MC9S08AW60CFUE vs MC9S08AW32VFUE Vergleich
Detaillierter Direktvergleich von MC9S08AW60CFUE von NXP Semiconductors und MC9S08AW32VFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW60CFUE | MC9S08AW32VFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,10 | $6,40 |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Frequency | 40 MHz | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | — |
| Core | Enhanced HCS08 8-bit core | HCS08 (S08 CISC) |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| Internal Bus Frequency | 20 MHz | — |
| I/O Ports | 38 ports | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Gehäuse | 64-QFP, 14 x 14 mm | 64-QFP (14x14 mm) |
| Package Height | 1 mm | — |
| Package Pitch | 0.50 mm | — |
| Montagestil | Surface mount | — |
| Instruction Cycle | 50 ns minimum at 2.7 V and 20 MHz bus | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode interface | Background Debug Mode (BDM) |
| Application Support | Industrial and automotive | — |
| Lebenszyklusstatus | NRND | — |
| Supplier Reference | NXP USA Inc. | — |
| Datenbusbreite | — | 8-bit |
| Maximale Taktfrequenz | — | 40 MHz |
| Program Memory Size | — | 32 KB Flash |
| RAM Size | — | 2 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, up to 12 channels |
| Timers | — | TPM1, TPM2 (PWM), RTI, PIT |
| Communication Interfaces | — | 1x SPI, 2x SCI (UART), 1x I2C |
| I/O Pins | — | 54 general-purpose I/O |
| Montageart | — | Surface Mount |
| Betriebstemperatur | — | -40 C to +105 C |
| RoHS-Status | — | Compliant |