MC9S08AW32CFUE vs S9S08AW60E5MFGE 对比
详细并排对比 MC9S08AW32CFUE 出自 NXP Semiconductors 和 S9S08AW60E5MFGE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ 量产中规格对比
| 参数 | MC9S08AW32CFUE | S9S08AW60E5MFGE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7.18 | $6.05 |
| Core | S08 (HCS08 enhanced 8-bit) | — |
| Program Memory | 32 KB Flash | — |
| RAM | 2 KB | [DATA_NEEDED: RAM size] |
| Maximum CPU Frequency | 40 MHz | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 10-bit, 8-channel | Multi-channel 10-bit (per family) |
| Communication Interfaces | 2x SCI (UART), 1x SPI, 1x IIC | — |
| Timers | Multiple TPM/MTIM (see datasheet) | TPM modules with PWM channels |
| GPIO | Up to 54 | — |
| 封装 | 64-QFP (14x14 mm) | 44-pin LQFP (10 x 10 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +85C (industrial) | -40C to +125C (automotive range) |
| MSL 等级 | 3 | — |
| RoHS 状态 | Compliant | — |
| Debug Interface | BDM (Background Debug Mode) | BDM (Background Debug Mode) |
| Lead-Free | Yes | — |
| Core Architecture | — | HCS08 (S08 enhanced), 8-bit CISC |
| CPU Clock (Max) | — | 40 MHz (20 MHz bus) |
| Program Flash | — | 60 KB (60K x 8) |
| EEPROM / Data Flash | — | [DATA_NEEDED: data EEPROM size] |
| 电源电压 | — | 3 V / 3.3 V / 5 V |
| I/O Pins | — | [DATA_NEEDED: GPIO count] |
| Communication | — | SCI (UART), SPI, I2C |
| Family | — | S08 / MC9S08AW60 series |
| Automotive/Industrial | — | Dual-targeted |
| Lead Free / RoHS | — | Yes (per suffix "E" = Pb-free, "R" = tape & reel) |