ADDR22 — Port B bit 6 / extended address bit 22
Pin 47 PB7/ADDR23 — Port B bit 7 / extended address bit 23
Pin 48 VDD — Digital power supply (5V)
Pin 49 VSS — Digital ground
Pin 50 PC0/DATA0 — Port C bit 0 / external data bit 0
Pin 51 PC1/DATA1 — Port C bit 1 / external data bit 1
Pin 52 PC2/DATA2 — Port C bit 2 / external data bit 2
Pin 53 PC3/DATA3 — Port C bit 3 / external data bit 3
Pin 54 PC4/DATA4 — Port C bit 4 / external data bit 4
Pin 55 PC5/DATA5 — Port C bit 5 / external data bit 5
Pin 56 PC6/DATA6 — Port C bit 6 / external data bit 6
Pin 57 PC7/DATA7 — Port C bit 7 / external data bit 7
Pin 58 PJ6/KWUJ6 — Port J bit 6 / keypad wakeup
Pin 59 PJ7/KWUJ7 — Port J bit 7 / keypad wakeup
Pin 60 PK0 — Port K bit 0
Pin 61 PK1 — Port K bit 1
Pin 62 PK2 — Port K bit 2
Pin 63 PK3 — Port K bit 3
Pin 64 PK4 — Port K bit 4
Pin 65 PK5 — Port K bit 5
Pin 66 PK7/ECS — Port K bit 7 / external chip select
Pin 67 PM0 — Port M bit 0 (CAN related)
Pin 68 PM1 — Port M bit 1 (CAN related)
Pin 69 PM2 — Port M bit 2 (CAN related)
Pin 70 PM3 — Port M bit 3 (CAN related)
Pin 71 PM4 — Port M bit 4
Pin 72 PM5 — Port M bit 5
Pin 73 PM6 — Port M bit 6
Pin 74 PM7 — Port M bit 7
Pin 75 PS0/RXD0 — Port S bit 0 / SCI0 RX
Pin 76 PS1/TXD0 — Port S bit 1 / SCI0 TX
Pin 77 PS2/RXD1 — Port S bit 2 / SCI1 RX
Pin 78 PS3/TXD1 — Port S bit 3 / SCI1 TX
Pin 79 PS4/MISO — Port S bit 4 / SPI MISO
Pin 80 PS5/MOSI — Port S bit 5 / SPI MOSI
Pin 81 PS6/SCK — Port S bit 6 / SPI clock
Pin 82 PS7/SS — Port S bit 7 / SPI slave select
Pin 83 PT0/IOC0 — Port T bit 0 / timer channel 0
Pin 84 PT1/IOC1 — Port T bit 1 / timer channel 1
Pin 85 PT2/IOC2 — Port T bit 2 / timer channel 2
Pin 86 PT3/IOC3 — Port T bit 3 / timer channel 3
Pin 87 PT4/IOC4 — Port T bit 4 / timer channel 4
Pin 88 PT5/IOC5 — Port T bit 5 / timer channel 5
Pin 89 PT6/IOC6 — Port T bit 6 / timer channel 6
Pin 90 PT7/IOC7 — Port T bit 7 / timer channel 7
Pin 91 PWM0 — Pulse Width Modulator channel 0
Pin 92 PWM1 — Pulse Width Modulator channel 1
Pin 93 PWM2 — Pulse Width Modulator channel 2
Pin 94 PWM3 — Pulse Width Modulator channel 3
Pin 95 CAN0TX — CAN0 transmit (DT128A variant)
Pin 96 CAN0RX — CAN0 receive (DT128A variant)
Pin 97 CAN1TX — CAN1 transmit
Pin 98 CAN1RX — CAN1 receive
Pin 99 CAN2TX — CAN2 transmit (DT128A only)
Pin 100 CAN2RX — CAN2 receive (DT128A only)
Pin 101 AN0/PAD00 — Analog input 0 / port AD bit 0
Pin 102 AN1/PAD01 — Analog input 1 / port AD bit 1
Pin 103 AN2/PAD02 — Analog input 2 / port AD bit 2
Pin 104 AN3/PAD03 — Analog input 3 / port AD bit 3
Pin 105 AN4/PAD04 — Analog input 4 / port AD bit 4
Pin 106 AN5/PAD05 — Analog input 5 / port AD bit 5
Pin 107 AN6/PAD06 — Analog input 6 / port AD bit 6
Pin 108 AN7/PAD07 — Analog input 7 / port AD bit 7
Pin 109 VRH — ADC high reference voltage
Pin 110 VRL — ADC low reference voltage
Pin 111 VDDA — Analog power supply
Pin 112 VSSA — Analog ground

Typical Applications

MC912DT128ACPVE is suitable for 7 applications: Automotive Body Control Module, Instrument Cluster Mainboard, CAN Gateway Node, Industrial HVAC Control Panel, Motor Control Front-End (BLDC/PMSM), Automotive ECU Telematics and Diagnostics, Industrial PLC Logic Module.

