MC9S08AW16CPUE vs MC9S08AW32CPUE Comparison
Detailed side-by-side comparison of MC9S08AW16CPUE by NXP Semiconductors and MC9S08AW32CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08AW16CPUE | MC9S08AW32CPUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.20 | $6.10 |
| Core Processor | S08 (HCS08) | S08 |
| Core Size | 8-Bit | 8-Bit |
| Core Architecture | CISC | — |
| Maximum Clock Frequency | 40 MHz (CPU) / 20 MHz (bus) | — |
| Program Memory Size | 16KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 1K x 8 | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Operating Temperature | -40C to +85C | -40C to +85C |
| ADC Resolution | 10-bit | 10-bit |
| ADC Channels | 16 | — |
| I/O Ports | 38 | — |
| Oscillator Type | Internal | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Package | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Mounting Type | Surface Mount | Surface Mount |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Max Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| I/O Count | — | 38 |
| Packaging | — | Tray |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) |
| Family | — | S08AW (AW60/48/32/16) |