MC9S08AW60CFUE vs MC9S08AW32VFUE Comparison
Detailed side-by-side comparison of MC9S08AW60CFUE by NXP Semiconductors and MC9S08AW32VFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08AW60CFUE | MC9S08AW32VFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.10 | $6.40 |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Frequency | 40 MHz | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | — |
| Core | Enhanced HCS08 8-bit core | HCS08 (S08 CISC) |
| Supply Voltage | 2.7 V to 5.5 V | — |
| Internal Bus Frequency | 20 MHz | — |
| I/O Ports | 38 ports | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Package | 64-QFP, 14 x 14 mm | 64-QFP (14x14 mm) |
| Package Height | 1 mm | — |
| Package Pitch | 0.50 mm | — |
| Mounting Style | Surface mount | — |
| Instruction Cycle | 50 ns minimum at 2.7 V and 20 MHz bus | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode interface | Background Debug Mode (BDM) |
| Application Support | Industrial and automotive | — |
| Lifecycle Status | NRND | — |
| Supplier Reference | NXP USA Inc. | — |
| Data Bus Width | — | 8-bit |
| Maximum Clock Frequency | — | 40 MHz |
| Program Memory Size | — | 32 KB Flash |
| RAM Size | — | 2 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, up to 12 channels |
| Timers | — | TPM1, TPM2 (PWM), RTI, PIT |
| Communication Interfaces | — | 1x SPI, 2x SCI (UART), 1x I2C |
| I/O Pins | — | 54 general-purpose I/O |
| Mounting Type | — | Surface Mount |
| Operating Temperature | — | -40 C to +105 C |
| RoHS Status | — | Compliant |