MC9RS08KB8CTG vs MC9RS08KB4CWJ 对比
详细并排对比 MC9RS08KB8CTG 出自 NXP Semiconductors 和 MC9RS08KB4CWJ 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9RS08KB8CTG | MC9RS08KB4CWJ |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.93 | $1.49 |
| Core | RS08 (subset of HC08 with BGND) | — |
| 数据总线宽度 | 8 bit | 8-bit |
| Program Memory Size | 8 KB (8K x 8) Flash | 4 KB (4K x 8) Flash |
| Maximum CPU Frequency | 20 MHz | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.5 V to 5.5 V |
| 工作温度范围 | -40C to +85C | — |
| 封装 | 16-TSSOP (0.173", 4.40 mm width) | 20-pin SOIC (wide-body, tube) |
| 安装类型 | Surface Mount | Surface Mount |
| On-chip RAM | [DATA_NEEDED: RAM size] | — |
| On-chip EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O Pins | [DATA_NEEDED: I/O pin count] | — |
| Interrupt Structure | Single global interrupt vector | — |
| Debug Interface | RS08 background debug (BGND instruction) | Background Debug Mode (BDM) |
| Peripherals | ADC, Timers, Communication interfaces (per datasheet) | LVD, POR, PWM, WDT |
| RoHS 状态 | Compliant (per distributor listings) | [DATA_NEEDED: RoHS compliance status] |
| Core Processor | — | RS08 |
| Core Size | — | 8-bit |
| CPU Speed | — | 20 MHz |
| RAM Size | — | 126 B |
| EEPROM Size | — | None (Flash-based) |
| Number of I/O | — | 18 |
| Connectivity | — | I2C, SPI |
| Instruction Set | — | HC08 subset + BGND |
| 工作温度 | — | -40C to +85C |
| MSL 等级 | — | [DATA_NEEDED: MSL moisture sensitivity level] |