MC9S08AW32CFUE vs S9S08AW60E5MFGE Comparison
Detailed side-by-side comparison of MC9S08AW32CFUE by NXP Semiconductors and S9S08AW60E5MFGE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ ActiveSpecification Comparison
| Parameter | MC9S08AW32CFUE | S9S08AW60E5MFGE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.18 | $6.05 |
| Core | S08 (HCS08 enhanced 8-bit) | — |
| Program Memory | 32 KB Flash | — |
| RAM | 2 KB | [DATA_NEEDED: RAM size] |
| Maximum CPU Frequency | 40 MHz | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 10-bit, 8-channel | Multi-channel 10-bit (per family) |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x IIC | — |
| Timers | Multiple TPM/MTIM (see datasheet) | TPM modules with PWM channels |
| GPIO | Up to 54 | — |
| Package | 64-QFP (14x14 mm) | 44-pin LQFP (10 x 10 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (automotive range) |
| MSL Level | 3 | — |
| RoHS Status | Compliant | — |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Lead-Free | Yes | — |
| Core Architecture | — | HCS08 (S08 enhanced), 8-bit CISC |
| CPU Clock (Max) | — | 40 MHz (20 MHz bus) |
| Program Flash | — | 60 KB (60K x 8) |
| EEPROM / Data Flash | — | [DATA_NEEDED: data EEPROM size] |
| Supply Voltage | — | 3 V / 3.3 V / 5 V |
| I/O Pins | — | [DATA_NEEDED: GPIO count] |
| Communication | — | SCI (UART), SPI, I2C |
| Family | — | S08 / MC9S08AW60 series |
| Automotive/Industrial | — | Dual-targeted |
| Lead Free / RoHS | — | Yes (per suffix "E" = Pb-free, "R" = tape & reel) |