MC9S08AW60CPUE - 8-bit MCU 60KB Flash 40MHz | NXP
MPN: MC9S08AW60CPUE ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MC9S08AW60CPUE Overview
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripheral interfaces on one die, serving as the lowest level of the embedded computing hierarchy (MCU -> embedded processor -> semiconductor). The HCS08 family from NXP (originally Freescale Semiconductor) is a CISC-architecture 8-bit MCU line built around an enhanced S08 core that executes the HC08 instruction set with the added BGND instruction.
Key features of the MC9S08AW60CPUE include 60 KB of on-chip flash program memory with 4 KB of RAM, a single-wire background debug mode (BDM) interface for low-cost in-circuit debugging, a 16-bit timer module, a 10-bit ADC, and serial communication interfaces including SCI and SPI. The device offers 38 general-purpose I/O and multiple power-saving modes, which are essential for battery-operated and energy-sensitive designs.
The enhanced HCS08 core operates from a 2.7 V to 5.5 V single supply, supporting direct connection to automotive and industrial 5 V rails as well as 3.3 V logic systems. The wide supply range eliminates the need for an external regulator in many cost-sensitive applications, reducing bill-of-materials cost. Flash memory is programmed in-system through the background debug interface, supporting field firmware updates.
Typical applications include automotive body electronics, industrial control systems, home appliances, motor control, and cost-sensitive consumer devices. The industrial and automotive qualification breadth of the S08AW family makes it a common choice for dashboard controllers, sensor hubs, and lighting control modules.
When designing with this MCU, plan the clock configuration carefully: the 40 MHz CPU clock is derived from an internal bus running at 20 MHz, so timing budgets and peripheral prescalers must be calculated at bus speed. Reserve the single-wire debug pin routing on the PCB for production programming access.
This page synthesizes distributor pricing data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a complete selection and sourcing resource.
Drop-in alternatives for MC9S08AW60CPUE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08AW60CPUE (same form factor and footprint) — differing in Package, Flash Memory, Core Processor, Lifecycle Status, RAM Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08AW60MPUE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08AW48CPUE
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MC9S08AW60CFUE
✅ Drop-In✓ In Stock
$8.1029 / Unit
View Datasheet →S9S08AW60E5MPUE
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08AW32CPUE
✅ Drop-In✓ In Stock
$6.1 / Unit
View Datasheet →MC9S08AC60CPUE
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →MC9S08AW60CPUE Maximum Ratings & Electrical Characteristics
| Core Processor | S08 (HCS08) |
| Core Size | 8-Bit |
| Speed (CPU Clock) | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Flash Memory | 60 KB (60K x 8) |
| RAM Size | 4 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| I/O Count | 38 |
| Peripherals | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | 10-bit |
| Instruction Set | HC08 (CISC) with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BDM) |
| Package | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Mounting Type | Surface Mount |
| Life Cycle Stage | Active |
| Programmable Memory Type | Flash |
| Family | HCS08 (S08AW) |
MC9S08AW60CPUE 64-lqfp (10 x 10 mm, 0.5 mm pitch, mo-220vkkd-2, 1 mm height) Pin Configuration Guide
Pin configuration for MC9S08AW60CPUE (64-lqfp (10 x 10 mm, 0.5 mm pitch, mo-220vkkd-2, 1 mm height) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC9S08AW60CPUE.
Refer to the datasheet for full pin configuration.
Typical Applications
MC9S08AW60CPUE is suitable for 6 applications: Automotive Body Electronics, Industrial Control Systems, Home Appliances, Motor Control, Consumer Electronics and IoT Sensor Nodes, Test and Measurement Instrumentation.
