MC9S08AW48CPUE vs MC9S08AW60CPUE Comparison
Detailed side-by-side comparison of MC9S08AW48CPUE by NXP Semiconductors and MC9S08AW60CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08AW48CPUE | MC9S08AW60CPUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 (HCS08) |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory Type | FLASH | — |
| Program Memory Size | 48 KB (48K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] | 4 KB |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| Package Type | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) | — |
| Package Height | 1 mm | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Instruction Set | HC08 with added BGND instruction | HC08 (CISC) with added BGND instruction |
| Packaging | Tray | — |
| Lifecycle Status | NRND (Not Recommended for New Designs) | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| Speed (CPU Clock) | — | 40 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | — | 10-bit |
| Package | — | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |
| Family | — | HCS08 (S08AW) |