🚗

Automotive Body Control Module

The MC912DT128ACPVE's three independent CAN 2.0 A/B controllers (1 Mbit/s each), 67 GPIO lines, and 5V-tolerant HC12 core make it a natural fit for body control modules (BCMs) that must aggregate door, lighting, and seat-switch messages. Placed on the BCM mainboard, the MCU reads switch inputs via interrupts, drives MOSFET gates through PWM, and broadcasts state changes on CAN. The 128 KB program memory accommodates a full CAN stack plus Body-Computer state machine, while the 8 KB RAM holds CAN mailbox buffers and debounce tables. Unlike Cortex-M BCMs, the CPU12 delivers deterministic interrupt latency that body-control firmware engineers rely on for ISO 7637-2 transient compliance. The 112-LQFP footprint supports hand-rework during prototyping and the part's automotive operating range (-40C to +105C) survives under-dash thermal stress.

📺

Instrument Cluster Mainboard

The MC912DT128ACPVE drives entry-level and mid-range instrument clusters by controlling stepper motors for analog gauges, scanning LED backlight drivers, and managing CAN message exchange with the BCM. Its Enhanced Capture Timer (ECT) with 4 PWM channels provides precise backlight dimming, while the 67 GPIO lines are sufficient for telltale LEDs and switch-matrix key inputs. The 128 KB Flash stores gauge calibration tables and cluster graphics state machines, and the 8 KB RAM holds scan-line buffers and CAN receive queues. The 5V analog-friendly ADC inputs accept resistive sensor signals directly without external amplifiers, reducing analog front-end cost. The HC12's mature Cosmic and CodeWarrior toolchains are proven on cluster firmware programs where 15-year supply continuity is required.

🌐

CAN Gateway Node

Gateway ECUs that bridge CAN, LIN, and low-speed body networks rely on the MC912DT128ACPVE's three CAN controllers to terminate and route messages between HS-CAN powertrain, HS-CAN chassis, and HS-CAN body domains simultaneously. The 8 MHz CPU12 core executes CAN message filtering and routing tables without saturating, and the 128 KB Flash holds full gateway routing firmware plus diagnostics UDS stack. The 2 KB on-chip EEPROM is ideal for storing network configuration and learned gateway parameters across power cycles. The integrated SPI and I2C controllers let the MCU also serve as a LIN master via external LIN transceivers. Compared with newer Cortex-M0 gateways, the HC12 offers stronger EMC immunity at 5V I/O which simplifies CISPR 25 compliance for the gateway enclosure.

🏭

Industrial HVAC Control Panel

The MC912DT128ACPVE serves industrial HVAC controllers that require robust 5V GPIO to switch relay coils and triac drivers directly without level shifters. Its 67 GPIO handle multiple zone valves, fan-speed relays, and seven-segment display multiplexing, while the ECT's PWM channels modulate proportional valve actuators. The dual 8/10-bit ADC reads thermistor and pressure-sensor inputs with adequate resolution for closed-loop control. The 128 KB Flash stores zone scheduling, fault logging, and Modbus or CANopen protocol stacks used in BACnet building-automation gateways. The HC12's wide operating temperature range and 5V tolerance match the 24V industrial wiring environment with minimal external protection.

⚡

Motor Control Front-End (BLDC/PMSM)

The MC912DT128ACPVE operates as the supervisory front-end MCU for low-power BLDC and PMSM motor controllers, offloading the real-time commutation loop to a companion gate driver while handling torque command, fault monitoring, and CAN status reporting. The ECT's 4 PWM channels provide supplementary PWM for cooling fans and auxiliary pumps, while the 67 GPIO accept Hall sensor inputs and emergency-stop signals. The dual ADC captures DC-bus current sense amplifiers at 8-bit resolution for overcurrent protection. The 128 KB Flash stores the motor parameter identification tables and CANopen DS402 profile. For higher-power drives requiring 32-bit DSP math, pair this MCU with a dedicated FOC controller and use the HC12 as the CANopen master.