Automotive Body Electronics
The MC9S08AW60CPUE fits automotive body electronic modules such as door controllers, seat adjusters, and lighting control units. The S08AW family is explicitly supported for the automotive industry per NXP product documentation, and the 5 V-tolerant 2.7 V to 5.5 V supply range interfaces directly with 12 V vehicle electrical systems via simple preconditioning. Its 60 KB flash accommodates protocol stacks (LIN via SCI) and diagnostic routines, while the 10-bit ADC reads switch matrices, potentiometer position sensors, and current-sense outputs. The multiple power-saving modes support ignition-off quiescent-current budgets, a hard requirement in vehicle modules; the 16-bit timer generates PWM for lamp dimming and motor actuation. The 64-LQFP 10 x 10 mm footprint fits standard ECU PCB layouts with 38 GPIOs covering switch, relay, and LED loads in a single controller.
Recommended
Industrial Control Systems
In industrial control panels and process controllers, the MC9S08AW60CPUE serves as a low-cost main controller for sequential logic, sensor polling, and actuator drive. The HCS08 core running at a 20 MHz internal bus speed executes control loops fast enough for thermal, level, and flow regulation where 8-bit resolution of the integrated 10-bit ADC is sufficient. The SCI interface connects to RS-485/RS-232 field buses and the SPI port interfaces external EEPROMs, display drivers, and precision ADCs from the same signal chain. Wide 2.7 V to 5.5 V operation tolerates industrial supply fluctuation, and the single-wire background debug interface enables firmware field updates without removing the MCU from the panel. Its 60 KB flash leaves ample room for scaling logic and logged data routines over the product lifecycle.
Recommended
Home Appliances
The MC9S08AW60CPUE is well suited to appliance control boards for washing machines, refrigerators, cooktops, and small kitchen appliances. Cost-sensitive appliance designs benefit from the single-chip integration of flash, RAM, ADC, timers, and serial interfaces, minimizing bill-of-materials count. The 16-bit timer provides PWM for triac firing, fan speed, and heater duty control, while the 10-bit ADC reads NTC temperature sensors, buttons, and potentiometers. The 60 KB flash capacity stores menu-driven UI logic, multiple language strings, and fault diagnostics. Multiple power-saving modes reduce standby consumption to meet energy-efficiency regulations, and the robust 5 V operation interfaces directly with relay drivers and display multiplexing circuitry common in appliance control PCBs. Production programming through the single-wire debug port simplifies assembly-line flashing.
Recommended
Motor Control
For low- and medium-complexity motor control such as DC fan, pump, and basic BLDC drives, the MC9S08AW60CPUE provides the essential control elements: a 16-bit timer for PWM generation, a 10-bit ADC for current-sense and back-EMF feedback sampling, and a 40 MHz HCS08 core executing commutation and PI control loops at the 20 MHz bus rate. The 38 GPIOs drive gate drivers and read Hall-effect or encoder inputs. Because the MCU operates from 2.7 V to 5.5 V, it connects directly to standard 5 V gate-driver logic. The 60 KB flash supports sensorless commutation tables and protective fault-handling code including overcurrent and stall detection. The 64-LQFP package thermal and pin count suit compact driver boards integrated with the power stage.
Recommended
Consumer Electronics and IoT Sensor Nodes
In cost-sensitive consumer devices and simple connected sensor nodes, the MC9S08AW60CPUE acts as the main system controller managing button interfaces, LED indicators, small displays via SPI, and sensor reading through its 10-bit ADC. The S08AW family's low-cost positioning, described by NXP as serving cost-sensitive applications, makes it competitive for high-volume consumer products where 32-bit processing is unnecessary. Its multiple power-saving modes allow battery-powered products to extend runtime by sleeping between periodic sensor samples, waking via timer interrupt. The 60 KB flash supports feature-rich firmware including serial protocol handling over SCI. The wide supply range supports both primary-cell designs near 3 V and USB or adapter-powered designs at 5 V without changing the power architecture, simplifying product variant management.
