MC9S08DN32AMLC vs MC9S08JM60CLH Comparison

Detailed side-by-side comparison of MC9S08DN32AMLC by NXP Semiconductors and MC9S08JM60CLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DN32AMLC MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC - S08 8-bit MCU, 32KB Flash, 40MHz | NXP

MC9S08DN32AMLC Nrnd
NXP Semiconductors
MC9S08JM60CLH MC9S08JM60CLH - 8-bit USB MCU 60KB Flash 48MHz 64-LQFP | NXP

MC9S08JM60CLH - 8-bit USB MCU 60KB Flash 48MHz 64-LQFP | NXP

MC9S08JM60CLH ✓ Active

Specification Comparison

Parameter MC9S08DN32AMLC MC9S08JM60CLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $3.98 $5.05
Core HCS08 (S08) HCS08 (S08) 8-bit CISC
Instruction Set HC08 with BGND HC08 + BGND
CPU Frequency 40 MHz 48 MHz (24 MHz internal bus)
Bus Frequency 20 MHz —
Program Memory (Flash) 32 KB (32K x 8) —
RAM 1.5 KB (1.5K x 8) 4 KB
EEPROM Embedded —
Number of I/O 25 —
ADC 12-bit, up to 16 channels, 2.5 us conversion [DATA_NEEDED: ADC resolution and channel count]
CAN (MSCAN) CAN 2.0 A/B —
Serial Interfaces SCI (UART), SPI, I2C —
Package 32-LQFP (7x7 mm) 64-LQFP (10x10 mm)
Operating Temperature -40 C to +125 C -40C to +85C
Supply Voltage [DATA_NEEDED: VDD range] 2.7 V to 5.5 V
Mounting Type Surface Mount Surface Mount
Packaging Tray —
RoHS Status Compliant Compliant
Oscillator Type External —
Debug Interface Background Debug Mode (BDM) Background Debug System (BDS) + ICE debug module with 2 comparators and 9 trigger modes
Program Flash — 60 KB
USB — USB 2.0 full-speed device + on-chip transceiver
GPIO (max) — 51
Timers — [DATA_NEEDED: timer module count]
Communication Interfaces — USB 2.0 FS, I2C, SPI, UART (up to 2)
MSL Level — [DATA_NEEDED: MSL rating]
Tray Standard Qty — Tray

Datasheets & Resources

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