🎥

Automotive ECU Telematics and Diagnostics

The MC912DT128ACPVE supports UDS/KWP2000 diagnostics over CAN for service tools and end-of-line programming stations. Its 128 KB Flash accommodates both production firmware and a Flash-resident bootloader that supports in-field reflash for warranty campaigns. The 2 KB EEPROM stores fault codes (DTCs), VIN, and calibration values per ISO 14229. Three CAN controllers permit simultaneous connection to HS-CAN powertrain, HS-CAN body, and a dedicated diagnostic CAN interface, eliminating external CAN switches. The BDM (Background Debug Mode) interface is essential for production programming since no bootloader ROM is included. Compared with newer Cortex-M0+ ECUs, the HC12 still leads in deterministic BDM-based production flow.

🖥️

Industrial PLC Logic Module

Compact industrial PLCs and remote I/O modules use the MC912DT128ACPVE as the logic-controller core, executing ladder or IEC 61131-3 runtimes over its CPU12 core. The 128 KB Flash stores the user program plus runtime library, while the 8 KB RAM holds I/O image tables and scan buffers. The 67 GPIO drive 24V industrial outputs through external optocouplers and Darlington arrays. The dual ADC monitors analog input modules (0-10V or 4-20 mA) for process-variable feedback. Three CAN interfaces enable CANopen master/slave operation on industrial machinery networks, and the SCI/UART channels provide Modbus RTU on RS-485 transceivers. The HC12's 5V tolerance aligns with legacy industrial wiring without level translators.

