MC9S08AW16CPUE vs MC9S08AW32CPUE Vergleich
Detaillierter Direktvergleich von MC9S08AW16CPUE von NXP Semiconductors und MC9S08AW32CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW16CPUE | MC9S08AW32CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,20 | $6,10 |
| Core Processor | S08 (HCS08) | S08 |
| Core Size | 8-Bit | 8-Bit |
| Core Architecture | CISC | — |
| Maximale Taktfrequenz | 40 MHz (CPU) / 20 MHz (bus) | — |
| Program Memory Size | 16KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 1K x 8 | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Betriebstemperatur | -40C to +85C | -40C to +85C |
| ADC Resolution | 10-bit | 10-bit |
| ADC Channels | 16 | — |
| I/O Ports | 38 | — |
| Oscillator Type | Internal | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Gehäuse | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Montageart | Surface Mount | Surface Mount |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Max Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| I/O Count | — | 38 |
| Packaging | — | Tray |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |
| Family | — | S08AW (AW60/48/32/16) |