MC9RS08KB8CTG vs MC9RS08KB4CWJ Comparison

Detailed side-by-side comparison of MC9RS08KB8CTG by NXP Semiconductors and MC9RS08KB4CWJ by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9RS08KB8CTG MC9RS08KB8CTG - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP

MC9RS08KB8CTG - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP

MC9RS08KB8CTG ✓ Active
NXP Semiconductors
MC9RS08KB4CWJ MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP

MC9RS08KB4CWJ - 8-bit RS08 MCU, 4KB Flash, 20MHz | NXP

MC9RS08KB4CWJ ✗ End of Life

Specification Comparison

Parameter MC9RS08KB8CTG MC9RS08KB4CWJ
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Stock Status In Stock In Stock
Unit Price (USD) $0.93 $1.49
Core RS08 (subset of HC08 with BGND) —
Data Bus Width 8 bit 8-bit
Program Memory Size 8 KB (8K x 8) Flash 4 KB (4K x 8) Flash
Maximum CPU Frequency 20 MHz —
Supply Voltage Range 2.7 V to 5.5 V 2.5 V to 5.5 V
Operating Temperature Range -40C to +85C —
Package 16-TSSOP (0.173", 4.40 mm width) 20-pin SOIC (wide-body, tube)
Mounting Type Surface Mount Surface Mount
On-chip RAM [DATA_NEEDED: RAM size] —
On-chip EEPROM [DATA_NEEDED: EEPROM size] —
Number of I/O Pins [DATA_NEEDED: I/O pin count] —
Interrupt Structure Single global interrupt vector —
Debug Interface RS08 background debug (BGND instruction) Background Debug Mode (BDM)
Peripherals ADC, Timers, Communication interfaces (per datasheet) LVD, POR, PWM, WDT
RoHS Status Compliant (per distributor listings) [DATA_NEEDED: RoHS compliance status]
Core Processor — RS08
Core Size — 8-bit
CPU Speed — 20 MHz
RAM Size — 126 B
EEPROM Size — None (Flash-based)
Number of I/O — 18
Connectivity — I2C, SPI
Instruction Set — HC08 subset + BGND
Operating Temperature — -40C to +85C
MSL Level — [DATA_NEEDED: MSL moisture sensitivity level]

Datasheets & Resources

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