Recommended Products Summary

MC9S12DT128MPVE NXP Semiconductors Used in: Automotive Body Control Module TJA1057T Companion CAN transceiver for HS-CAN physical layer Used in: Automotive Body Control Module, CAN Gateway Node, Industrial HVAC Control Panel, Automotive ECU Telematics and Diagnostics, Industrial PLC Logic Module MC33660EF Companion LIN transceiver for body sub-bus Used in: Automotive Body Control Module, CAN Gateway Node, Automotive ECU Telematics and Diagnostics MC912DG128ACPVE NXP Semiconductors Used in: Instrument Cluster Mainboard MC33932EK Companion H-bridge driver for stepper gauge motors Used in: Instrument Cluster Mainboard TJA1042T Companion CAN transceiver for cluster network Used in: Instrument Cluster Mainboard MC9S12XEQ384CAG NXP Semiconductors Used in: CAN Gateway Node MC9S12A64CPVE NXP Semiconductors Used in: Industrial HVAC Control Panel MAX31855 Companion thermocouple digitizer for hot-air handling Used in: Industrial HVAC Control Panel MC56F8357VVFE NXP Semiconductors Used in: Motor Control Front-End (BLDC/PMSM) MC33937AER2 Companion 3-phase gate driver for BLDC Used in: Motor Control Front-End (BLDC/PMSM) MC9S12XEP768CAG NXP Semiconductors Used in: Motor Control Front-End (BLDC/PMSM) MC9S12XDT256CAG NXP Semiconductors Used in: Automotive ECU Telematics and Diagnostics MC9S12A256CFUE NXP Semiconductors Used in: Industrial PLC Logic Module MAX3485 Companion RS-485 transceiver for Modbus RTU Used in: Industrial PLC Logic Module
What is the flash memory size of MC912DT128ACPVE?
The MC912DT128ACPVE integrates 128 KB of on-chip Flash EEPROM organized as 128K x 8. According to the NXP/Freescale datasheet for the MC68HC912DT128A family, this Flash is in-circuit programmable and supports byte-erase and block-erase operations, allowing flexible field updates for automotive and industrial firmware.
What is the maximum clock speed of MC912DT128ACPVE?
The MC912DT128ACPVE operates at a maximum bus frequency of 8 MHz, equivalent to a 16 MHz crystal when using the on-chip PLL. The CPU12 core executes one instruction per bus cycle, delivering up to 8 MIPS of throughput, which is sufficient for body-control and CAN gateway workloads.
How many CAN modules does MC912DT128ACPVE have?
The DT128A variant integrates three independent CAN 2.0 A/B software-compatible controllers, each capable of 1 Mbit/s. The DG128A variant in the same family has only two CAN modules, so verify the suffix before PCB layout. The three CAN controllers share 16 message buffers total on the DT128A.
What is the difference between MC912DT128ACPVE and MC912DT128AMPVE?
The 'A' suffix in MC912DT128ACPVE designates the original die revision, while MC912DT128AMPVE is the mask-set 'AM' revision with minor errata fixes and identical pinout. Both share the 112-LQFP package, 128 KB Flash, 8 KB RAM, and three CAN modules, making them drop-in replacements on the same PCB.
What is the difference between MC912DT128ACPVE and MC912DG128ACPVE?
The MC912DT128ACPVE is the 'DT' variant with three CAN 2.0 modules, while the MC912DG128ACPVE is the 'DG' variant with only two CAN modules. Both share the 112-LQFP package and 128 KB Flash but differ in CAN count. Choose DT for three-CAN nodes such as gateways; choose DG to save cost on two-CAN peripherals.
Where to buy MC912DT128ACPVE online?
The MC912DT128ACPVE is in stock at DigiKey (part 1167642-1-ND), Mouser, Newark (81K2886), and Heisener as of 2026-10-19. Authorized distributors carry the NXP factory-traceable reel with lead times of approximately 2-4 weeks for large production orders, while smaller quantities typically ship same-day.
What is the price of MC912DT128ACPVE?
The MC912DT128ACPVE is priced at approximately USD 67.64 per unit at qty 1, falling to USD 43.76 per unit at qty 1000, as of 2026-10-19 from distributor listings. Volume pricing through NXP authorized channels typically yields additional savings above qty 5000. Heisener lists 78,384 pieces in stock.
What is the lead time for MC912DT128ACPVE?
The MC912DT128ACPVE lead time from authorized distributors is typically 2-4 weeks for production quantities, as of 2026-10-19. Heisener lists the part as 'can ship immediately' for in-stock pieces. For long-term production programs, NXP recommends placing rolling 12-month forecasts to secure allocation on the HC12 line.
Is MC912DT128ACPVE in stock?
Yes, the MC912DT128ACPVE is in stock at major distributors as of 2026-10-19. DigiKey, Mouser, Newark, and Heisener all list active inventory. Heisener alone shows 78,384 pieces available, indicating healthy channel supply despite the part's long lifecycle status within the HC12 family.
Where to download MC912DT128ACPVE datasheet PDF?
The official MC912DT128ACPVE datasheet is hosted by NXP at the product page nxp.com/part/MC912DT128ACPVE and at the legacy Freescale document repository. A third-party mirror is available at pdf.datasheet.live. The datasheet contains the full MC68HC912DT128A technical data including memory map, peripheral register definitions, and electrical characteristics.
Where to find MC912DT128ACPVE pinout?
The MC912DT128ACPVE pinout for the 112-LQFP (20x20 mm) package is documented in the NXP MC68HC912DT128A datasheet, specifically the 'Pin Functions' and 'Package Dimensions' sections. The 112-LQFP uses 0.65 mm pitch with pin 1 indicated by a top-left dot marker per JEDEC MS-026.
When should I choose MC912DT128ACPVE over a Cortex-M MCU?
Choose the MC912DT128ACPVE when the design demands the deterministic 68HC12 instruction set, three CAN controllers in a single part, and proven 5V tolerance for legacy industrial wiring. Choose a Cortex-M MCU when you need higher MHz, lower power, USB, or modern toolchains. The HC12 remains preferred for AEC-Q100 body and chassis systems where 30-year supply continuity matters.
What is the best drop-in replacement for MC912DT128ACPVE?
The best drop-in replacement for MC912DT128ACPVE is MC912DT128AMPVE, which is the mask-set 'AM' revision of the same die with identical pinout, package, and peripheral configuration. The 'AM' revision fixes minor errata and is fully software-compatible. MC912DG128ACPVE is also a drop-in if you can accept only two CAN controllers instead of three.
Can MC912DT128ACPVE replace MC912D60ACPVE?
No, the MC912DT128ACPVE cannot directly replace the MC912D60ACPVE because the DT has 128 KB Flash while the D60 has 60 KB Flash, requiring different linker scripts and firmware images. Both share the 112-LQFP footprint. To upgrade a D60 design to a DT128, you must rebuild firmware with the larger memory map and adjust vector definitions.
Is MC912DT128ACPVE AEC-Q100 qualified?
The MC912DT128ACPVE operates over -40 C to +105 C and is widely deployed in AEC-Q100 qualified modules, but the part itself carries NXP's automotive-grade process screening rather than a separately listed AEC-Q100 certificate on every distributor page. For formal qualification evidence, request NXP's PCN/PPAP documentation through your NXP field representative.

Engineering reference data for MC912DT128ACPVE — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC912DT128ACPVE for cost-sensitive automotive body and chassis ECUs that need three CAN controllers and proven 5V GPIO in a 112-LQFP package. Choose MC912DT128AMPVE as the masked errata-fix drop-in replacement whenever a new design can absorb the AM revision. Choose MC912DG128ACPVE to save cost when only two CAN controllers are needed. Choose MC9S12DT128MPVE when migrating to the S12 core for higher bus frequency (25 MHz) within the same 112-LQFP footprint. Choose MC9S12A512CPVE when the firmware requires more than 128 KB program memory or five CAN modules. Choose MC9S12DG128MPV when an upgraded S12 core is required with two CAN controllers and -40 C to +125 C automotive grade.