Recommended
Test and Measurement Instrumentation
The MC9S08AW60CPUE functions as a control and housekeeping processor in bench instruments, handheld meters, and sensor calibrators. In this role it manages front-panel keypads and displays, sequences measurement ranges via SPI-controlled gain devices, and streams results over SCI to a host PC. The integrated 10-bit ADC handles auxiliary channels such as battery monitoring and temperature compensation, while precision measurement is delegated to external high-resolution ADCs over the SPI bus. The 60 KB flash accommodates calibration tables, communication firmware, and UI logic without external memory. The single-wire background debug interface supports factory calibration fixture programming, and the industrial temperature operation typical of the AW family suits benchtop and portable instrument environments where stability and long product lifecycles matter.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08AW60CPUE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08AW60MPUE | MC9S08AW48CPUE | S9S08AW60E5MPUE | MC9S08AC60CPUE |
|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 60 KB | 60 KB | 48 KB | 60 KB | 60 KB |
| RAM | 4 KB | 4 KB | 2 KB | 4 KB | 4 KB |
| CPU Clock | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Family / Peripheral Set | S08AW (ADC, 16-bit timer, SCI, SPI) | S08AW - identical | S08AW - identical | S08AW automotive - identical | S08AC - similar, verify pinout/peripheral differences |
| Market Targeting | Industrial / general purpose | Industrial / general purpose | Industrial / general purpose, lower memory | Automotive qualification | Industrial / general purpose (AC family) |
Key Differentiators
- Largest flash in the S08AW 64-LQFP group (vs MC9S08AW48CPUE)
- Guaranteed drop-in silicon with identical peripherals (vs MC9S08AC60CPUE)
- Broad supply range reduces BOM cost (vs lower-voltage MCU alternatives)
Design Notes
Design the supply rail within the 2.7 V to 5.5 V operating window and decouple VDD/VDDA with 0.1 uF ceramic capacitors placed within 5 mm of the respective pins, plus bulk capacitance of 4.7 uF to 10 uF near the regulator output. If analog measurements use the on-chip 10-bit ADC, isolate VDDA with an RC filter (for example 10 ohm series resistor and 1 uF capacitor) from the digital rail to reduce ADC noise from core switching. When flashing in-circuit, verify supply current headroom since flash programming draws additional current per the datasheet electrical characteristics.
Route the single-wire background debug (BDM) pin to a 2 or 3-pad programming header on every production PCB; this costs negligible board space and enables in-system programming and debug without socketing the MCU. Keep the 64-LQFP footprint per MO-220VKKD-2 with 0.5 mm pitch trace geometry; use 0.2 mm to 0.25 mm trace width for fanout under dense routing. Ensure unused GPIOs are either grounded, tied to a rail through the internal pull configuration, or driven by firmware to avoid floating-input oscillation and excess current draw.
Remember that all timing calculations must use the 20 MHz internal bus frequency, not the 40 MHz CPU clock - timer periods, baud rates, and ADC sample times are derived from the bus clock. Misconfiguration here is the most common source of incorrect SCI baud rates and PWM frequencies in HCS08 designs. Also confirm the clock source selection (internal oscillator vs external crystal) early, since accuracy of the internal oscillator may be insufficient for precise UART communication; the datasheet specifies oscillator tolerances that should be checked against the worst-case baud rate error budget of about 3 percent.
The 64-LQFP (10 x 10 mm) package dissipates little heat in typical HCS08 applications because an 8-bit MCU at 20 MHz bus draws only tens of milliamperes. Estimated: at 5 V and a worst-case 30 mA active current, power dissipation is approximately 0.15 W, producing a junction temperature rise of only a few degrees C above ambient in still air. No heatsink or thermal via array is required; standard 2-oz copper ground pours are more than sufficient for thermal relief in industrial ambient conditions.
Compliance Information
Compliance status not stated in the provided web data. Note that the S08AW family per NXP supports both Industrial and Automotive industries; the S9S08AW60E5MPUE variant carries the automotive designation. Verify RoHS/REACH status on the official NXP product page before procurement.
