MC9328MXLDVM15-FR vs MC9328MXLVP15 Comparison

Detailed side-by-side comparison of MC9328MXLDVM15-FR by NXP Semiconductors and MC9328MXLVP15 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9328MXLDVM15-FR MC9328MXLDVM15-FR - i.MXL ARM920T 200MHz Microprocessor | NXP

MC9328MXLDVM15-FR - i.MXL ARM920T 200MHz Microprocessor | NXP

MC9328MXLDVM15-FR Nrnd
NXP Semiconductors
MC9328MXLVP15 MC9328MXLVP15 - i.MXL ARM920T MPU 150MHz 225-MAPBGA | NXP

MC9328MXLVP15 - i.MXL ARM920T MPU 150MHz 225-MAPBGA | NXP

MC9328MXLVP15 Obsolete

Specification Comparison

Parameter MC9328MXLDVM15-FR MC9328MXLVP15
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $15.05 $7.45
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
MPN MC9328MXLDVM15-FR —
Core Architecture ARM920T (ARM9TDMI core with MMU) —
Core Frequency 200 MHz —
Instruction Set Width 32-bit —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
MMU Yes (full ARM MMU) —
Package LFBGA-256 (MAP) —
Mounting Type Surface Mount Surface Mount
Operating Temperature Range -40C to +85C (industrial, per -FR suffix / DVM15 speed code family) —
Process Technology 0.18 um CMOS —
Supply Voltage (Core) 1.8 V nominal —
Supply Voltage (I/O) 3.3 V nominal —
On-chip Peripherals LCD controller, USB 1.1 device/host, 10/100 Ethernet MAC, SD/MMC, 3x UART, 2x SPI, 2x I2C, PWM, RTC, PCM/I2S audio —
Memory Bus External SDRAM and NAND flash controllers —
Packing Style Factory Reel (FR suffix) —
RoHS Status [DATA_NEEDED: RoHS compliance status] Compliant
MSL Level [DATA_NEEDED: MSL rating] —
Core — ARM920T (32-bit RISC)
Architecture — RISC
Data Bus Width — 32-bit
Maximum Clock Speed — 150 MHz
Core Type — ARM920T
Instruction Set — ARMv4T (ARM/Thumb)
I-Cache — 16 KB
D-Cache — 16 KB
Operating Supply Voltage — 1.8 V (core) / 3.3 V (I/O)
Package Type — 225-MAPBGA (Plastic, Mold Array Process BGA)
Package Size — 13 x 13 mm
Ball Pitch — 0.80 mm
Pin Count — 225
Integrated LCD Controller — Yes (STN/TFT)
USB Device Controller — Yes (USB 1.1)
MMC/SD Host Controller — Yes

Datasheets & Resources

Browse All Products Create BOM Request Quote