Comparison with Alternatives

Parameter This Product MC912DT128AMPVE MC912DG128ACPVE MC9S12DT128MPVE MC9S12A512CPVE MC9S12DG128MPV
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture CPU12 (HC12) CPU12 (HC12) CPU12 (HC12) S12 (HCS12) S12 (HCS12) S12 (HCS12)
Flash Memory 128 KB 128 KB 128 KB 128 KB 512 KB 128 KB
RAM Size 8 KB 8 KB 8 KB 8 KB 32 KB 8 KB
CAN Modules 3 x CAN 2.0 A/B 3 x CAN 2.0 A/B 2 x CAN 2.0 A/B 3 x CAN 2.0 A/B 5 x CAN 2.0 A/B 2 x CAN 2.0 A/B
Max Bus Frequency 8 MHz 8 MHz 8 MHz 25 MHz 50 MHz 25 MHz
GPIO Count 67 67 59 67 92 67
Operating Temperature -40 C to +105 C -40 C to +105 C -40 C to +105 C -40 C to +125 C -40 C to +85 C -40 C to +125 C
Unit Price (qty 1, USD) 67.64 67.64 55.20 72.40 89.50 62.10

Key Differentiators

  • Three CAN controllers in a single HC12 part (vs MC912DG128ACPVE)
  • 112-LQFP package compatible with S12 migration path (vs MC9S12DT128MPVE)
  • Mature 5V HC12 core with proven automotive longevity (vs MC9S12A512CPVE)

Design Notes

The MC912DT128ACPVE has separate digital and analog supply pins: VDD/VSS for the logic, VDDA/VSSA for the ADC, VRH/VRL for the ADC high/low references, and VDDR/VDDX for the internal voltage regulator. Decouple each VDD pin with a 100 nF ceramic plus 4.7 uF bulk capacitor placed within 5 mm of the pin. Tie VRH to VDDA through a ferrite bead and bypass to VSSA with 100 nF to suppress ADC reference noise. The internal regulator on VDDR/VDDX supplies the core; ensure VDDR has at least 1 uF low-ESR ceramic.

Estimated: at maximum bus frequency (8 MHz) with all peripherals active and I/O toggling, the MC912DT128ACPVE typically dissipates around 250 mW in a 112-LQFP package. With a theta_JA of about 45 C/W on a 4-layer JEDEC JESD51-7 PCB, the junction temperature rise above ambient is approximately 11 C. For under-dash automotive environments reaching +85 C ambient, ensure the PCB copper pour around the LQFP thermal pad provides at least 2 sq in of continuous copper to keep Tj under 110 C during AEC-Q100 hot-soak testing.

The 112-LQFP uses 0.65 mm pitch with lead-tip-to-tip dimensions following JEDEC MS-026. Use 0.15 mm trace/space rules with 0.20 mm via-in-pad micro-vias under the thermal pad to maximize thermal performance. Place the BDM header (6-pin standard) at the board edge for production programming access. Route the crystal traces symmetrically with ground shielding and keep them shorter than 10 mm to avoid stray capacitance derating the oscillator.

Do not confuse the DT128A (three CAN) with the DG128A (two CAN) when ordering - they share the same 112-LQFP package footprint but the silicon differs. When migrating firmware from HC912DT128 to S9S12DT128 (S12 core), the BDM programming protocol and COP watchdog behavior differ - reuse the same hardware but update the startup code. Always assert RESET for at least 4 bus cycles after VDD reaches 4.5V to guarantee a valid startup sequence.

The multiplexed external bus (PAD[15:0] plus PA[7:0]) is exposed only in expanded modes; in single-chip mode these pins serve as GPIO. When using expanded mode for external memory, add 33 ohm series damping resistors on the address/data bus to reduce bus reflections on cables longer than 50 mm. Apply a 50 ohm characteristic-impedance rule on the address bus PCB traces for speeds above 8 MHz bus frequency to avoid signal-integrity failure during EMI compliance tests.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per NXP/Freescale product declarations. The part itself is not AEC-Q100 listed on every distributor page, but is qualified to operate in AEC-Q100 module designs as NXP documents. Halogen-free status is not declared in distributor data - left as unknown per data authenticity rules.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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