MC9328MXLDVM15-FR vs MC9328MXLVP15 Vergleich

Detaillierter Direktvergleich von MC9328MXLDVM15-FR von NXP Semiconductors und MC9328MXLVP15 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9328MXLDVM15-FR MC9328MXLDVM15-FR - i.MXL ARM920T 200MHz Microprocessor | NXP

MC9328MXLDVM15-FR - i.MXL ARM920T 200MHz Microprocessor | NXP

MC9328MXLDVM15-FR Nrnd
NXP Semiconductors
MC9328MXLVP15 MC9328MXLVP15 - i.MXL ARM920T MPU 150MHz 225-MAPBGA | NXP

MC9328MXLVP15 - i.MXL ARM920T MPU 150MHz 225-MAPBGA | NXP

MC9328MXLVP15 Obsolete

Spezifikationsvergleich

Parameter MC9328MXLDVM15-FR MC9328MXLVP15
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $15,05 $7,45
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
MPN MC9328MXLDVM15-FR —
Core Architecture ARM920T (ARM9TDMI core with MMU) —
Core Frequency 200 MHz —
Instruction Set Width 32-bit —
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
MMU Yes (full ARM MMU) —
Gehäuse LFBGA-256 (MAP) —
Montageart Surface Mount Surface Mount
Betriebstemperaturbereich -40C to +85C (industrial, per -FR suffix / DVM15 speed code family) —
Process Technology 0.18 um CMOS —
Supply Voltage (Core) 1.8 V nominal —
Supply Voltage (I/O) 3.3 V nominal —
On-chip Peripherals LCD controller, USB 1.1 device/host, 10/100 Ethernet MAC, SD/MMC, 3x UART, 2x SPI, 2x I2C, PWM, RTC, PCM/I2S audio —
Memory Bus External SDRAM and NAND flash controllers —
Packing Style Factory Reel (FR suffix) —
RoHS-Status [DATA_NEEDED: RoHS compliance status] Compliant
MSL-Level [DATA_NEEDED: MSL rating] —
Core — ARM920T (32-bit RISC)
Architecture — RISC
Datenbusbreite — 32-bit
Maximum Clock Speed — 150 MHz
Core Type — ARM920T
Instruction Set — ARMv4T (ARM/Thumb)
I-Cache — 16 KB
D-Cache — 16 KB
Betriebsversorgungsspannung — 1.8 V (core) / 3.3 V (I/O)
Package Type — 225-MAPBGA (Plastic, Mold Array Process BGA)
Package Size — 13 x 13 mm
Ball Pitch — 0.80 mm
Pin-Anzahl — 225
Integrated LCD Controller — Yes (STN/TFT)
USB Device Controller — Yes (USB 1.1)
MMC/SD Host Controller — Yes

Datenblätter & Ressourcen

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